JPH0360873B2 - - Google Patents
Info
- Publication number
- JPH0360873B2 JPH0360873B2 JP61242526A JP24252686A JPH0360873B2 JP H0360873 B2 JPH0360873 B2 JP H0360873B2 JP 61242526 A JP61242526 A JP 61242526A JP 24252686 A JP24252686 A JP 24252686A JP H0360873 B2 JPH0360873 B2 JP H0360873B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- pyrrole
- monomer
- resin
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims description 102
- 239000000843 powder Substances 0.000 claims description 74
- 239000000178 monomer Substances 0.000 claims description 34
- 229920000642 polymer Polymers 0.000 claims description 32
- 239000002131 composite material Substances 0.000 claims description 24
- 230000001590 oxidative effect Effects 0.000 claims description 20
- 229920003002 synthetic resin Polymers 0.000 claims description 18
- 239000000057 synthetic resin Substances 0.000 claims description 18
- 239000002019 doping agent Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 17
- 239000012985 polymerization agent Substances 0.000 claims description 15
- 239000008187 granular material Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 40
- 239000011347 resin Substances 0.000 description 40
- 239000002245 particle Substances 0.000 description 25
- 239000000243 solution Substances 0.000 description 12
- 239000011231 conductive filler Substances 0.000 description 11
- -1 indium oxide Chemical class 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 239000004677 Nylon Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920001778 nylon Polymers 0.000 description 5
- 239000004800 polyvinyl chloride Substances 0.000 description 5
- 229920000915 polyvinyl chloride Polymers 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000002216 antistatic agent Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 229920000547 conjugated polymer Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 150000002739 metals Chemical group 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910021381 transition metal chloride Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- OXHNLMTVIGZXSG-UHFFFAOYSA-N 1-Methylpyrrole Chemical compound CN1C=CC=C1 OXHNLMTVIGZXSG-UHFFFAOYSA-N 0.000 description 1
- FEKWWZCCJDUWLY-UHFFFAOYSA-N 3-methyl-1h-pyrrole Chemical compound CC=1C=CNC=1 FEKWWZCCJDUWLY-UHFFFAOYSA-N 0.000 description 1
- RBWNDBNSJFCLBZ-UHFFFAOYSA-N 7-methyl-5,6,7,8-tetrahydro-3h-[1]benzothiolo[2,3-d]pyrimidine-4-thione Chemical compound N1=CNC(=S)C2=C1SC1=C2CCC(C)C1 RBWNDBNSJFCLBZ-UHFFFAOYSA-N 0.000 description 1
- SWDGQFQKNKEWHK-UHFFFAOYSA-N B(F)(F)F.[Ag] Chemical compound B(F)(F)F.[Ag] SWDGQFQKNKEWHK-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- SKCNIGRBPJIUBQ-UHFFFAOYSA-N chloroform;ethyl acetate Chemical compound ClC(Cl)Cl.CCOC(C)=O SKCNIGRBPJIUBQ-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Chemical class O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920005615 natural polymer Polymers 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-N peroxydisulfuric acid Chemical compound OS(=O)(=O)OOS(O)(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-N 0.000 description 1
- OBCUTHMOOONNBS-UHFFFAOYSA-N phosphorus pentafluoride Chemical compound FP(F)(F)(F)F OBCUTHMOOONNBS-UHFFFAOYSA-N 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- SATVIFGJTRRDQU-UHFFFAOYSA-N potassium hypochlorite Chemical compound [K+].Cl[O-] SATVIFGJTRRDQU-UHFFFAOYSA-N 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Description
〔産業上の利用分野〕
本発明は例えば電磁波シールド、帯電防止性を
必要とする電子機器部品等の包装用資材や電子機
器組立ライン等の静電気発生を嫌う場所で使用す
る床材、壁材、静電気帯電防止靴等、各種導電性
製品製造用原料として用いられる導電性複合粉粒
体及びその製造方法に関する。
〔従来の技術〕
近年、ICやLSI等の半導体部品の静電気による
破壊が大きな問題となり、さらに電磁波による電
子機器の誤動作がクローズアツプされるようにな
つており、これに伴いIC等の収納用容器や包装
用資材は勿論のこと、ICの組立工場そのものに
帯電防止性を付与することやコンピユーター等の
ハウジングに電磁波シールドを施すことが必要と
されており、かかる目的を達成するために導電性
を付与した製品が広く用いられるようになつてい
る。この種の導電性を付与した製品としてはポリ
アセチレン等の如くポリマー自体が導電性を有す
る導電性樹脂から成形したものや樹脂又はゴムに
導電性充填剤を混入した導電性樹脂組成物から成
形したものあるいは樹脂に帯電防止性を混入した
帯電防止性組成物から成形したものが知られてい
るが、一般的にはカーボン粉末、金属フレーク、
金属繊維、金属粉末、金属蒸着粒子等の導電性充
填剤や界面活性剤等の帯電防止剤を混入して導電
性を付与した樹脂又はゴムより成形した製品が用
いられている。また金、パラジウム等の金属や酸
化インジウム等の金属酸化物を蒸着する方法、あ
るいはピロールを電解酸化重合する方法等により
導電性を付与した樹脂も知られている。
〔発明が解決しようとする問題点〕
しかしながら、導電性充填剤を樹脂又はゴムに
混入させて導電性を付与する場合、導電性充填剤
を樹脂又はゴムに添加して混練する際の導電性充
填剤の分散性に問題があり、導電性が不均一とな
つたり、また導電性を向上させるために導電性充
填剤の添加量を増加させると樹脂の強度低下をき
たす等の問題があつた。また帯電防止剤を混入し
て導電性を付与する方法は、帯電防止剤が樹脂等
の中より流出して失なわれやすいために導電性低
下をきたしやすい欠点があつた。更に導電性付与
とともに製品の増量化、軽量化を行なう必要があ
る場合には、導電性充填剤や帯電防止剤とともに
合成樹脂粒子、天然高分子粒子、ゴム粉粒体、無
機粉粒体等の一般の充填剤を併用するが、これら
の充填剤を併用すると充分な導電性を付与するこ
とができない場合があるという問題があつた。一
方金属、金属酸化物を蒸着する方法やピロールを
電解酸化重合する方法では蒸着や電解を行うため
の製造コストが高くつくとともに、複雑な製造装
置を必要とするという問題があつた。
〔問題点を解決するための手段〕
本出願人は上記問題点を解決するため鋭意研究
した結果、プラスチツクフイルム、シートあるい
は成形品等の被導電処理材を処理液中に浸漬し
て、該処理液中で電子共役系ポリマーを形成し得
るモノマーと酸化重合剤とに接触せしめ、ドーパ
ントの存在下にモノマーを重合せしめて電子共役
系ポリマーと被導電処理材とからなる導電性の付
与された複合体を得る方法が優れていることを見
出し先に提案したが(特願昭60−247763号)、処
理液の使用効率を高めるべく更に鋭意研究した結
果、被導電処理材として合成樹脂粉粒体を用い、
該粉粒体を非溶媒中に分散させ、該非溶媒中でピ
ロール系モノマーと、酸化重合剤とに接触せし
め、ドーパントと存在下に前記モノマーを重合せ
しめて粉粒体表面をピロール系重合体で被覆する
か、あるいは粉粒体内にピロール系重合体の一部
又は全部が含浸された導電性複合粉粒体とする方
法によると、ピロール系モノマーの使用量がきわ
めて少なくとも、実質的に収率100%でピロール
系重合体と粉粒体とからなる導電性複合合成樹脂
粉粒体を形成することができ、更に従来の方法の
ようにピロール系重合体の析出が殆ど認められ
ず、ピロール系モノマーのむだがないとともに、
得られる導電性複合合成樹脂粉粒体は種々の形状
の製品に成形することができ、優れた導電性を有
する製品を得ることができること、しかもこれら
導電性複合粉粒体は導電性充填剤として樹脂に練
り込んで用いた場合でも、この樹脂より得られる
成形品に付与される導電性が不均一となる虞れが
ないとともに単なる導電性を付与するための充填
材としての利用のみならず、製品の増量化、軽量
化のための充填材としても有効に利用できること
を見い出し本発明を完成するに至つた。
即ち本発明の一つは、合成樹脂粉粒体表面がピ
ロール系重合体で被覆されているか、あるいは粉
粒体内にピロール系重合体の一部又は全部が含浸
されていることを特徴とする導電性複合粉粒体を
要旨とするものである。また本発明のいま一つは
合成樹脂粉粒体を非溶媒中に分散させ、該非溶媒
中でピロール系モノマーと、酸化重合剤とに接触
せしめ、ドーパントの存在下に前記モノマーを重
合せしめて合成樹脂粉粒体とピロール系重合体と
からなる導電性の付与された複合粉粒体を得るこ
とを特徴とする導電性複合粉粒体の製造方法を要
旨とするものである。
本発明の導電性複合粉粒体は粉粒体の表面がピ
ロール系重合体で被覆された構成を有するか、粉
粒体の表面がピロール系重合体で被覆されている
とともに粉粒体内に一部ピロール系重合体が含浸
された構成を有するか、あるいは粉粒体内にピロ
ール系重合体の全部が含浸された構成を有するも
のである。上記合成樹脂粉粒体としては合成樹脂
の発泡粒子や多孔質粒子も含まれる。これら粉粒
体は表面多孔性のものがピロール系重合体との複
合強度が大きくなり、この結果耐久性のある導電
性が得られるため好ましい。合成樹脂粉粒体の粒
径は、射出、圧縮、押出し、ブロー成形、ビーズ
発泡成形等の成形に用いることのできる25〜
320μmが好ましい。
本発明の製造方法は合成樹脂粉粒体を非溶媒中
に分散せしめ、該非溶媒中で粉粒体をドーパント
の存在下にピロール系モノマーと酸化重合剤と接
触せしめることによりピロール系モノマーを重合
せしめて合成樹脂粉粒体とピロール系重合体とが
複合化し、ピロール系重合体によつて導電性の付
与がされた導電性複合粉粒体を得るものである。
合成樹脂粉粒体の基材樹脂としてはポリビニル
アルコール、セロフアン、セルロールエステル、
ポリ酢酸ビニル、ポリビニルホルマール、ポリビ
ニルブチラール、ポリ塩化ビニル、ポリ塩化ビニ
リデン、ポリ弗化ビニリデン、塩素化ポリエチレ
ン、ポリエチレン、ポリプロピレン、ポリメタク
リル酸メチル、ポリカーボネート、ポリエチレン
テレフタレート、ポリブチレンテレフタレート、
6−ナイロン、11−ナイロン、12−ナイロン、66
−ナイロン、イオン電解質モノマーの重合体ある
いは該モノマーと他のモノマーとの共重合体等の
熱可塑性樹脂が単独又は混合して使用される。6
−ナイロン等の如く吸水性の高い樹脂よりなるも
のの場合、ピロール系重合体が樹脂粉粒体内に略
完全に含浸形成され易く、またポリ塩化ビニル等
の如く吸水性の低い樹脂よりなるものの場合、ピ
ロール系重合体は樹脂粉粒体の表面のみを被覆す
るように形成され易い。ピロール系モノマーとし
ては例えばピロール、3−メチルピロール、N−
メチルピロール等が挙げられる。粉粒体を分散さ
せる非溶媒としては水が用いられるが、粉粒体表
面を粗してピロール系重合体の粉粒体表面への付
着性及び/又は粉粒体内への含浸性を向上するた
めに有機溶媒を添加してもよい。有機溶媒として
は例えばメタノール、エタノール等の脂肪族アル
コール類;アセトン、メチルエチルケトン等の脂
肪族ケトン類;ジエチルエーテル、テトラヒドロ
フラン等のエーテル類;塩化メチレン、クロロホ
ルム等のハロゲン化炭化水素類;酢酸エチル、酢
酸ブチル等のエステル類;トルエン、ベンゼン等
の芳香族炭化水素類;ヘキサン等の脂肪族炭化水
素類;アセトニトリル、ベンゾニトリル等の含窒
素化合物;ジメチルホルムアミド等やこれらの混
合物が挙げられ、これら溶媒の中からモノマー、
ドーパント、酸化重合剤及び粉粒体の材質に応じ
て適宜選択して用いる。上記ドーパントとしては
一般に使用されるアクセプター性のドーパントな
ら全て使用できる。アクセプター性のドーパント
としては塩素、臭素、ヨウ素等のハロゲン類;五
弗化リン等のルイス酸;塩化水素、硫酸等のプロ
トン酸;塩化第二鉄等の遷移金属塩化物;過塩素
酸銀、弗化ホウ素銀等の遷移金属化合物等が挙げ
られる。酸化重合剤としては過マンガン酸あるい
は過マンガン酸カリウム等の過マンガン酸(塩)
類;三酸化クロム酸等のクロム酸類;硝酸銀等の
硝酸塩類;塩素、臭素、ヨウ素等のハロゲン類;
過酸化水素、過酸化ベンゾイル等の過酸化物;ペ
ルオクソ二硫酸、ペルオクソ二硫酸カリウム等の
ペルオクソ酸類、ペルオクソ酸塩類;次亜塩素
酸、次亜塩素酸カリウム等の酸素酸類、酸素酸塩
類;塩化第二鉄等の遷移金属塩化物;酸化銀等の
金属酸化物等が挙げられる。これらの酸化重合剤
のうちハロゲン類、ペルオクソ酸(塩)類、遷移
金属塩化合物等はドーパントとしての作用を有す
るため、これらを酸化重合剤として用いた場合に
は、特に他のドーパントを併用する必要はない
が、前記ドーパントと併用すると更に導電性を向
上することができる。
粉粒体を非溶媒中に分散させてドーパントの存
在下にピロール系モノマーと酸化重合剤とに接触
処理する方法としては例えばモノマーと酸化重
合剤及び必要により更にドーパントを添加した非
溶媒溶液中に、モノマーが実質的に重合する前に
粉粒体を浸漬して撹拌し分散させる方法、酸化
重合剤と必要により更にドーパントを添加した非
溶媒溶液と、モノマーを含有する非溶媒溶液とに
粉粒体を順次浸漬して撹拌し分散させる方法、
酸化重合剤と必要により更にドーパントを添加し
た非溶媒溶液に粉粒体を浸漬して撹拌し分散させ
た後、この溶液中にモノマーを添加する方法等が
挙げられる。の方法によれば処理時間を短縮す
ることができるが、ピロール系モノマー重合反応
が速いため溶液を調整した後に直ちに粉粒体を溶
液中に浸漬して分散させる必要があり、溶液調整
から粉粒体を溶液に浸漬して分散させるまでに時
間が経過すると粉粒体とピロール系重合体の複合
化が低下し導電性の低下をきたし易い。また酸化
重合剤はモノマーに比べて粉粒体への浸透性が低
いため、、の方法のようにモノマー含有溶液
による処理と酸化重合剤含有溶液による処理とを
別に行う方法を採用し、先に酸化重合剤含有溶液
中に粉粒体を20分〜1時間程度浸漬分散させた
後、ピロール系モノマーと接触させることが好ま
しく、特に低吸水性樹脂よりなる粉粒体等の場合
にはピロール系重合体の粉粒体中への含浸度が向
上することによつて、より耐久性のある導電性が
付与される。
粉粒体を非溶媒に分散させて処理する際の処理
液温度は、付与される導電性をより向上する上で
0〜40℃が好ましく、特に0〜5℃が好ましい。
また粉粒体を処理する時間は粉粒体の樹脂材質、
所望する電導度の大きさ、更にはモノマー、酸化
重合剤の濃度等によつても異なるが、通常1分〜
3時間程度である。
〔実施例〕
以下、実施例を挙げて本発明を更に詳細に説明
する。
実施例 1
5の丸底フラスコに1000gのポリ塩化ビニル
樹脂粒子(重合度800、粒径50〜100μm)を入
れ、0.2Mの塩化第二鉄水溶液2を加えて撹拌
して樹脂粒子を分散させ、温度が2〜3℃になる
まで冷却した。次いで同温度にて30分間撹拌を続
けた後、0.2Mピロールモノマー水溶液400mlを加
え、更に2〜3℃に保持して1時間激しく撹拌し
た。この分散液を濾過して蒸溜水で充分洗浄した
後、50℃で乾燥して灰色の樹脂粒子を得た。この
樹脂粒子を電子顕微鏡で観察した結果、50μm以
下の粒子が観察されず、ピロール重合体のみの生
成がないことが判明した。またこの樹脂粒子を容
積21.1mlの容器に充填し、電極間(5.85cm)の抵
抗値をテスターで測定した結果、1.6×104Ωであ
り優れた導電性を有していた。
更にこの樹脂粒子を用いて厚さ0.1mmのフイル
ムを成形し、このシートの表面抵抗値、可視光線
透過率を測定した結果、それぞれ3×103Ω/cm
(25℃、50%RH)、40%であり、所望の導電性、
透明性を有していた。尚、表面抵抗値は高抵抗計
により測定した値であり、可視光線透過率は分光
光度計により400〜800nmで測定した値の積分値
である。
実施例 2〜5
第1表に示す樹脂粒子を実施例1と同様の方法
で処理し、灰色の樹脂粒子を得た。この樹脂粒子
を電子顕微鏡で観察した結果、ピロール重合体が
樹脂粒子内に含浸していた。この樹脂粒子の抵抗
値を実施例1と同様にして測定した結果を第1表
に示す。
実施例 6
ピロールモノマー水溶液濃度を0.2Mから0.4M
とした他は実施例1と同様の樹脂粒子を、同様の
方法で処理して黒色の樹脂粒子を得た。この樹脂
粒子の抵抗値を実施例1と同様にして測定した結
果、2×103Ωであつた。またこの樹脂粒子を用
いて厚さ0.1mmのフイルムを成形し、このフイル
ムの表面抵抗値及び可視光線透過率を実施例1と
同様に測定した結果、それぞれ1.2×103Ω/cm
(25℃、50%RH)、32%であつた。
比較例 1
厚さ0.1mm×幅20cm×長さ500cmのポリ塩化ビニ
ルフイルムをロール状に巻いたものを2〜3℃に
保持した2の0.2M塩化第二鉄水溶液中に30分
間浸漬した後、この溶液中に0.2Mピロールモノ
マー水溶液400mlを加えて激しく撹拌して1時間
保持した。次いでフイルムを取出して蒸溜水で洗
浄し、50℃で乾燥した後フイルムの表面抵抗値及
び可視光線透過率を実施例1と同様に測定した結
果、それぞれ8×102Ω/cm(25℃、50%RH)、
42%であつたが、ポリ塩化ビニルフイルムへのピ
ロール重合体の取込みは1.5%であり、きわめて
悪かつた。
[Industrial Application Field] The present invention is applicable to, for example, packaging materials for electronic device parts that require electromagnetic shielding and antistatic properties, and flooring and wall materials used in places where static electricity generation is averse, such as electronic device assembly lines. The present invention relates to a conductive composite powder used as a raw material for manufacturing various conductive products such as anti-static shoes, and a method for manufacturing the same. [Prior art] In recent years, the destruction of semiconductor components such as ICs and LSIs due to static electricity has become a major problem, and malfunctions of electronic equipment due to electromagnetic waves have become a focus of attention.As a result, containers for storing ICs, etc. It is necessary to provide antistatic properties not only to IC assembly plants and packaging materials, but also to provide electromagnetic shielding to the housings of computers and other devices. Products with this effect are becoming widely used. Products with this type of conductivity include those molded from conductive resins such as polyacetylene, where the polymer itself is conductive, and those molded from conductive resin compositions in which conductive fillers are mixed into resin or rubber. Alternatively, molded products made from antistatic compositions in which antistatic properties are mixed into resin are known, but generally carbon powder, metal flakes,
Products molded from resins or rubbers that have been mixed with conductive fillers such as metal fibers, metal powders, and metallized particles, and antistatic agents such as surfactants to impart conductivity are used. Also known are resins imparted with electrical conductivity by vapor deposition of metals such as gold and palladium or metal oxides such as indium oxide, or by electrolytic oxidative polymerization of pyrrole. [Problems to be solved by the invention] However, when a conductive filler is mixed into a resin or rubber to impart conductivity, the conductive filler is added to the resin or rubber and when kneaded, the conductive filling is There were problems with the dispersibility of the agent, resulting in non-uniform conductivity, and when the amount of conductive filler added to improve conductivity was increased, the strength of the resin decreased. Furthermore, the method of imparting conductivity by incorporating an antistatic agent has the disadvantage that the antistatic agent tends to flow out of the resin and be lost, resulting in a decrease in conductivity. Furthermore, if it is necessary to increase the volume or reduce the weight of the product as well as impart conductivity, synthetic resin particles, natural polymer particles, rubber powder, inorganic powder, etc. may be used in addition to conductive fillers and antistatic agents. Although general fillers are used in combination, there is a problem in that when these fillers are used in combination, sufficient conductivity may not be imparted. On the other hand, the methods of vapor depositing metals and metal oxides and the electrolytic oxidative polymerization of pyrrole have problems in that the manufacturing costs for vapor deposition and electrolysis are high and that they require complicated manufacturing equipment. [Means for Solving the Problems] As a result of intensive research in order to solve the above-mentioned problems, the present applicant immersed materials to be conductively treated, such as plastic films, sheets, or molded products, in a treatment liquid and performed the treatment. A conductive composite consisting of an electronically conjugated polymer and a conductive material is produced by bringing a monomer capable of forming an electronically conjugated polymer into contact with an oxidative polymerization agent in a liquid, and polymerizing the monomer in the presence of a dopant. However, as a result of further intensive research in order to increase the efficiency of using the processing liquid, we found that synthetic resin powder and granules were used as the conductive material. using
The powder or granules are dispersed in a non-solvent, brought into contact with a pyrrole-based monomer and an oxidative polymerization agent in the non-solvent, and the monomers are polymerized in the presence of a dopant to form a pyrrole-based polymer on the surface of the powder or granules. According to the method of forming a conductive composite powder by coating or impregnating part or all of the pyrrole-based polymer in the powder, the amount of the pyrrole-based monomer used is extremely minimal, and the yield is substantially 100%. %, a conductive composite synthetic resin powder consisting of a pyrrole polymer and a powder can be formed, and furthermore, unlike the conventional method, precipitation of the pyrrole polymer is hardly observed, and the pyrrole monomer With no waste,
The resulting conductive composite synthetic resin powder can be molded into products of various shapes, and products with excellent conductivity can be obtained.Moreover, these conductive composite resin powders can be used as conductive fillers. Even when it is kneaded into a resin and used, there is no risk that the conductivity imparted to the molded product obtained from this resin will be uneven, and it can be used not only as a filler for simply imparting conductivity. They have discovered that it can be effectively used as a filler to increase the weight and weight of products, and have completed the present invention. Specifically, one aspect of the present invention is a conductive material characterized in that the surface of the synthetic resin powder is coated with a pyrrole-based polymer, or the powder or granule is partially or entirely impregnated with a pyrrole-based polymer. This paper focuses on composite powder and granular materials. Another aspect of the present invention is to disperse synthetic resin powder in a non-solvent, bring it into contact with a pyrrole monomer and an oxidative polymerization agent in the non-solvent, and polymerize the monomer in the presence of a dopant. The gist of the present invention is a method for producing a conductive composite powder, which is characterized by obtaining a conductive composite powder consisting of a resin powder and a pyrrole polymer. The conductive composite powder of the present invention has a structure in which the surface of the powder is coated with a pyrrole polymer, or the surface of the powder is coated with a pyrrole polymer and the powder is coated with a pyrrole polymer. It has a structure in which part of the pyrrole-based polymer is impregnated, or it has a structure in which the pyrrole-based polymer is entirely impregnated in the powder body. The synthetic resin powder particles also include foamed particles and porous particles of synthetic resin. It is preferable that these powders and granules have surface porosity because the composite strength with the pyrrole polymer is increased and, as a result, durable conductivity can be obtained. The particle size of the synthetic resin powder is between 25 and 25, which can be used for molding such as injection, compression, extrusion, blow molding, and bead foam molding.
320 μm is preferred. The production method of the present invention involves dispersing synthetic resin powder in a non-solvent, and polymerizing the pyrrole monomer by bringing the powder into contact with a pyrrole monomer and an oxidative polymerization agent in the presence of a dopant in the non-solvent. The synthetic resin powder and the pyrrole polymer are composited together to obtain a conductive composite powder which is imparted with conductivity by the pyrrole polymer. Base resins for synthetic resin powder include polyvinyl alcohol, cellophane, cellulose ester,
Polyvinyl acetate, polyvinyl formal, polyvinyl butyral, polyvinyl chloride, polyvinylidene chloride, polyvinylidene fluoride, chlorinated polyethylene, polyethylene, polypropylene, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, polybutylene terephthalate,
6-nylon, 11-nylon, 12-nylon, 66
- Thermoplastic resins such as nylon, polymers of ionic electrolyte monomers, or copolymers of these monomers and other monomers are used alone or in combination. 6
- In the case of resins with high water absorption such as nylon, the pyrrole polymer tends to be almost completely impregnated into the resin particles, and in the case of resins with low water absorption such as polyvinyl chloride, The pyrrole polymer is likely to be formed so as to cover only the surface of the resin powder. Examples of pyrrole monomers include pyrrole, 3-methylpyrrole, N-
Examples include methylpyrrole. Water is used as a non-solvent to disperse the powder, but the surface of the powder is roughened to improve the adhesion of the pyrrole polymer to the surface of the powder and/or the impregnation into the powder. An organic solvent may be added for this purpose. Examples of organic solvents include aliphatic alcohols such as methanol and ethanol; aliphatic ketones such as acetone and methyl ethyl ketone; ethers such as diethyl ether and tetrahydrofuran; halogenated hydrocarbons such as methylene chloride and chloroform; ethyl acetate and acetic acid. Esters such as butyl; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as hexane; nitrogen-containing compounds such as acetonitrile and benzonitrile; dimethylformamide and mixtures thereof; Monomer from inside,
They are appropriately selected and used depending on the dopant, the oxidative polymerization agent, and the material of the powder. As the above-mentioned dopant, all commonly used acceptor dopants can be used. Acceptor dopants include halogens such as chlorine, bromine, and iodine; Lewis acids such as phosphorus pentafluoride; protonic acids such as hydrogen chloride and sulfuric acid; transition metal chlorides such as ferric chloride; silver perchlorate; Examples include transition metal compounds such as silver boron fluoride. As an oxidative polymerization agent, permanganic acid (salt) such as permanganic acid or potassium permanganate is used.
Chromic acids such as chromic trioxide; Nitrates such as silver nitrate; Halogens such as chlorine, bromine, and iodine;
Peroxides such as hydrogen peroxide and benzoyl peroxide; Peroxo acids and peroxo acid salts such as peroxodisulfuric acid and potassium peroxodisulfate; Oxygen acids and acid salts such as hypochlorous acid and potassium hypochlorite; Chloride Examples include transition metal chlorides such as ferric iron; metal oxides such as silver oxide. Among these oxidative polymerization agents, halogens, peroxo acids (salts), transition metal salt compounds, etc. act as dopants, so when these are used as oxidative polymerization agents, it is especially important to use other dopants together. Although not necessary, when used in combination with the above dopants, the conductivity can be further improved. An example of a method of dispersing the powder in a non-solvent and contacting it with a pyrrole monomer and an oxidative polymerization agent in the presence of a dopant is to disperse it in a non-solvent solution containing the monomer, an oxidative polymerization agent, and if necessary, a dopant. , a method of immersing, stirring and dispersing the powder before the monomer is substantially polymerized, and adding the powder to a non-solvent solution containing an oxidative polymerization agent and, if necessary, a dopant, and a non-solvent solution containing the monomer. A method of sequentially immersing the body and stirring and dispersing it,
Examples include a method in which the powder is immersed in a non-solvent solution containing an oxidative polymerization agent and, if necessary, a dopant, and then stirred and dispersed, and then the monomer is added to this solution. According to the method described above, the processing time can be shortened, but since the polymerization reaction of the pyrrole monomer is fast, it is necessary to immediately immerse the powder into the solution and disperse it after preparing the solution. If time elapses between immersing the body in the solution and dispersing it, the compositing of the powder and the pyrrole polymer tends to deteriorate, resulting in a decrease in conductivity. In addition, since oxidative polymerization agents have lower permeability into powder and granules than monomers, we adopt a method in which the treatment with a monomer-containing solution and the treatment with an oxidative polymerization agent-containing solution are performed separately, as in the method of . After immersing and dispersing the powder in a solution containing an oxidative polymerization agent for about 20 minutes to 1 hour, it is preferable to contact it with a pyrrole-based monomer. By improving the degree of impregnation of the polymer into the powder, more durable conductivity is imparted. The temperature of the treatment liquid when dispersing the powder in a non-solvent is preferably from 0 to 40°C, particularly preferably from 0 to 5°C, in order to further improve the imparted conductivity.
In addition, the processing time for powder and granules depends on the resin material of the powder and granules.
Although it varies depending on the desired degree of conductivity and the concentration of monomer and oxidative polymerization agent, it is usually 1 minute to
It takes about 3 hours. [Example] Hereinafter, the present invention will be explained in more detail with reference to Examples. Example 1 1000 g of polyvinyl chloride resin particles (degree of polymerization 800, particle size 50 to 100 μm) was placed in the round bottom flask of Example 1 5, and 0.2 M ferric chloride aqueous solution 2 was added and stirred to disperse the resin particles. , and cooled until the temperature reached 2-3°C. Next, stirring was continued for 30 minutes at the same temperature, and then 400 ml of a 0.2M pyrrole monomer aqueous solution was added, and the mixture was further maintained at 2 to 3°C and vigorously stirred for 1 hour. This dispersion was filtered, thoroughly washed with distilled water, and then dried at 50°C to obtain gray resin particles. As a result of observing the resin particles using an electron microscope, it was found that no particles with a size of 50 μm or less were observed, and that only pyrrole polymer was not produced. Furthermore, the resin particles were filled into a container with a volume of 21.1 ml, and the resistance value between the electrodes (5.85 cm) was measured with a tester, and the result was 1.6×10 4 Ω, indicating excellent conductivity. Furthermore, a film with a thickness of 0.1 mm was formed using these resin particles, and the surface resistance value and visible light transmittance of this sheet were measured, and the results were 3 x 10 3 Ω/cm.
(25℃, 50%RH), the desired conductivity is 40%,
It had transparency. Note that the surface resistance value is a value measured using a high resistance meter, and the visible light transmittance is an integral value of a value measured at 400 to 800 nm using a spectrophotometer. Examples 2 to 5 The resin particles shown in Table 1 were treated in the same manner as in Example 1 to obtain gray resin particles. As a result of observing the resin particles using an electron microscope, it was found that the pyrrole polymer was impregnated into the resin particles. The resistance value of the resin particles was measured in the same manner as in Example 1, and the results are shown in Table 1. Example 6 Pyrrole monomer aqueous solution concentration from 0.2M to 0.4M
The same resin particles as in Example 1 were treated in the same manner except that black resin particles were obtained. The resistance value of the resin particles was measured in the same manner as in Example 1 and was found to be 2×10 3 Ω. In addition, a film with a thickness of 0.1 mm was formed using these resin particles, and the surface resistance value and visible light transmittance of this film were measured in the same manner as in Example 1. As a result, they were each 1.2 × 10 3 Ω/cm.
(25°C, 50%RH) and 32%. Comparative Example 1 A polyvinyl chloride film wound into a roll with a thickness of 0.1 mm x width of 20 cm x length of 500 cm was immersed for 30 minutes in the 0.2 M ferric chloride aqueous solution of 2 kept at 2 to 3°C. 400 ml of 0.2M pyrrole monomer aqueous solution was added to this solution, stirred vigorously, and maintained for 1 hour. Next, the film was taken out, washed with distilled water, dried at 50°C , and the surface resistance and visible light transmittance of the film were measured in the same manner as in Example 1. 50%RH),
However, the incorporation of the pyrrole polymer into the polyvinyl chloride film was 1.5%, which was extremely poor.
以上説明したように本発明の導電性複合粉粒体
は合成樹脂粉粒体の表面をピロール系重合体が被
覆しているか、あるいは粉粒体内にピロール系重
合体の一部又は全部が含浸された構成を有するこ
とにより優れた導電性を有するとともに本発明の
導電性複合粉粒体は成形することにより優れた導
電性を有する任意の形状の成形体を容易に得るこ
とができる。また本発明の導電性複合粉粒体は導
電性充填剤等として用いることができ、本発明導
電性複合粉粒体は樹脂への分散性が良いため、導
電性充填剤として樹脂に添加して用いた場合でも
均一な導電性を付与できるとともに、粉粒体の当
初の性能を損うことなく導電化されているため、
粉粒体が従来より使用されている用途にそのまま
適用でき、例えば導電性を有する増量材、軽量化
材等として有効に有利し得るため、従来のように
導電性充填剤とともに増量材、軽量化材を併用す
る必要がなく、増量材、軽量化材の併用による従
来の欠点を全て解消できる。また導電性充填剤と
して樹脂等に添加して用いる場合、充填剤を添加
すべき樹脂と相溶性のある樹脂等よりなる粉粒体
にピロール処理した導電性複合粉粒体を用いれ
ば、カーボンブラツク等を使用する場合のように
機械的強度を低下させる慮れがない。
また本発明方法は合成樹脂粉粒体を非溶媒中に
分散し、該非溶媒中でピロール系モノマーと酸化
重合剤とに接触せしめてドーパントの存在下にピ
ロール系モノマーを重合せしめてピロール系重合
体と合成樹脂粉粒体とからなる複合体を形成し、
ピロール系重合体により導電性を付与する方法を
採用したから、確実かつ容易に導電性複合粉粒体
を製造することができる。また本発明方法はピロ
ール系モノマーの使用量がきわめて少なくとも高
収率で優れた導電性複合粉粒体を得ることがで
き、しかもピロール系モノマーのむだが少なく効
率よい製造を行ない得る。更に本発明方法では粉
粒体が透明な樹脂よりなる場合でも、樹脂の透明
性をほとんど損うことなく導電性を付与すること
ができ、得られた導電性複合粉粒体を成形して得
たシート、フイルム等は透明性の高いものとなる
等の種々の効果を有する。
As explained above, in the conductive composite powder of the present invention, the surface of the synthetic resin powder is coated with a pyrrole-based polymer, or a part or all of the pyrrole-based polymer is impregnated into the powder. The conductive composite powder of the present invention can be molded to easily obtain a molded article of any shape having excellent conductivity. Furthermore, the conductive composite powder of the present invention can be used as a conductive filler, etc. Since the conductive composite powder of the present invention has good dispersibility in resin, it can be added to resin as a conductive filler. Even when used, uniform conductivity can be imparted, and it is made conductive without impairing the original performance of the powder or granule.
Powder and granules can be used as they are for conventional purposes, and can be effectively used as electrically conductive fillers, weight-reducing materials, etc. There is no need to use materials together, and all the drawbacks of the conventional methods of using bulking materials and lightweighting materials in combination can be overcome. In addition, when used as a conductive filler by adding it to a resin, etc., if a conductive composite powder made of a resin, etc. that is compatible with the resin to which the filler is added is used, and a conductive composite powder is treated with pyrrole, carbon black can be used. There is no possibility of reducing the mechanical strength as in the case of using In addition, the method of the present invention involves dispersing synthetic resin powder in a non-solvent, bringing it into contact with a pyrrole-based monomer and an oxidative polymerization agent in the non-solvent, and polymerizing the pyrrole-based monomer in the presence of a dopant to form a pyrrole-based polymer. and synthetic resin powder, forming a composite consisting of
Since the method of imparting conductivity using a pyrrole polymer is adopted, conductive composite powder can be produced reliably and easily. In addition, the method of the present invention can produce excellent conductive composite powder at a high yield even when the amount of pyrrole monomer used is extremely low, and moreover, it can be produced efficiently with less waste of the pyrrole monomer. Furthermore, in the method of the present invention, even when the powder is made of a transparent resin, conductivity can be imparted without substantially impairing the transparency of the resin, and the resulting conductive composite powder can be molded. Sheets, films, etc., obtained by this method have various effects such as being highly transparent.
Claims (1)
覆されているか、あるいは粉粒体内にピロール系
重合体の一部又は全部が含浸されていることを特
徴とする導電性複合粉粒体。 2 合成樹脂粉粒体を非溶媒中に分散させ、該非
溶媒中でピロール系モノマーと酸化重合剤とに接
触せしめ、ドーパントの存在下に前記モノマーを
重合せしめて合成樹脂粉粒体とピロール系重合体
とからなる導電性の付与された複合粉粒体を得る
ことを特徴とする導電性複合粉粒体の製造方法。[Scope of Claims] 1. A conductive material characterized in that the surface of the synthetic resin powder is coated with a pyrrole-based polymer, or the powder or granule is partially or entirely impregnated with a pyrrole-based polymer. Composite powder. 2 The synthetic resin powder is dispersed in a non-solvent, brought into contact with a pyrrole-based monomer and an oxidative polymerization agent in the non-solvent, and the monomer is polymerized in the presence of a dopant to form the synthetic resin powder and the pyrrole-based polymer. 1. A method for producing a conductive composite powder, the method comprising obtaining a conductive composite powder consisting of:
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6949086 | 1986-03-27 | ||
JP61-69490 | 1986-03-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6310685A JPS6310685A (en) | 1988-01-18 |
JPH0360873B2 true JPH0360873B2 (en) | 1991-09-18 |
Family
ID=13404199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24252686A Granted JPS6310685A (en) | 1986-03-27 | 1986-10-13 | Conductive composite particulate matter and production of same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6310685A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0757699B2 (en) * | 1987-12-24 | 1995-06-21 | 株式会社リコー | Method for producing composite of conductive polymer material |
JPH02273407A (en) * | 1989-04-14 | 1990-11-07 | Japan Carlit Co Ltd:The | Conductive grains and manufacture thereof |
EP2021396B1 (en) * | 2006-05-18 | 2011-07-27 | University of Florida Research Foundation, Inc. | Catalyst free polymerization of 3,4-alkylenedioxypyrrole and 3,4-alkylenedioxyfuran |
CN103119088B (en) * | 2010-09-28 | 2014-12-17 | 积水化成品工业株式会社 | Coloring resin particles, and production method and uses therefor |
JP2012072261A (en) * | 2010-09-28 | 2012-04-12 | Sekisui Plastics Co Ltd | Production method for coloring resin particles, and coloring resin particles obtained by the production method |
JP5603726B2 (en) * | 2010-09-28 | 2014-10-08 | 積水化成品工業株式会社 | Colored resin particles and uses thereof |
JP6653854B1 (en) * | 2019-07-10 | 2020-02-26 | 宮川ローラー株式会社 | Conductive rubber |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55133455A (en) * | 1979-02-16 | 1980-10-17 | Eastman Kodak Co | Coating composition and its manufacture |
US4521450A (en) * | 1982-06-22 | 1985-06-04 | Asea Aktiebolag | Method of increasing the electrical conductivity of cellulose-based materials or other impregnable materials |
-
1986
- 1986-10-13 JP JP24252686A patent/JPS6310685A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55133455A (en) * | 1979-02-16 | 1980-10-17 | Eastman Kodak Co | Coating composition and its manufacture |
US4521450A (en) * | 1982-06-22 | 1985-06-04 | Asea Aktiebolag | Method of increasing the electrical conductivity of cellulose-based materials or other impregnable materials |
Also Published As
Publication number | Publication date |
---|---|
JPS6310685A (en) | 1988-01-18 |
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