JPH01202846A - Semiconductor device - Google Patents

Abstract

PURPOSE:To hold hermetic seal at all times by forming an annular projecting section to one part of a section buried with glass in a metallic pipe shaping an external terminal for a cap, a top section of which has a glass insulating section. CONSTITUTION:An annular projecting section 11 is formed to one part of a section buried with glass in a metallic pipe 10 penetrated and sealed to a glass insulating section 2 in the top section of a cap 3. That is, the annular projecting section 11 is shaped by welding a doughnut-shaped metallic plate onto the outer circumference of the metallic pipe 10. Consequently, the metallic pipe 10 buried into the glass insulating section 2 and glass are brought into contact not only in the pipe axial direction but also in the direction rectangular to a pipe axis, thus increasing strength to external force in the direction of the bending of the metallic pipe. Accordingly, even when force in the direction of bending is applied, the generation of cracks in glass is prevented, thus holding hermetic seal.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor device of the type having a cap and stud having a glass insulated terminal on the top.

[Conventional technology]

The structure of a conventional semiconductor device of this type will be explained with reference to the cross-sectional view of FIG. Stud 5 with a male thread carved into the protrusion
A semiconductor pellet 4 is mounted with solder, and a cap 3 having a glass insulating part 2 is welded to the top. An internal wire 6 connected to the electrode of the semiconductor pellet 4 passes through the metal vibrator 7 that penetrates the glass insulation part 2, but the tip of the metal pipe 7 is caulked to connect an external terminal l for direct electrical connection. is forming.

With such a structure, the semiconductor device is fixed by fixing with the male screw of the stud 5, making one electrical connection, and attaching a lead to the external terminal 1.

[Problem to be solved by the invention]

In the conventional semiconductor device described above, the metal pipe insulated by glass has the same shape from the glass insulating part to the caulked part, so if a bending force is applied outside the cap, the glass will crack. Therefore, there was a drawback that the airtight seal could not be maintained and the semiconductor pellet deteriorated.

An object of the present invention is to provide a semiconductor device that eliminates the above-mentioned drawbacks.

[Means to solve the problem]

The present invention relates to a type in which a metal pipe is hermetically sealed and penetrates through the top glass insulating part of a cap directly attached to a stud carrying a semiconductor pellet, and the tip of the metal pipe is caulked to form an electrical connection terminal. In the semiconductor device, a part of the metal pipe embedded in the glass insulating part has an annular protrusion on the outer periphery thereof.

[Effect]

The metal pipe embedded in the glass insulation part makes contact with the glass not only in the direction of the tube axis as in the conventional case, but also in the direction perpendicular to the tube axis, which increases the strength against external forces in the bending direction of the metal pipe. becomes stronger, and glass cracks do not occur.

〔Example〕

Embodiments of the present invention will be described below with reference to one drawing.

FIG. 1 is a longitudinal cross-sectional view of the first embodiment, which is basically the same in structure as the conventional one, except that a metal pipe 10 that is sealed through the glass insulating part 2 at the top of the cap 3 is connected to the glass. The difference is that a part of the embedded portion is provided with an annular convex portion 11. The annular convex portion 11 is formed by welding a donut-shaped metal plate to the outer periphery of the metal pipe 10.

Assembling this semiconductor device involves mounting the semiconductor pellet 4 on the stud 5, connecting the internal wire 6 to the electrode of the semiconductor pellet 4 by bonding it, and then inserting the internal wire 6 into the metal pipe 10 of the cap 3. Then, after welding the flange part of cap 3 to stud 5,
An external terminal l is formed by caulking the tip of the metal pipe 10. This simultaneously seals.

Next, a second embodiment will be explained with reference to the longitudinal sectional view of FIG. 2. Since the annular convex portion 11 of the metal pipe 10 has a triangular cross section in the axial direction of the pipe, when pouring glass and embedding the metal pipe 10 in manufacturing the cap 3, it is difficult to form voids and it is difficult to form a close contact with the glass. good. Further, although not particularly shown in the drawings, the cross section in the axial direction of the pipe may be semicircular.

〔Effect of the invention〕

As explained above, the present invention provides a ring-shaped convex part in a part of the part embedded in the glass of the metal pipe forming the external terminal of the cap having the glass insulating part on the top. It has increased strength against external forces in the bending direction, and can maintain airtight sealing without causing glass cracks even when the external forces are applied.

[Brief explanation of the drawing]

1 and 2 are longitudinal sectional views of an embodiment of the present invention, and FIG. 3 is a longitudinal sectional view of a conventional example. 1...External terminal, 2...Glass insulation part. 3... Cap, 4... Semiconductor pellet, 5
...Stud, 7.10...Metal pipe, 1
1... Annular convex part.

Claims (1)

[Claims] A metal pipe hermetically seals and penetrates the top glass insulating part of the cap directly attached to the stud carrying the semiconductor pellet, and its tip is caulked to form an electrical connection terminal. type semiconductor device, characterized in that the metal pipe has an annular convex portion on a part of the outer periphery of the portion embedded in the glass insulating portion.