JPH0363997U - - Google Patents
Info
- Publication number
- JPH0363997U JPH0363997U JP12471489U JP12471489U JPH0363997U JP H0363997 U JPH0363997 U JP H0363997U JP 12471489 U JP12471489 U JP 12471489U JP 12471489 U JP12471489 U JP 12471489U JP H0363997 U JPH0363997 U JP H0363997U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- type integrated
- dip type
- adhesive
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12471489U JPH0363997U (cs) | 1989-10-25 | 1989-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12471489U JPH0363997U (cs) | 1989-10-25 | 1989-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363997U true JPH0363997U (cs) | 1991-06-21 |
Family
ID=31672619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12471489U Pending JPH0363997U (cs) | 1989-10-25 | 1989-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363997U (cs) |
-
1989
- 1989-10-25 JP JP12471489U patent/JPH0363997U/ja active Pending