JPH0242499U - - Google Patents
Info
- Publication number
- JPH0242499U JPH0242499U JP12255688U JP12255688U JPH0242499U JP H0242499 U JPH0242499 U JP H0242499U JP 12255688 U JP12255688 U JP 12255688U JP 12255688 U JP12255688 U JP 12255688U JP H0242499 U JPH0242499 U JP H0242499U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- electrode
- substrate
- insulating resin
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12255688U JPH0242499U (cs) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12255688U JPH0242499U (cs) | 1988-09-19 | 1988-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242499U true JPH0242499U (cs) | 1990-03-23 |
Family
ID=31370598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12255688U Pending JPH0242499U (cs) | 1988-09-19 | 1988-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242499U (cs) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273571A (ja) * | 2002-03-18 | 2003-09-26 | Fujitsu Ltd | 素子間干渉電波シールド型高周波モジュール |
| JP2004006973A (ja) * | 2003-08-01 | 2004-01-08 | Kitagawa Ind Co Ltd | 電磁波シールド構造及び電磁波シールド方法 |
| JP4743764B2 (ja) * | 2005-02-02 | 2011-08-10 | セイコーインスツル株式会社 | 半導体パッケージの製造方法 |
| JP2018040816A (ja) * | 2017-12-14 | 2018-03-15 | 株式会社東芝 | センサ |
| WO2023074507A1 (ja) * | 2021-10-25 | 2023-05-04 | 富士フイルム株式会社 | 電子デバイスの製造方法 |
-
1988
- 1988-09-19 JP JP12255688U patent/JPH0242499U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273571A (ja) * | 2002-03-18 | 2003-09-26 | Fujitsu Ltd | 素子間干渉電波シールド型高周波モジュール |
| JP2004006973A (ja) * | 2003-08-01 | 2004-01-08 | Kitagawa Ind Co Ltd | 電磁波シールド構造及び電磁波シールド方法 |
| JP4743764B2 (ja) * | 2005-02-02 | 2011-08-10 | セイコーインスツル株式会社 | 半導体パッケージの製造方法 |
| JP2018040816A (ja) * | 2017-12-14 | 2018-03-15 | 株式会社東芝 | センサ |
| WO2023074507A1 (ja) * | 2021-10-25 | 2023-05-04 | 富士フイルム株式会社 | 電子デバイスの製造方法 |