JPH0363942U - - Google Patents

Info

Publication number
JPH0363942U
JPH0363942U JP12545489U JP12545489U JPH0363942U JP H0363942 U JPH0363942 U JP H0363942U JP 12545489 U JP12545489 U JP 12545489U JP 12545489 U JP12545489 U JP 12545489U JP H0363942 U JPH0363942 U JP H0363942U
Authority
JP
Japan
Prior art keywords
insulating base
package
lid
recess
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12545489U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0745962Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12545489U priority Critical patent/JPH0745962Y2/ja
Publication of JPH0363942U publication Critical patent/JPH0363942U/ja
Application granted granted Critical
Publication of JPH0745962Y2 publication Critical patent/JPH0745962Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP12545489U 1989-10-26 1989-10-26 半導体素子収納用パッケージ Expired - Lifetime JPH0745962Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12545489U JPH0745962Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12545489U JPH0745962Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0363942U true JPH0363942U (enEXAMPLES) 1991-06-21
JPH0745962Y2 JPH0745962Y2 (ja) 1995-10-18

Family

ID=31673324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12545489U Expired - Lifetime JPH0745962Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0745962Y2 (enEXAMPLES)

Also Published As

Publication number Publication date
JPH0745962Y2 (ja) 1995-10-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term