JPH0362953A - Surface mounting type container for electronic component - Google Patents

Abstract

PURPOSE:To decrease damages due to heating at the time of sealing work by providing a side wall along the periphery of the surface of one side of a glass bottom plate, molding the wall in a shape having a recessed cross section, and molding the inner side of the side wall as an inwardly inclined surface. CONSTITUTION:A side wall 11a is provided along the periphery of the surface of one side of a glass bottom plate 11 in a shape having a recessed cross section. The entire inside surface of the side wall 11a is molded as an inwardly inclined surface 11b. Thus, mechanical strength is increased, and the capacity is also made large. Therefore, heat capacity is made large. Since the inner wall of the side wall 11a of the bottom plate 11 to which a seal ring 12 is fixed is molded as the inwardly inclined surface 11b in this way, the mechanical strength can be increased. Since the volume becomes also large, the heat capacity is also increased. The amount of the rise of the temperature of the entire body is decreased. Therefore, damages due to the thermal cause of the bottom plate can remarkably be decreased.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a surface-mounted container for electronic components whose lid is sealed by seam welding.

(Technical Background of the Invention and Problems thereof) Recently, surface-mounted components have been widely used in various electronic components for the purpose of automating assembly processes and increasing packaging density.

For this reason, surface-mounted electronic components such as crystal resonators are desired, and for example, they are significantly smaller in size than conventional ones, with a width of 5.0 mm, a length of 7.0 mm, and a height of 2 mm.
．． Quartz crystals with a culm of 0 mm are manufactured.

FIG. 2 is a perspective view showing an example of a conventional container for a crystal resonator of this type, and FIG. 3 is a sectional view.

In the figure, reference numeral 1 denotes a bottom plate made of glass, which is approximately rectangular and has a side wall along the periphery of the plate surface to form a concave cross section. In this way, a bottom plate made of glass has the advantage of being cheaper and having higher dimensional accuracy than, for example, ceramic, but has the problem of easily causing 6ti loss when locally heated.

2 is a metal seal ring formed into a substantially rectangular ring shape. Then, one side of the seal ring 2 is airtightly fixed to the edge of the side wall when the bottom plate 1 is heated and melted and molded.

Furthermore, an electrode 1a for mounting on a printed circuit board or the like is formed on the outer surface of the bottom plate 1.

Inside the container consisting of the bottom plate 1 and the seal ring 2 is housed an electronic component 3, such as a crystal piece whose resonant frequency is adjusted to a predetermined resonance frequency by forming electrodes on the plate surface.

Then, a metal lid 4 is placed on the other side of the seal ring 2, and a pair of roller electrodes 5, for example, in the shape of a truncated cone, are placed on the upper surface of the lid 4 along its periphery as shown by broken lines in FIG. Seam welding is performed by applying welding current while moving the welding material into contact with the ridge angle of the material.

In this way, when the lid 4 is sealed to the container by seam welding, if the welding conditions are carefully considered, good sealing properties can be obtained. The mechanical strength is also good.

In addition, it is possible to prevent the lid 4 from shifting when the roller electrode 5 comes into contact with the lid 4 during the sealing work, and to reduce the heat capacity of the lid 4 at the welding area to ensure reliability with as little electric power as possible. The peripheral edge 4a of the lid body 4 facing the seal ring 2 is formed thin so that welding can be carried out with ease.

However, in this type of container, when the temperature of the lid 4 and seal ring 2 increases due to the current applied during seam welding, residual strain and thermal stress occur, and in extreme cases, cracks occur on the glass bottom plate. There have been problems such as the seal ring 2 and the glass of the plate 1 coming apart at the boundary.

(Object of the Invention) The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a surface-mounted container for electronic components that is less likely to be damaged by heat generated during sealing work.

(Summary of the Invention) The present invention is an example of a bottom plate of glass, in which a side wall is provided along the periphery of the bottom plate, the cross section is formed into a concave shape, and one side of a metal seal ring is airtightly attached to the edge of the side wall. It is characterized by a metal lid body being airtightly welded directly to the other side of the seal ring by seam welding, and the inside of the side wall being formed into an inwardly sloped surface. .

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the cross-sectional view shown in FIG. 1, taking a surface-mounted container for a crystal resonator as an example.

In the figure, reference numeral 11 denotes a glass bottom plate, and a side wall 11a is provided along the periphery of the negative side plate surface to form a concave cross section. Note that an inwardly inclined surface 11b extends along the entire circumference of the inside of the side wall 11a.
It is molded to increase mechanical strength and increase volume to increase heat capacity.

And 12 is a Kovar molded into a roughly rectangular shape, 4270i,
This is a seal ring made of nickel silver hat.

One side of this seal ring 12 is fixed to the edge of the side wall 11a of the bottom plate 11 to form a container.

Furthermore, an electrode 11c for mounting on a printed circuit board or the like is formed on the outer surface of the bottom plate 11.

This container houses an electronic component 13, such as a crystal piece whose resonant frequency is adjusted to a predetermined resonance frequency by cutting and polishing a quartz crystal at a predetermined angle and forming excitation electrodes on the plate surface.

A metal lid body 14 is attached to the other side of the seal ring 12.
Place it in place and hold it in place, then seam weld it to make it airtight.

The peripheral edge 14a of the lid 14 is formed thin to prevent it from shifting when the roller electrode comes into contact with it, and to reduce the heat capacity of the lid 14 at the welding area.

With this configuration, the inner wall of the side wall 11a of the bottom plate 11 to which the seal ring 12 is fixed is formed into an inwardly inclined surface 11b, so it is possible to increase the mechanical strength, and the volume is also large. As a result, the heat capacity increases and the overall temperature rise decreases, and damage to the bottom plate due to thermal causes can be significantly reduced.

Note that the present invention is not limited to the above embodiments,
For example, although the above embodiment has been explained using a crystal resonator as an example, it is of course applicable to various electronic components such as filters, oscillators, integrated circuit elements, etc. (Effects of the Invention) As detailed above, the present invention Seam welding can reduce damage caused by heat generated when welding the lid to the seal ring, thereby providing a surface-mounted container for electronic components that is highly reliable and inexpensive.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a perspective view showing an example of a conventional container, and FIG. 3 is a sectional view of the container shown in FIG. 2. 11 ・ ・ ・ ・ 11b ・ ・ ・ 12 ・ ・ ・ ・ l 3 ・ ・ ・ ・ l 4 ・ ・ ・ ・ ・ Bottom plate, inclined surface, seal ring, electronic parts, lid body

Claims (1)

[Scope of Claims] A glass bottom plate formed to have a concave cross-section with a side wall provided along the periphery of one side plate surface; a metal seal ring with one side airtightly attached to the edge of the side wall; An electronic component housed in a container consisting of the bottom plate and a seal ring, and a metal lid hermetically welded to the other side of the seal ring by seam welding, the inner side of the side wall facing inward. A surface-mounted electronic component container characterized by being molded onto an inclined surface.