JPH0363942U - - Google Patents
Info
- Publication number
- JPH0363942U JPH0363942U JP12545489U JP12545489U JPH0363942U JP H0363942 U JPH0363942 U JP H0363942U JP 12545489 U JP12545489 U JP 12545489U JP 12545489 U JP12545489 U JP 12545489U JP H0363942 U JPH0363942 U JP H0363942U
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- package
- lid
- recess
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000003566 sealing material Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12545489U JPH0745962Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12545489U JPH0745962Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0363942U true JPH0363942U (pl) | 1991-06-21 |
| JPH0745962Y2 JPH0745962Y2 (ja) | 1995-10-18 |
Family
ID=31673324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12545489U Expired - Lifetime JPH0745962Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0745962Y2 (pl) |
-
1989
- 1989-10-26 JP JP12545489U patent/JPH0745962Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0745962Y2 (ja) | 1995-10-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |