JPH0363948U - - Google Patents
Info
- Publication number
- JPH0363948U JPH0363948U JP12363589U JP12363589U JPH0363948U JP H0363948 U JPH0363948 U JP H0363948U JP 12363589 U JP12363589 U JP 12363589U JP 12363589 U JP12363589 U JP 12363589U JP H0363948 U JPH0363948 U JP H0363948U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- circuit pattern
- sealing resin
- area
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12363589U JPH0363948U (he) | 1989-10-24 | 1989-10-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12363589U JPH0363948U (he) | 1989-10-24 | 1989-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0363948U true JPH0363948U (he) | 1991-06-21 |
Family
ID=31671601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12363589U Pending JPH0363948U (he) | 1989-10-24 | 1989-10-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0363948U (he) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61258457A (ja) * | 1985-05-13 | 1986-11-15 | Nec Corp | 樹脂封止型半導体装置 |
-
1989
- 1989-10-24 JP JP12363589U patent/JPH0363948U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61258457A (ja) * | 1985-05-13 | 1986-11-15 | Nec Corp | 樹脂封止型半導体装置 |