JPH036368A - Vacuum deposition device - Google Patents

Abstract

PURPOSE:To rapidly adjust the thickness of a vapor-deposited film without causing any defect at the time of vaporizing a vapor-deposition metal in a crucible and depositing the metal on a material to be vapor-deposited by vertically moving a heat- resistant rod in the crucible to adjust the molten metal level. CONSTITUTION:A film B rewound from a rewinding shaft 10 in a vacuum chamber 5 is sent to a vacuum chamber 6 via a coating roller 4, the molten metal M in the crucible 17 is vaporized by an electron gun 16, the vapor is deposited on the film B, and the film B is wound on a winding shaft 15. At this time, the film C coated with the metallic film is irradiated with the light beam from a light emitter 43, and the film thickness is read by a film thickness measuring device 46 through a light receiving device 44. The comparison data signal of the read thickness and the reference thickness is transmitted to a controller 37, the changes in the thickness are momentarily compared and adjusted, and the heat-resistant rod 27 is vertically moved in the crucible 17 to adjust the height H of the molten metal surface in the crucible 17 by a motor 34. As a result, the film thickness is instantaneously and continuously controlled without generating any defect in the film, and a vapor-deposited film having uniform thickness is obtained.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a vapor deposition apparatus for vacuum vapor deposition of metal onto materials to be vaporized such as metal, paper, cloth, etc., and particularly for adjusting the level of molten metal in a crucible. This relates to a hot water level adjustment mechanism.

[Prior Art] Conventional vacuum deposition technology, for example, a vacuum deposition apparatus for VTR tape, coats the center of a vacuum chamber 5.6 consisting of a vacuum chamber 1 and a vacuum chamber cover 2, as shown in FIG. A film unwinding chamber 5 and a deposition chamber 6 are separated by vacuum chamber partition walls 7a and 7b with the roller 4 in between, and each chamber 5 and 6 is equipped with a vacuum pump 8 for the deposition chamber and a vacuum pump 9 for the winding chamber. The interior of the film unwinding and winding chamber 5 is maintained at a maximum of 1X10-'mbar, and the interior of the deposition chamber 6 is maintained at a maximum of 1X10-'mbar.

The film B to be deposited is suspended on an unwinding shaft 10 as an unwinding roll film A wound into a roll, and is unwound to the coating roller 4 via an entrance guide roller 11.
The metal vapor V is deposited while the coating roller 4 has been around the outer periphery of the coating roller 4 for more than 2/3 times, and is then wound onto the winding shaft 15 through the outlet guide roller 12, tension roller 13, deflector roller 14, etc. Roll film C is obtained. The crucible 1 is heated by the electron beam E emitted from the electron gun 16.
The vapor-deposited metal ingot D in 7 is heated to a maximum temperature of 900°C and melted into molten metal water M, which rises as metal vapor V because it is under highly reduced pressure and is sent by coating roller 4. A vapor-deposited metal thin film is formed directly below or diagonally on the film B.

The vapor-deposited metal M is supplied into the crucible 17 using vapor-deposited metal ingots D stored in a vertical line in the supply chamber 3 to the inbot 1.
This is performed sequentially by pushing up 1 to D3. That is, the motor 19 rotates the ingot push-up shaft 23 via the worm screw 2o and the worm wheel 21, and the ingot push-up shaft 23, which is supported by push-up shaft bearings 22a and 22b at the top and bottom, is rotated to raise and lower the ingot and is supported on the ingot receiver 24. Vapor-deposited metal ingots D, D2. D3 is continuously pushed into the crucible 17 from the lower part of the crucible 17 manually or automatically in an amount that is consumed as metal vapor V. New evaporated metal ingots are supplied by opening the ingot supply port cover 25 before operation, and during operation, they are simultaneously evacuated by the evaporation chamber vacuum pump 8 through the evacuation pipe 26 and maintained under reduced pressure.

As mentioned above, in the conventional vacuum evaporation equipment, film B
In order to obtain a continuous and uniform metal film thickness over the entire length of 2,000 to 5,000 m or more, a stable electron gun 16 is required.
control and maintenance, melting of vapor-deposited metal ingot l-D process to ensure a constant degree of vacuum with little vertical fluctuation, and control of the surface height H of the molten metal M in the crucible 17 in Fig. 4. There is.

[Problems to be Solved by the Invention] In conventional vacuum evaporation equipment, when increasing or decreasing the thickness of the evaporated film in the length direction of the material to be evaporated, the evaporation speed, the output of the electron gun, and the feeding speed of the ingot must be adjusted. Although this method has the advantage of being able to change the deposition rate instantaneously, it has the disadvantage of causing wrinkles in the film-like material to be deposited.

Adjustment of the output of the electron gun is limited to a certain range for control purposes, so the adjustment range is narrow, and since it affects the film thickness distribution in the width direction, it is limited to minute adjustments.

In addition, by increasing or decreasing the feeding speed of the ingot and adjusting the height H of the hot water level in the crucible 17 shown in FIG. Although it is common practice to adjust the film thickness by increasing or decreasing the film thickness, there is a delay in increasing or decreasing the film thickness, and if the ingot feeding speed is rapidly increased, the small amount of N contained in the ingot may ○、H
etc. gases are ejected temporarily (splash phenomenon), which causes the molten metal M to scatter, which tends to cause quality defects in the deposited film, and cannot be used when it is necessary to instantly adjust the film thickness. This problem has been dealt with by changing the deposition rate, which unavoidably causes defects such as wrinkles in some areas, but there is still no mechanism for adjusting the film thickness that has a fast dissolution with a small time constant and does not affect the deposition material. does not exist.

The present invention solves the drawback of the prior art of slow film thickness control (slow solubility) in vacuum evaporation, makes it possible to quickly adjust the level of the molten metal, and moreover, It is an object of the present invention to provide a vacuum evaporation apparatus that can improve film thickness accuracy.

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention provides a heat-resistant rod that moves up and down in the crucible, and an adjustment mechanism that moves this heat-resistant rod up and down, and adjusts the level of the molten metal. It made it possible.

[Function] Even if a splash phenomenon occurs in the crucible and the molten metal M spouts out and the melt level drops, the melt level can be quickly adjusted by lowering the heat-resistant rod, and the thickness of the deposited film can be controlled at a constant level. I can do it.

[Example] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an enlarged sectional view of a hot water level height adjusting device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a vacuum evaporation device.

In FIGS. 1 and 2, numerals 1 to 26 indicate the same parts as the conventional one.

27 is a heat-resistant rod that adjusts the level H of the molten metal M in the crucible 17; 28 is an adjustment mechanism that moves the heat-resistant rod 27 up and down; this adjustment mechanism 28 includes a frame 29, fixed poles 1 to 30, and a worm. It is composed of a speed reducer 31, a screw shaft 32, a transmission shaft 33, an electric motor 34, and a gripper 35.

36 is a pulse transmitter, 37 is a control device for controlling the hot water level H, 3
8 is a dynamic cable, 39 is a rotation signal cable, 40 is a deposited film thickness signal cable, 41 is a lot supply signal cable,
42 is a light beam, 43 is a projector, 44 is a light receiver, 45 is a film thickness measurement signal, and 46 is a film thickness measuring device.

In such a structure, the level H of the molten metal M in the crucible 17 shown in FIG. When a splash phenomenon of the molten metal M occurs and the hot water level H decreases, the heat resistant rod 27 is inserted into the molten metal M in the crucible 17 using the adjustment mechanism 28 to raise the hot water level H. let On the other hand, if the hot water surface height [■] rises too much, the adjustment mechanism 28 pulls out the heat-resistant rod 27 from the molten metal hot water M by the completely opposite operation to lower the hot water surface height H.

That is, when the level H of the molten metal M melted by heating with the electron gun 16 in the crucible 17 provided in the vacuum chamber 1 shown in FIG. , the heat-resistant rod 27 which is a worm reducer is connected to the first
As shown in the figure, the heat-resistant rod 27 is inserted into the molten metal M in the crucible 17 to raise the hot water level H by the amount that the heat-resistant rod 27 is inserted.

By inserting the heat-resistant rod 27 into the molten metal bath M in this manner, the surface height H of the molten metal bath M can be quickly raised.

On the contrary, when lowering the hot water level H, the heat-resistant rod 27 is connected from the electric motor 34 to the transmission shaft 33 and the worm reducer 3.
1 through the screw shaft 32, and the crucible 1 through the gripper 35.
By withdrawing the molten metal from the molten metal M in the molten metal 7, the height H of the molten metal can be lowered.

Furthermore, if the pulse signal from the rotation signal cable 39 from the pulse transmitter 36 directly connected to the electric motor 34 exceeds the set range, the controller 37 makes a comparative judgment and the lot signal cable 41 sends the ingot as shown in FIG. Motor 1 that supplies
9 performs acceleration or deceleration control.

7. The film thickness is usually measured by irradiating the metal film deposited on the film B with a light beam 42 and measuring the film thickness based on the transmittance of the light transmitted from the emitter 43 to the receiver 44, as shown in FIG. The 81 constant signal 45 is read by the film thickness measuring device 46, and the measurement comparison data signal with the reference film thickness value is transmitted to the control device 40 shown in FIG. If the film thickness is thinner than the set film thickness by comparing and judging from time to time, the heat resistant rod 27 raises the hot water level height H, and if the film thickness is thicker than the set film thickness, the heat resistant rod 27 lowers the hot water level height H. By continuously controlling the electric motor 34 in this manner, the film thickness can be made uniform.

Next, the conditions for implementing this example and the results obtained will be described below.

Film dimensions: Thickness 7~20μm x Width 508nyn x Length 5,000m Film material: Polyethylene terephthalate 1-Deposited metal: Co-Ni (80-20% by weight) Deposition rate: 10~Loom/min Deposited film thickness: 800
~2,000 people Electron gun for deposition: 300 kW Deposition crucible: Water-cooled copper crucible Crucible dimensions: depth 60mm x width 170mm x length 75mm
■Heat-resistant rod: 100mm square x 300mm length ca
O-beam electric motor: A-C80w3. OOOrpm servo motor ~ 1 unit Vacuum level in deposition chamber: 1 xlo-'mbar-5XIO"
Mbar film thickness measuring device: Continuous 6-point beam transmission measurement type The material of the heat-resistant rod 27 above is Af120. , ng.

Carbon or the like may be used, and the electric motor 34 may be a C servo motor, A, C clutch brake motor, hydraulic servo actuator, or the like.

[Effects of the Invention] According to the present invention, the hot water level can be adjusted quickly, the thickness of the deposited film can be controlled instantaneously and continuously without causing defects in the deposited film, and the work This improves performance and product yield.

[Brief explanation of the drawing]

FIG. 1 is an enlarged sectional view of a hot water level height adjustment device according to an embodiment of the present invention, FIG. 2 is a sectional view of a vacuum evaporation device, FIG. 3 is a sectional view of a conventional vacuum evaporation device, and FIG. 4 is an explanatory diagram showing the vapor deposition height. 3... Vacuum chamber, 16... Electron gun, 17... Crucible, 27... Heat resistant rod, 28... Adjustment mechanism, B evaporation target. 1- Figure 6

Claims (1)

[Claims] A heat-resistant rod that moves up and down within the crucible, in which an electron gun for heating and melting a metal for deposition and a crucible for storing the molten metal are provided in a vacuum chamber, and the metal for deposition is vacuum-deposited onto an object to be deposited. A vacuum evaporation apparatus characterized in that an adjustment mechanism is provided to move the heat-resistant rod up and down, thereby making it possible to adjust the level of the hot water level.