JPH0361326U - - Google Patents
Info
- Publication number
- JPH0361326U JPH0361326U JP12334289U JP12334289U JPH0361326U JP H0361326 U JPH0361326 U JP H0361326U JP 12334289 U JP12334289 U JP 12334289U JP 12334289 U JP12334289 U JP 12334289U JP H0361326 U JPH0361326 U JP H0361326U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- insulating part
- case
- glass insulating
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の湿式電解コンデン
サを示す縦断面図、第２図は同実施例の湿式電解
コンデンサのガラス絶縁部を示す部分拡大断面図
、第３図は従来の電子部品（半導体装置）を示す
部分断面図、第４図は他の従来の電子部品（半導
体装置）を示す部分断面図である。
１３……ケース、１４……パイプ、１５……ガ
ラス絶縁部、１６……環状突起、１７……開口部
（ケース）、１８……陽極リード線、２４……陰
極リード線、２５……開口部の内周面（ケース）
。
Fig. 1 is a longitudinal sectional view showing a wet electrolytic capacitor according to an embodiment of the present invention, Fig. 2 is a partially enlarged sectional view showing the glass insulation part of the wet electrolytic capacitor according to the same embodiment, and Fig. 3 is a conventional electronic component. FIG. 4 is a partial sectional view showing another conventional electronic component (semiconductor device). 13... Case, 14... Pipe, 15... Glass insulation part, 16... Annular projection, 17... Opening (case), 18... Anode lead wire, 24... Cathode lead wire, 25... Opening inner peripheral surface (case)
.
Claims (1)
のリード線を内側から外側に導出するための開口
部を有するケースと、上記ケースの開口部の内外
を通り内部に上記リード線が挿通されるパイプと
、上記ケースの開口部の内周面と上記パイプの外
周面とにより形成される隙間を気密封止するガラ
ス絶縁部とを有し、上記パイプにこれを包囲する
状態に設けられ少なくとも一部が上記ガラス絶縁
部の表面に露出した状態で上記ガラス絶縁部に埋
込まれている突起を有することを特徴とする電子
部品。 A case that houses an electronic component element inside and has an opening for leading the lead wire of the electronic component element from the inside to the outside, and a pipe into which the lead wire is inserted through the inside and outside of the opening of the case. and a glass insulating part that airtightly seals a gap formed by the inner circumferential surface of the opening of the case and the outer circumferential surface of the pipe, the glass insulating part being provided around the pipe and at least partially surrounding it. An electronic component characterized in that the electronic component has a protrusion embedded in the glass insulating part with the protrusion exposed on the surface of the glass insulating part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12334289U JPH0361326U (en) | 1989-10-20 | 1989-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12334289U JPH0361326U (en) | 1989-10-20 | 1989-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361326U true JPH0361326U (en) | 1991-06-17 |
Family
ID=31671325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12334289U Pending JPH0361326U (en) | 1989-10-20 | 1989-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361326U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01202846A (en) * | 1988-02-08 | 1989-08-15 | Nec Corp | Semiconductor device |
-
1989
- 1989-10-20 JP JP12334289U patent/JPH0361326U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01202846A (en) * | 1988-02-08 | 1989-08-15 | Nec Corp | Semiconductor device |
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