JPH0363943U - - Google Patents
Info
- Publication number
- JPH0363943U JPH0363943U JP12545689U JP12545689U JPH0363943U JP H0363943 U JPH0363943 U JP H0363943U JP 12545689 U JP12545689 U JP 12545689U JP 12545689 U JP12545689 U JP 12545689U JP H0363943 U JPH0363943 U JP H0363943U
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- insulating container
- package
- area
- connection terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989125456U JPH0741162Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989125456U JPH0741162Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0363943U true JPH0363943U (US07345094-20080318-C00003.png) | 1991-06-21 |
| JPH0741162Y2 JPH0741162Y2 (ja) | 1995-09-20 |
Family
ID=31673326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989125456U Expired - Lifetime JPH0741162Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741162Y2 (US07345094-20080318-C00003.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08306855A (ja) * | 1995-04-27 | 1996-11-22 | Lg Semicon Co Ltd | 半導体パッケージ、リードフレーム、回路基板、半導体パッケージモールディング用金型及び電子回路盤並にリードフレームの製造方法 |
| WO2018155559A1 (ja) * | 2017-02-22 | 2018-08-30 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
| WO2018155434A1 (ja) * | 2017-02-21 | 2018-08-30 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55176571U (US07345094-20080318-C00003.png) * | 1979-06-05 | 1980-12-18 | ||
| JPS59151443A (ja) * | 1983-02-17 | 1984-08-29 | Fujitsu Ltd | 半導体装置 |
-
1989
- 1989-10-26 JP JP1989125456U patent/JPH0741162Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55176571U (US07345094-20080318-C00003.png) * | 1979-06-05 | 1980-12-18 | ||
| JPS59151443A (ja) * | 1983-02-17 | 1984-08-29 | Fujitsu Ltd | 半導体装置 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08306855A (ja) * | 1995-04-27 | 1996-11-22 | Lg Semicon Co Ltd | 半導体パッケージ、リードフレーム、回路基板、半導体パッケージモールディング用金型及び電子回路盤並にリードフレームの製造方法 |
| WO2018155434A1 (ja) * | 2017-02-21 | 2018-08-30 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
| WO2018155559A1 (ja) * | 2017-02-22 | 2018-08-30 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
| JPWO2018155559A1 (ja) * | 2017-02-22 | 2020-01-09 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741162Y2 (ja) | 1995-09-20 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |