JPH036399A - Feeder for plating auxiliary electrode - Google Patents
Feeder for plating auxiliary electrodeInfo
- Publication number
- JPH036399A JPH036399A JP14160889A JP14160889A JPH036399A JP H036399 A JPH036399 A JP H036399A JP 14160889 A JP14160889 A JP 14160889A JP 14160889 A JP14160889 A JP 14160889A JP H036399 A JPH036399 A JP H036399A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- power
- power supply
- feeder
- auxiliary electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 81
- 239000000463 material Substances 0.000 claims abstract description 14
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 9
- 239000010936 titanium Substances 0.000 claims description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 229910052719 titanium Inorganic materials 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 230000002950 deficient Effects 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 229910052697 platinum Inorganic materials 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
（産業上の利用分野）
この発明は、とくに窪み状部分を有する被メッキ部材の
前記窪み状部分のメッキを行うのに用いられるメッキ用
補助極に電源を供給するのに利用されるメッキ用補助極
給電装置に関するものである。
（従来の技術）
被メッキ部材に対するメッキを行うために用いられるメ
ッキ手法としては、電気メッキ、浸漬メッキ、気相メッ
キ等々の各種のものがあるが、これらのうち電気メッキ
は、メッキ液中に被メッキ部材を浸漬すると共に電極に
より通電を行ってメッキを行うようにしている。
このような電気メッキにおいて、被メッキ部材が窪み状
部分を有する場合には、メッキ層の形成が良好に行われ
るように前記窪み状部分にメッキ用補助極を配設して通
電することがある。
第３図はメッキ用補助極を用いる従来のメッキ装置を示
しており、メッキ槽５１の内部にメッキ液５２を入れた
ものが用いられる。そして、陽極用導電性支持体５３に
陽極５４が吊り下げられてメッキ液５２中に陽極５４が
浸漬しであると共に、陰極用導電性支持体５５に陰極５
６が吊り下げられてメッキ液５２中に陰極５６が浸漬し
てあリ、陰極５６には被メッキ部材５７が固定しである
。この被メッキ部材５７には窪み状部分５７ａを有して
いるので、この窪み状部分５７ａにはメッキ用補助（陽
）極５８が配設してあり、このメッキ用補助極５８は導
電性支持体５９および前記陰極５６に固定した絶縁性支
持体６０によって支持してあり、導電性支持体５９は、
電源に接続した給電体６１と当該給電体６１に導電接触
する受電体６２とから構成されるメッキ用補助極給電装
置６３の受電体６２に接続されており、前記メッキ用補
助極給電装置６３を介して電源がメッキ用補助極５８に
供給され、被メッキ部材５７の窪み状部分５７ａの内側
にもメッキが施されるようになっている。
（発明が解決しようとする課題）
しかしながら、上記のような従来のメッキ用補助極給電
装ｆｉ６３にあっては、メッキ用補助極５８に電源を供
給するために導電接触する給電体６１および受電体６２
がメッキ槽５１の外部に配設された構造となっているた
め、給電体６１および受電体６２の導電接触面の汚れや
酸化などによって通電不良が生じ、メッキネ良が発生す
ることがあるという問題があり、この問題の解決がこの
ようなメッキ用補助極給電装置の課題となっていた。
（発明の目的）
この発明は、従来のメッキ用補助極給電装置の上記課題
を解決するためになされたものであって、その目的とす
るところは、給電体および受電体の導電接触面が常に清
浄に保たれ、通電不良が発生することのないメッキ用補
助極給電装置を提供することにある。(Industrial Application Field) This invention particularly relates to a plating auxiliary electrode that is used to supply power to a plating auxiliary electrode that is used to plate a recessed part of a member having a recessed part. This invention relates to a pole power supply device. (Prior art) There are various plating methods used to plate parts to be plated, such as electroplating, immersion plating, and vapor phase plating. Plating is performed by immersing the member to be plated and applying electricity through an electrode. In such electroplating, if the member to be plated has a recessed part, an auxiliary electrode for plating may be provided in the recessed part and energized so that the plating layer can be formed well. . FIG. 3 shows a conventional plating apparatus using an auxiliary electrode for plating, in which a plating bath 51 containing a plating solution 52 is used. The anode 54 is suspended from the anode conductive support 53 and immersed in the plating solution 52, and the cathode 54 is suspended from the cathode conductive support 55.
6 is suspended and a cathode 56 is immersed in a plating solution 52, and a member to be plated 57 is fixed to the cathode 56. Since this member 57 to be plated has a recessed portion 57a, an auxiliary (anode) electrode 58 for plating is disposed in this recessed portion 57a, and this auxiliary electrode for plating 58 is provided with a conductive support. The conductive support 59 is supported by an insulating support 60 fixed to the body 59 and the cathode 56.
It is connected to the power receiving body 62 of a plating auxiliary pole power supply device 63 which is composed of a power supply body 61 connected to a power supply and a power receiving body 62 that is in conductive contact with the power supply body 61, and the plating auxiliary pole power supply device 63 is Power is supplied to the plating auxiliary pole 58 through the plating plate, so that the inside of the recessed portion 57a of the plated member 57 is also plated. (Problem to be Solved by the Invention) However, in the conventional plating auxiliary pole power supply device fi63 as described above, the power supply body 61 and the power receiving body are in conductive contact to supply power to the plating auxiliary pole 58. 62
Since the plating tank is arranged outside the plating bath 51, there is a problem in that conduction failure may occur due to dirt or oxidation on the conductive contact surfaces of the power supply body 61 and the power reception body 62, resulting in poor plating. Therefore, solving this problem has been a challenge for such auxiliary electrode power supply devices for plating. (Object of the invention) This invention was made to solve the above-mentioned problems of the conventional auxiliary electrode power supply device for plating, and its purpose is to always keep the conductive contact surfaces of the power supply body and the power reception body To provide an auxiliary electrode power supply device for plating that is kept clean and does not cause conduction failure.
（課題を解決するための手段）
この発明に係るメッキ用補助極給電装置は、電源に接続
した給電体とメッキ用補助極に接続した受電体とを導電
接触させて、前記電源を前記給電体および受電体を介し
て前記メッキ用補助極に供給するメッキ用補助極給電装
置において、前記給電体および受電体をチタン系材料よ
り形成すると共に前記給電体および受電体のそれぞれの
少なくとも導電接触側に貴金属層を設けて前記給電体お
よび受電体をメッキ液中に浸漬させてなる構成としたも
のであり、このようなメッキ用補助極給電装置の構成を
前述の課題を解決するための手段としたことを特徴とし
ている。
（作用）
この発明に係るメッキ用補助極給電装置の給電体および
受電体は、耐食性に優れたチタン系材料によって形成さ
れていると共に、それらの少なくとも導電接触面側には
白金等の貴金属層が設けである。さらに、これら給電体
および受電体はメッキ液中に浸漬され、メッキ液中で給
・受電が行なわれるようになっている。
したがって、チタン系材料により形成されている給電体
および受電体は、メッキ液中で通電してもほとんど腐食
されず、前記給電体および受電体がメッキ液中に浸漬さ
れ、しかもその導電接触面には貴金属層が設けであるの
で酸化皮膜が形成されずに常に清浄な表面状態を保ち、
良好な通電性を維持して安定な給電が行われるようにな
っている。
（実施例）
以下、実施例に基づいてこの発明をさらに具体的に説明
する。
第１図および第２図は、この発明に係るメッキ用補助極
給電装置の一実施例を説明するもので、第１図に示すメ
ッキ用補助極給電装置１は、この実施例ではチタン系材
料からなる給電台２を介して図示しない陽極電源に接続
されたチタン系材料製の給電体３と、同じくチタン系材
料からなる導電体４および導電性支持体５を介してメッ
キ用補助極６（第２図参照）に接続されたチタン系材料
製の受電体７とから構成されている。また、前記給電体
３および受電体７の導電接触面には、それぞれ白金層（
貴金属層）３ａおよび７ａが形成されている。そして、
当該メッキ用補助極給電装置１は、第２図に示すように
、メッキ槽８の内部に満たされたメッキ液９の中に浸漬
され、メッキ液９中で給・受電が行われるようになつて
いる。
一方、前記メッキ槽８内には、陽極用導電性支持体１０
に陽極１１が吊り下げられて、前記メッキ液９中に浸漬
していると共に、陰極用導電性支持体１２には陰極１３
が吊り下げられて、メッキ液９中に浸漬している。そし
て、前記陰極１３には窪み状部分１４ａを有する被メッ
キ部材１４が固定され、前記窪み状部分１４ａが前述の
メッキ用補助極６に対向するようになっている。当該メ
ッキ用補助極６は、前記導電性支持体５および前記陰極
１３に固定した絶縁性支持体１５によって支持されてい
る。
上記のような構造を有するメッキ用補助極給電装置１は
、その給電体３および受電体７が優れた耐食性を備えた
チタン系材料によって形成されているため、メッキ液９
中で通電してもほとんど腐食されず、しかもその導電接
触面には白金層３ａおよび７ａが形成されているため酸
化皮膜が形成されずに常に清浄な表面状態が得られ、良
好な通電性を保持して前記メッキ用補助極６への安定な
１４ａの内側にも良好なメッキ層を形成させることがで
きるようになる。
なお、この発明において給電体３および受電体７を形成
するチタン系材料としてはとくに限定されず、工業用純
チタンや０．１５〜０．２０Ｐｄ−Ｔｉ 、６ａ文−４
Ｖ−Ｔｉなどのチタン合金をその特性に応じて使用する
ことができる。(Means for Solving the Problems) A plating auxiliary pole power supply device according to the present invention brings a power supply connected to a power supply and a power receiving body connected to a plating auxiliary pole into conductive contact, and connects the power supply to the power supply. and an auxiliary electrode power supply device for plating that supplies power to the auxiliary electrode for plating via a power receiving body, wherein the power feeding body and the power receiving body are formed of a titanium-based material, and at least the conductive contact side of each of the power feeding body and the power receiving body is The power feeding body and the power receiving body are immersed in a plating solution by providing a noble metal layer, and this configuration of the auxiliary electrode power feeding device for plating is used as a means to solve the above-mentioned problems. It is characterized by (Function) The power supply body and the power reception body of the auxiliary electrode power supply device for plating according to the present invention are made of a titanium-based material with excellent corrosion resistance, and a noble metal layer such as platinum is formed on at least the conductive contact surface side of the power supply body and the power reception body. It is a provision. Further, the power supply body and the power reception body are immersed in a plating solution so that power is supplied and received in the plating solution. Therefore, the power supply body and the power reception body formed of titanium-based materials are hardly corroded even when energized in the plating solution, and even when the power supply body and the power reception body are immersed in the plating solution, their conductive contact surfaces Since it has a precious metal layer, no oxide film is formed and the surface is always clean.
Stable power supply is achieved by maintaining good current conductivity. (Examples) Hereinafter, the present invention will be described in more detail based on Examples. 1 and 2 illustrate an embodiment of the auxiliary electrode power supply device for plating according to the present invention.The auxiliary electrode power supply device 1 for plating shown in FIG. 1 is made of titanium-based material in this embodiment. A power supply body 3 made of a titanium-based material is connected to an anode power supply (not shown) via a power supply base 2 consisting of a plating auxiliary electrode 6 ( (see FIG. 2) and a power receiving body 7 made of a titanium-based material. Further, the conductive contact surfaces of the power supply body 3 and the power reception body 7 are each provided with a platinum layer (
Noble metal layers 3a and 7a are formed. and,
As shown in FIG. 2, the plating auxiliary pole power supply device 1 is immersed in a plating solution 9 filled inside a plating tank 8, and power is supplied and received in the plating solution 9. ing. On the other hand, in the plating bath 8, an anode conductive support 10 is provided.
An anode 11 is suspended from and immersed in the plating solution 9, and a cathode 13 is suspended from the cathode conductive support 12.
is suspended and immersed in plating solution 9. A member to be plated 14 having a recessed portion 14a is fixed to the cathode 13, and the recessed portion 14a faces the auxiliary electrode 6 for plating. The plating auxiliary electrode 6 is supported by an insulating support 15 fixed to the conductive support 5 and the cathode 13. The auxiliary electrode power supply device 1 for plating having the above-described structure has its power supply body 3 and power receiving body 7 made of a titanium-based material with excellent corrosion resistance.
Even when electricity is applied inside, there is almost no corrosion, and since the platinum layers 3a and 7a are formed on the conductive contact surfaces, no oxide film is formed and a clean surface is always obtained, ensuring good conductivity. A good plating layer can also be formed on the inside of the stable plating auxiliary electrode 6 by holding it. In this invention, the titanium-based material forming the power supply body 3 and the power reception body 7 is not particularly limited, and may include industrially pure titanium, 0.15 to 0.20Pd-Ti, 6a-4
Titanium alloys such as V-Ti can be used depending on their properties.
以上説明したように、この発明に係るメッキ用補助極給
電装置は、電源に接続した給電体とメッキ用補助極に接
続した受電体とを導電接触させて、前記電源を前記給電
体および受電体を介して前記メッキ用補助極に供給する
メッキ用補助極給電装置において、前記給電体および受
電体をチタン系材料より形成すると共に前記給電体およ
び受電体のそれぞれの少なくとも導電接触側に貴金属層
を設けて前記給電体および受電体をメッキ液中に浸漬さ
せてなる構成としたものであるから、給電体と受電体の
導電接触面に汚れや酸化皮膜等が生ぜず、メッキ用補助
極に安定した給電を行うことができ、もって、良好なメ
ッキ層を形成させることができるという優れた効果を奏
するものである。As explained above, the plating auxiliary pole power supply device according to the present invention brings the power supply connected to the power source into conductive contact with the power receiving body connected to the plating auxiliary pole, and connects the power source to the power supply and the power receiving body. In the plating auxiliary electrode power supply device that supplies power to the plating auxiliary electrode through the plating auxiliary electrode, the power feeding body and the power receiving body are formed of a titanium-based material, and a noble metal layer is provided on at least the conductive contact side of each of the power feeding body and the power receiving body. Since the power supply body and the power receiver are immersed in the plating solution, no dirt or oxide film is formed on the conductive contact surface between the power supply body and the power receiver, and it is stable as an auxiliary electrode for plating. This provides an excellent effect in that it is possible to supply electric power in a controlled manner, thereby forming a good plating layer.
第１図は本発明に係るメッキ用補助極給電装置の一実施
例を示す概略説明図、第２図は第１図のメッキ用補助極
給電装置を用いたメッキ装置の全体を示す概略説明図、
第３図はメッキ用補助極を用いる従来のメッキ装置を示
す概略説明図である。
１・・・メッキ用補助極給電装置、３・・・給電体、３
ａ・・・白金層（貴金属層）、６・・・メッキ用補助極
、７・・・受電体、７ａ・・・白金層（貴金属層）。FIG. 1 is a schematic explanatory diagram showing one embodiment of the auxiliary electrode power supply device for plating according to the present invention, and FIG. 2 is a schematic explanatory diagram showing the entire plating apparatus using the auxiliary pole power supply device for plating shown in FIG. 1. ,
FIG. 3 is a schematic explanatory diagram showing a conventional plating apparatus using an auxiliary electrode for plating. 1... Auxiliary pole power supply device for plating, 3... Power supply body, 3
a... Platinum layer (noble metal layer), 6... Auxiliary electrode for plating, 7... Power receiver, 7a... Platinum layer (noble metal layer).
Claims (1)
た受電体とを導電接触させて、前記電源を前記給電体お
よび受電体を介して前記メッキ用補助極に供給するメッ
キ用補助極給電装置において、前記給電体および受電体
をチタン系材料より形成すると共に前記給電体および受
電体のそれぞれの少なくとも導電接触側に貴金属層を設
けて前記給電体および受電体をメッキ液中に浸漬させて
なることを特徴とするメッキ用補助極給電装置。(1) An auxiliary electrode for plating that brings a power supply connected to a power source into conductive contact with a power receiver connected to the auxiliary electrode for plating, and supplies the power source to the auxiliary electrode for plating via the power source and the power receiver. In the power feeding device, the power feeding body and the power receiving body are formed of a titanium-based material, a noble metal layer is provided on at least the conductive contact side of each of the power feeding body and the power receiving body, and the power feeding body and the power receiving body are immersed in a plating solution. An auxiliary pole power supply device for plating, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14160889A JPH036399A (en) | 1989-06-02 | 1989-06-02 | Feeder for plating auxiliary electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14160889A JPH036399A (en) | 1989-06-02 | 1989-06-02 | Feeder for plating auxiliary electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036399A true JPH036399A (en) | 1991-01-11 |
Family
ID=15295973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14160889A Pending JPH036399A (en) | 1989-06-02 | 1989-06-02 | Feeder for plating auxiliary electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036399A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104099658A (en) * | 2014-08-04 | 2014-10-15 | 葛婕 | Auxiliary anode for use in acid zinc-nickel alloy electroplating |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4718427U (en) * | 1971-04-01 | 1972-11-01 | ||
| JPS5744183B2 (en) * | 1974-11-15 | 1982-09-20 | ||
| JPS5867897A (en) * | 1981-10-16 | 1983-04-22 | Fujitsu Ltd | Electroplating method |
| JPS6029169B2 (en) * | 1984-02-07 | 1985-07-09 | 松下電器産業株式会社 | pressure sensing device |
-
1989
- 1989-06-02 JP JP14160889A patent/JPH036399A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4718427U (en) * | 1971-04-01 | 1972-11-01 | ||
| JPS5744183B2 (en) * | 1974-11-15 | 1982-09-20 | ||
| JPS5867897A (en) * | 1981-10-16 | 1983-04-22 | Fujitsu Ltd | Electroplating method |
| JPS6029169B2 (en) * | 1984-02-07 | 1985-07-09 | 松下電器産業株式会社 | pressure sensing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104099658A (en) * | 2014-08-04 | 2014-10-15 | 葛婕 | Auxiliary anode for use in acid zinc-nickel alloy electroplating |
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