JPH0363945U - - Google Patents
Info
- Publication number
- JPH0363945U JPH0363945U JP12545589U JP12545589U JPH0363945U JP H0363945 U JPH0363945 U JP H0363945U JP 12545589 U JP12545589 U JP 12545589U JP 12545589 U JP12545589 U JP 12545589U JP H0363945 U JPH0363945 U JP H0363945U
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- package
- recess
- semiconductor element
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12545589U JPH0723965Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12545589U JPH0723965Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0363945U true JPH0363945U (hr) | 1991-06-21 |
| JPH0723965Y2 JPH0723965Y2 (ja) | 1995-05-31 |
Family
ID=31673325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12545589U Expired - Lifetime JPH0723965Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723965Y2 (hr) |
-
1989
- 1989-10-26 JP JP12545589U patent/JPH0723965Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0723965Y2 (ja) | 1995-05-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |