JPH0364218A - Microwave module - Google Patents

Microwave module

Info

Publication number
JPH0364218A
JPH0364218A JP1200673A JP20067389A JPH0364218A JP H0364218 A JPH0364218 A JP H0364218A JP 1200673 A JP1200673 A JP 1200673A JP 20067389 A JP20067389 A JP 20067389A JP H0364218 A JPH0364218 A JP H0364218A
Authority
JP
Japan
Prior art keywords
circuit
control
pins
case
signal pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1200673A
Other languages
Japanese (ja)
Inventor
Norio Takeuchi
紀雄 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1200673A priority Critical patent/JPH0364218A/en
Publication of JPH0364218A publication Critical patent/JPH0364218A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards

Abstract

PURPOSE:To reduce the size of a module form by arranging an RF circuit and a control circuit in a case three-dimensionally and forming the power supply/control pins and the RF signal pins in the direction vertical to the circuit surface and in one body with the case. CONSTITUTION:The power supply/control pins 4 and an RF signal pin 5 are formed in one body with a case 1. An RF circuit 2 is set in the case land connected partly with the pins 4 and connected with the pin 5 respectively. A control circuit 3 is set above the circuit 2 and connected with the pins 4. In such constitution, both pins 4 and 5 set vertically to the circuit surface also function to secure the connection between an external interface and a circuit. Thus it is possible to obtain the satisfactory characteristic for supply of the power and signals and also to reduce the size of a module form.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、レーダ装置等に用いるマイクロ波回路及び制
御回路を重装したマイクロ波モジュールに関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a microwave module that is heavily equipped with a microwave circuit and a control circuit for use in a radar device or the like.

〔従来の技術〕[Conventional technology]

第4図は、例えばrAspgcTs OF MODER
N RADARJ 292〜293ページ(Elf B
rook*r著ArtsehHouse出版)に記載さ
れている従来のマイクロ波モジュールの構造断面図であ
る。図にかいて、1はケース、2はRF回路及3は制御
回路、4は電源・制御信号ピンである。また、5はRF
信号ピン、6は回路量接続部であシ、第4図に示すよう
に、RF回路2及び制御回路3は同一平面上に形成され
ていて、各々の電源・制御信号ピン4及びRF信号ピン
5がこれらの面に平行に設けられている。
FIG. 4 shows, for example, rAspgcTs OF MODER
N RADARJ pages 292-293 (Elf B
1 is a structural cross-sectional view of a conventional microwave module described in the book by Rook*r (published by Artseh House). In the figure, 1 is a case, 2 is an RF circuit, 3 is a control circuit, and 4 is a power supply/control signal pin. Also, 5 is RF
The signal pin 6 is a circuit quantity connection part, and as shown in FIG. 5 are provided parallel to these planes.

次に動作について第5図のブロック構成国により説明す
る。ここで、電源制御信号ピン4ののち信号ピン4!l
*41bに電源信号が、信号ピン4sa*43bに制御
信号が加えられると、この制御信号は制御回路3の各端
子Pxa I P tbより入力される。そして、この
制御回路3の内部において作られたRF制御信号は、各
々の端子P21& v P 21)よシ出力されたのち
、これらRF制御信号及び電源信号が回路量接続部6を
介してRF回路2に加えられる。これによp、aF回路
2はマイクロ波信号の切換えや増幅等の動作を行うとと
もに、該RF回路2へのRF傷信号入出力はRF信号ピ
ン5つまシ信号ピン5m、5bを介して行うものとなっ
ている。なシ第5図中、 Ps@ 、 p3bと441
m IP4b及びpsa。
Next, the operation will be explained based on the block constituent countries shown in FIG. Here, after power control signal pin 4, signal pin 4! l
When a power signal is applied to *41b and a control signal is applied to signal pin 4sa*43b, this control signal is input from each terminal Pxa I P tb of control circuit 3. The RF control signals generated inside this control circuit 3 are output from each terminal P21 & vP21), and then these RF control signals and power supply signals are sent to the RF circuit via the circuit connection section 6. Added to 2. As a result, the p, aF circuit 2 performs operations such as switching and amplifying the microwave signal, and the RF flaw signal input/output to the RF circuit 2 is performed via the RF signal pin 5 and the signal pins 5m and 5b. It has become a thing. In Figure 5, Ps@, p3b and 441
m IP4b and psa.

P5bは制御回路2の各々の端子を示している。P5b indicates each terminal of the control circuit 2.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のマイクロ波モジュールは以上のように構成されて
いるため、マイクロ波モジュールの形状が平板構造と−
ab、従って、平面方向の寸法が大きくなったシ、また
電源・制御信号ピン4及びRF信号ピン5のケース側面
に取シ付ける必要があシ、高い取り付は精度が要求され
るとともに配置スペースが少ないという問題があった。
Conventional microwave modules are configured as described above, so the shape of the microwave module is different from that of a flat plate structure.
ab, therefore, the dimensions in the plane direction have become larger, and it is necessary to install the power/control signal pin 4 and RF signal pin 5 on the side of the case, and high-level installation requires precision and requires installation space. There was a problem that there were few.

また、RF回路2に電源及び制御信号を供給するため、
制御回路3とRF回路2を回路量接続部6を設けて接続
する必要があシ、さらに電源、制御信号の配線が長くな
シ、その電圧降下、雑音混入などの問題があった。
In addition, in order to supply power and control signals to the RF circuit 2,
It is necessary to connect the control circuit 3 and the RF circuit 2 by providing a circuit connection section 6, and there are also problems such as long wiring for power supply and control signals, voltage drop, and noise.

本発明は上記のような問題点を解消するためになされた
もので、モジュール形状を小型化できるとともに、電源
・信号供給の良好々特性を得て電圧降下、雑音混入の少
ないマイクロ波モジュールを得ることを目的とする。
The present invention has been made to solve the above-mentioned problems, and it is possible to miniaturize the module shape, obtain good power supply and signal supply characteristics, and obtain a microwave module with less voltage drop and noise contamination. The purpose is to

〔課題を解決するための手段〕[Means to solve the problem]

本発明に係るマイクロ波モジュールは、ケース内にRF
回路及制御回路を立体的に配置して設けるとともに、該
RF回路及び制御回路の面に各々の電源・制御信号ピン
、RF信号ピンを垂直に設け、これら信号ピンを外部と
のインターフェイスと回路間の接続に兼用させるように
したものである。
The microwave module according to the present invention has an RF
In addition to providing circuits and control circuits in a three-dimensional arrangement, each power supply/control signal pin and RF signal pin is provided vertically on the surface of the RF circuit and control circuit, and these signal pins are connected to the external interface and between the circuits. It is designed so that it can also be used for connection.

〔作用〕[Effect]

本発明においては、電源・制御信号ピンは電源・制御信
号の外部とのインターフェイスを行うとともに、RF回
路及制御回路30回路間接続を行う。筐た、ケースと一
体構造の電源・制御信号ピン及びRF信号ピンは、その
RF回路2及び制御回路3の面に対して垂直方向に外部
とのインターフェイスを行うことができる。
In the present invention, the power supply/control signal pin provides an interface for the power supply/control signal with the outside, and also provides connection between the RF circuit and the control circuit 30. The power/control signal pins and RF signal pins integrated with the case can interface with the outside in a direction perpendicular to the surfaces of the RF circuit 2 and control circuit 3.

〔実施例〕〔Example〕

以下、本発明の実施例を図について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明に係るマイクロ波モジュールの一実施例
を示す概略構造の断面図である。第1図にシいて、1は
ケース、2はマイクロ波回路としてのRF回路及3は制
御回路、4は電源・制御信号ピン、5はRF信号ピンで
ある。ここで、電源・制御信号ピン4及びRF信号ピン
5はケース1と一体形成されておシ、そのケース内上部
にRF回路2が配置されている。そしてRF回路2には
、電源・制御信号ピン4の一部及びRF信号ピン5が接
続されている。また、制御回路3#iRF回路2の上部
に配置されてかb1電源・制御信号ピン4に接続されて
いる。
FIG. 1 is a cross-sectional view of a schematic structure of an embodiment of a microwave module according to the present invention. In FIG. 1, 1 is a case, 2 is an RF circuit as a microwave circuit, 3 is a control circuit, 4 is a power supply/control signal pin, and 5 is an RF signal pin. Here, the power/control signal pin 4 and the RF signal pin 5 are integrally formed with the case 1, and the RF circuit 2 is disposed in the upper part of the case. A portion of the power/control signal pin 4 and an RF signal pin 5 are connected to the RF circuit 2 . Further, the control circuit 3 # is arranged above the iRF circuit 2 and connected to the b1 power supply/control signal pin 4.

第2図は第1図の実施例に訃けるマイクロ波モジュール
のブロック構成を示したもので、この図では電源・制御
信号ピン40本数が6本、RF信号ピン5が2本の場合
を示している。ここで、電源・制御信号ピン41@、4
1bは制御回路3の端子Pla t P 1bに接続さ
れ、電源・制御信号ピン42.。
Figure 2 shows the block configuration of a microwave module similar to the embodiment shown in Figure 1. This figure shows a case where the number of power/control signal pins 40 is six and the number of RF signal pins 5 is two. ing. Here, power/control signal pins 41@, 4
1b is connected to the terminal Pla t P 1b of the control circuit 3, and is connected to the power/control signal pin 42. .

42bは制御回路3の端子Pla + P2bとRF回
路2の端子P 31L + P 3bにそれぞれ接続さ
れて>、6、電源・制御信号ピン43i+4mbはRF
回路2の端子P4alP4bに接続されている。また、
RF信号ピン5a、5bはRF回路2の端子Psa l
 Psbに接続されている。々お図中、同一符号は同−
筐たは相当部分を示している。
42b is connected to the terminal Pla + P2b of the control circuit 3 and the terminal P31L + P3b of the RF circuit 2, respectively.
It is connected to terminal P4alP4b of circuit 2. Also,
The RF signal pins 5a and 5b are terminals Psa l of the RF circuit 2.
Connected to Psb. In the figures, the same symbols are the same.
The casing shows a considerable portion.

次に動作について第2図のブロック図を用いて説明する
。ここで、マイクロ波モジュールの外部よシミ源・制御
信号ピン41&t41bを通して制御信号が制御回路3
の端子P1jL+Plbに入力されると、この制御回路
3はRF制御信号を作シ、端子P2jL # P 2b
に出力する。このとき、制御回路3とRF回路2は電源
制御信号ピン42m+42bにょシ接続されておシ、R
F制御信号はRF回路2の端子P31&+P3bに加え
られる。また電源信号は、マイクロ波モジュールの外部
より電源・制御信号ピン4s□4sbを介してRF回路
2の端子P41 r P 4bに加えられている。これ
によ、り、RF回路2では電源信号及びRF制御信号を
用いてマイクロ波信号の切換えや増幅等を行い、このR
F回路2の端子PS□P、、bに入出力されるマイクロ
波信号は、RF信号ピン5m、5bによシ外部とのイン
ターフェイスを行う。
Next, the operation will be explained using the block diagram shown in FIG. Here, the control signal is transmitted from the outside of the microwave module to the control circuit 3 through the stain source/control signal pin 41 & t41b.
When input to terminal P1jL+Plb, this control circuit 3 generates an RF control signal,
Output to. At this time, the control circuit 3 and the RF circuit 2 are connected to the power supply control signal pins 42m+42b.
The F control signal is applied to terminals P31 &+P3b of the RF circuit 2. Further, a power signal is applied from outside the microwave module to the terminal P41 r P 4b of the RF circuit 2 via the power/control signal pin 4s□4sb. As a result, the RF circuit 2 uses the power supply signal and the RF control signal to switch and amplify the microwave signal, and this R
Microwave signals input and output to terminals PS□P, , b of the F circuit 2 are interfaced with the outside via RF signal pins 5m, 5b.

このように本実施例のマイクロ波モジュールによると、
ケース1内にRF回路2と制御回路3を立体的に配置し
て、その回路面に垂直に設けた電源・制御信号ピン4及
びRF信号ピン5を外部とのインターフェイスと回路間
の接続に兼用することによう、電源・信号供給の良好々
特性が得られるとともに、モジュール形状の小型化が図
れる利点を有する。
As described above, according to the microwave module of this embodiment,
The RF circuit 2 and control circuit 3 are arranged three-dimensionally within the case 1, and the power/control signal pin 4 and RF signal pin 5 provided perpendicularly to the circuit surface are used for both the external interface and the connection between the circuits. In particular, it has the advantage of providing good power and signal supply characteristics, as well as being able to reduce the size of the module.

Δか、上記実施例ではRF回路2の上部に制御回路3を
設けたものを示したが、第3図に示すように制御回路3
をRF回路2の下部に設けてもよい。
In the above embodiment, the control circuit 3 is provided above the RF circuit 2, but as shown in FIG.
may be provided at the bottom of the RF circuit 2.

〔発明の効果〕〔Effect of the invention〕

以上のように本発明によれば、ケース内にRF回路と制
御回路を立体的に配置して、それら電源・制御信号ピン
及びRF信号ピンを該回路面に垂直にケースと一体構造
としたので、モジュール形状を小型化できるとともに、
電源・制御信号ピン及びRF信号ピンを同一平面上に精
度良く任意に配置できる。これによ)、外部とのインタ
ーフェイスを容易にすることができ、かつRF回路と制
御回路の接続に必要な回路量接続部を不要にして、電圧
降下、雑音混入の少ないマイクロ波モジュールが得られ
る効果がある。
As described above, according to the present invention, the RF circuit and the control circuit are arranged three-dimensionally within the case, and the power supply/control signal pin and the RF signal pin are integrated with the case perpendicular to the circuit surface. , the module shape can be made smaller, and
Power/control signal pins and RF signal pins can be arbitrarily arranged on the same plane with high precision. As a result, it is possible to easily interface with the outside, eliminate the need for circuit connections required to connect the RF circuit and control circuit, and obtain a microwave module with low voltage drop and noise contamination. effective.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例によるマイクロ波モジュール
を示す概略断面図、第2図はそのブロック構成図、第3
図は本発明の他の実施例を示す第1図相当の概略断面図
、第4図は従来のマイクロ波モジュールの一例を示す概
略断面図、第5図はそのブロック構成図である。 1・・・・ケース、2−・・―RF回路、3・・・・制
御回路、4・・・・電源・制御信号ピン、5・・・・R
F信号ピン
FIG. 1 is a schematic sectional view showing a microwave module according to an embodiment of the present invention, FIG. 2 is a block diagram thereof, and FIG.
The figure is a schematic sectional view corresponding to FIG. 1 showing another embodiment of the present invention, FIG. 4 is a schematic sectional view showing an example of a conventional microwave module, and FIG. 5 is a block diagram thereof. 1...Case, 2...RF circuit, 3...Control circuit, 4...Power/control signal pin, 5...R
F signal pin

Claims (1)

【特許請求の範囲】[Claims]  ケース内にRF回路と制御回路を立体的に配置して設
けるとともに、該RF回路及び制御回路の面に各々の電
源・制御信号ピン,RF信号ピンを垂直に設け、これら
信号ピンを外部とのインターフエイスと回路間の接続に
兼用させるようにしたことを特徴とするマイクロ波モジ
ユール。
The RF circuit and control circuit are arranged three-dimensionally within the case, and the power supply/control signal pins and RF signal pins are provided vertically on the surface of the RF circuit and control circuit, and these signal pins are connected to the outside. A microwave module characterized by being designed to serve as both an interface and a connection between circuits.
JP1200673A 1989-08-02 1989-08-02 Microwave module Pending JPH0364218A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1200673A JPH0364218A (en) 1989-08-02 1989-08-02 Microwave module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1200673A JPH0364218A (en) 1989-08-02 1989-08-02 Microwave module

Publications (1)

Publication Number Publication Date
JPH0364218A true JPH0364218A (en) 1991-03-19

Family

ID=16428338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1200673A Pending JPH0364218A (en) 1989-08-02 1989-08-02 Microwave module

Country Status (1)

Country Link
JP (1) JPH0364218A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995005005A1 (en) * 1993-08-05 1995-02-16 Honeywell Inc. Three dimensional package for monolithic microwave/millimeterwave integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995005005A1 (en) * 1993-08-05 1995-02-16 Honeywell Inc. Three dimensional package for monolithic microwave/millimeterwave integrated circuits

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