JPH0359928A - Gas discharge display element and its manufacture - Google Patents
Gas discharge display element and its manufactureInfo
- Publication number
- JPH0359928A JPH0359928A JP1195920A JP19592089A JPH0359928A JP H0359928 A JPH0359928 A JP H0359928A JP 1195920 A JP1195920 A JP 1195920A JP 19592089 A JP19592089 A JP 19592089A JP H0359928 A JPH0359928 A JP H0359928A
- Authority
- JP
- Japan
- Prior art keywords
- press
- bulkhead
- display element
- gas discharge
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000465 moulding Methods 0.000 claims abstract description 33
- 239000010409 thin film Substances 0.000 claims abstract description 13
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 3
- 229910052702 rhenium Inorganic materials 0.000 claims abstract description 3
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 25
- 238000005192 partition Methods 0.000 claims description 25
- 230000004888 barrier function Effects 0.000 claims description 12
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 13
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 5
- 239000000126 substance Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 27
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 229910002090 carbon oxide Inorganic materials 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910001948 sodium oxide Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- 229910000600 Ba alloy Inorganic materials 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical class [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910000820 Os alloy Inorganic materials 0.000 description 1
- 229910000691 Re alloy Inorganic materials 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- DYCKMDCRYZZTOV-UHFFFAOYSA-N [Os].[Ir].[Pt] Chemical compound [Os].[Ir].[Pt] DYCKMDCRYZZTOV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、高輝度、高精細度なガラス放電表示素子(プ
ラズマデイスプレィパネル)及びその製造方法並びにそ
の方法に用いるプレス成形用金型に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a high-luminance, high-definition glass discharge display element (plasma display panel), a method for manufacturing the same, and a press molding die used in the method.
従来の技術
従来、ガス放電表示素子(プラズマデイスプレィパネル
)において、2枚のガラスパネルの間に表示セル空間を
間仕切る隔壁はスクリーン印刷と呼ばれる厚膜印刷法で
形成されていたが、この方法では300ミクロン以上の
高さの隔壁を超精密なパターンで形成することが困難で
あった。Conventional technology Conventionally, in gas discharge display elements (plasma display panels), the partition wall that partitions the display cell space between two glass panels was formed by a thick film printing method called screen printing. However, it is difficult to form partition walls with a height of 300 microns or more in an ultra-precise pattern.
スクリーン印刷法はマスクパターンを張りつけたメツシ
ュ状スクリーンからペースト状隔壁材料をスキージによ
っておしだしてガラスパネルに印刷する。現在のスクリ
ーン印刷では最小線幅は100逅クロン、高さは20ξ
クロンが限界であり、それ以上の高さを得るためには、
プロセスを繰り返す必要があるが、プロセスの繰り返し
によって超精密な隔壁の形状がくずれる、あるいは乾燥
、焼成、焼鈍等の数多くの生産工程が必要であるという
問題点があった。(例えば、特公昭62278727号
公報)
発明が解決しようとする課題
従来のフルカラーのガス放電表示素子において、高精細
度のパターンをスクリーン印刷で形成した場合、パター
ンの位置ずれ、にしみ、だれ等が起るため、高精細度の
パターンの重ね合せによる多層化ができず、300ξク
ロンより高い隔壁を300ミクロンピッチでスクリーン
印刷で形成することができないという問題点があった。In the screen printing method, a paste-like barrier rib material is squeezed out with a squeegee from a mesh-like screen on which a mask pattern is pasted, and printed onto a glass panel. In current screen printing, the minimum line width is 100cm and the height is 20ξ.
Kron is the limit, and in order to obtain higher heights,
It is necessary to repeat the process, but there are problems in that the ultra-precise shape of the partition walls is distorted by repeating the process, or that numerous production steps such as drying, firing, annealing, etc. are required. (For example, Japanese Patent Publication No. 62278727) Problems to be Solved by the Invention When a high-definition pattern is formed by screen printing in a conventional full-color gas discharge display element, misalignment of the pattern, staining, dripping, etc. Therefore, there was a problem in that multi-layering by overlapping high-definition patterns was not possible, and barrier ribs higher than 300ξcm could not be formed by screen printing at a pitch of 300 microns.
本発明は、少なくとも300ミクロンより高い隔壁を高
精細度のパターンで形成した放電空間を有したガス放電
表示素子を得ることを目的としており、さらに300ミ
クロンより高い隔壁を高精細度のパターンで形成できる
製造方法及びプレス成形用金型を提供することを目的と
している。An object of the present invention is to obtain a gas discharge display element having a discharge space in which barrier ribs higher than 300 microns are formed in a high-definition pattern, and further, barrier ribs higher than 300 microns are formed in a high-definition pattern. The purpose of the present invention is to provide a manufacturing method and a press molding die that can be used.
課題を解決するための手段
本発明は前記目的を達成するために、本発明のガス放電
表示素子においては、少なくとも300ξクロンより高
い隔壁によって放電空間が形成されたものである。Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides a gas discharge display element in which a discharge space is formed by a partition wall having a height of at least 300ξcm.
少なくとも300ミクロンより高い隔壁をプレス成形用
金型により熱間でプレス成形する製造方法により比較的
長ギャンプの放電空間を形成することが可能となる。プ
レス成形に用いるプレス成形用金型は、所望の隔壁形状
および鏡面状に加工され、かつ化学的に安定な薄膜で被
覆されたものである。By the manufacturing method of hot press-forming the barrier ribs having a height of at least 300 microns using a press-forming die, it is possible to form a discharge space with a relatively long gap. The press mold used for press molding is processed into a desired partition wall shape and mirror finish, and is coated with a chemically stable thin film.
作用
ガス放電表示素子の放電空間が300ミクロンより高い
隔壁によって間仕切ると、放電開始電圧Vsが気体圧力
pと電極間隔長dの積pdの関数となるというパッシェ
ンの法則から、電極間隙長dが大きくなると気体圧力p
が小さくなる。気体圧力pが小さくなり電極間隙長dが
大きくなると、グロー放電の陽光柱が現れ、プラズマ中
の原子は電子によって衝突励起され、それが下のエネル
ギー準位に遷移する際に可視光や紫外線領域の電磁波を
放射する。When the discharge space of the working gas discharge display element is partitioned by partition walls higher than 300 microns, from Paschen's law that the discharge starting voltage Vs becomes a function of the product pd of the gas pressure p and the electrode gap length d, the electrode gap length d is As it increases, the gas pressure p
becomes smaller. When the gas pressure p decreases and the electrode gap length d increases, a positive column of glow discharge appears, atoms in the plasma are excited by collision with electrons, and when they transition to a lower energy level, they emit light in the visible and ultraviolet regions. radiates electromagnetic waves.
フルカラー表示を行うには希ガス原子の紫外線放射によ
り螢光体を励起発光させることが一般的であるが、発光
効率が小さいために低輝度である。In order to display full color, it is common to excite a phosphor to emit light using ultraviolet radiation from rare gas atoms, but the luminance is low due to low luminous efficiency.
これに対して低気圧のグロー放電陽光柱では水銀の基底
準位に関連した紫外線(185nm、253.7nm)
、とりわけ253.7nmを強く放射し、水銀の紫外線
励起に適合したフォトルミネセンス用螢光体が使用でき
、また低圧領域のため放射された紫外線の再吸収が少な
いために、発光効率が大きく高輝度である。On the other hand, in the glow discharge positive column of low pressure, ultraviolet rays (185 nm, 253.7 nm) related to the ground level of mercury
In particular, photoluminescent phosphors that emit strongly at 253.7 nm and are compatible with ultraviolet excitation of mercury can be used, and since the emitted ultraviolet rays are not reabsorbed because of the low pressure region, the luminous efficiency is greatly increased. It is brightness.
少なくとも300ミクロンより高い隔壁はプレス成形用
金型により熱間でプレス成形することにより製造するこ
とができる。プレス成形に用いるプレス成形用金型は、
所望の隔壁形状および鏡面状に加工され、かつ化学的に
安定な薄膜で被覆されたものであり、プレス成形用金型
の母材としては、例えば超硬合金、サーメット、ジルコ
ニア。Partition walls higher than at least 300 microns can be manufactured by hot press molding using a press mold. The press molding mold used for press molding is
It is processed into a desired partition wall shape and mirror finish, and is coated with a chemically stable thin film. Examples of the base material of the press molding die include cemented carbide, cermet, and zirconia.
炭化珪素、窒化珪素、ステンレス鋼等が適しており、ま
た、プレス成形用金型の母材に被覆する薄膜は、ガラス
と反応あるいは融着しない貴金属、タングステン、タン
タル、レニウム、ハフニウムの単体あるいはそれらの合
金であることが望ましい。Silicon carbide, silicon nitride, stainless steel, etc. are suitable, and the thin film that coats the base material of the press molding die is made of noble metals that do not react or fuse with glass, tungsten, tantalum, rhenium, hafnium, or any of them. It is desirable to be an alloy of.
本発明において、ガラスとこれらの薄膜とが反応あるい
は融着しないより好ましい成形雰囲気は、窒素、アルゴ
ン、ヘリウム等の不活性ガス、およびこれらの不活性ガ
スに水素、あるいは−酸化炭素、二酸化炭素の炭素酸化
物、メタン、エタン。In the present invention, a more preferable molding atmosphere in which the glass and these thin films do not react or fuse together is an inert gas such as nitrogen, argon, helium, etc., and hydrogen, carbon oxide, or carbon dioxide added to these inert gases. Carbon oxides, methane, ethane.
エチレン、トルエン等の炭化水素類、トリクロロエチレ
ン、トリクロルトリフルオルエタン等のハロゲン化炭化
水素類、エチレングリコール、グリセリン等のアルコー
ル類、F−113,F−11等のフルオロカーボン類を
適宜混合したものである。It is a mixture of hydrocarbons such as ethylene and toluene, halogenated hydrocarbons such as trichloroethylene and trichlorotrifluoroethane, alcohols such as ethylene glycol and glycerin, and fluorocarbons such as F-113 and F-11. .
これらの雰囲気は、ガラス組成、プレス成形用金型に被
覆する薄膜組成、プレス成形の温度と時間、あるいは隔
壁の形状等の条件によって適宜選択する。These atmospheres are appropriately selected depending on conditions such as the glass composition, the composition of the thin film coated on the press-molding mold, the temperature and time of press-molding, and the shape of the partition walls.
実施例
以下本発明の一実施例について、図面を用いて、詳細に
説明する。EXAMPLE Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
実施例1
第1図は本発明の一例として隔壁の形成方法を示したも
のであり、第2図は前記方法によるガス放電表示素子の
構成図であり、第3図はプレス或形用金型の断面図であ
る。プレス成形用金型の母材として超硬合金(WC−5
TiC−8Co)のブロックを第3図の形状にワイヤー
放電加工した。Example 1 FIG. 1 shows a method for forming partition walls as an example of the present invention, FIG. 2 is a block diagram of a gas discharge display element formed by the method, and FIG. 3 shows a press or mold. FIG. Cemented carbide (WC-5) is used as the base material for press molds.
A block of TiC-8Co) was wire electrical discharge machined into the shape shown in FIG.
プレス成形面をさらに超微細なダイヤモンド粉末を用い
て、約1時間で表面の表面粗さ(RMS)が約30人の
鏡面にした。鏡面となったプレス成形用金型に、スパッ
タ法で白金−イリジウム−オスミウム合金(Pt−1r
−Os)の薄膜を被覆した。The press-molded surface was further made into a mirror surface with a surface roughness (RMS) of about 30 in about 1 hour using ultrafine diamond powder. Platinum-iridium-osmium alloy (Pt-1r
-Os) was coated with a thin film.
背面板1(ソーダ石英ガラス)にNiのカソード電極2
を厚膜印刷で形成した。隔壁用材料として、酸化鉛系ガ
ラス、例えばシリカ(SiO2)52重量パーセント、
酸化カリウム(K2O)6重量パーセント、酸化鉛(p
b○)35重量パーセント、酸化ナトリウム(Na20
)5重量パーセント、残部が微量成分のガラスを用いた
。平板5、下型3(肉厚1mm)、ガラス薄板4、平型
5の順序ではさみ込み、下型3のスリット状の間隔にガ
ラスを押し込んだ。次に平型5をとりのぞいて上記の下
型3を反転させ、下型3を背面板1に押し当てて上型6
によりプレス成形し゛て隔壁7を背面板lに転写し、背
面板1上に隔壁7(高さ0.7mm)を形成した。なお
りソード電極2と下型3とが接触してカソード電極2が
変形しないように、下型3には切り欠き部を設けである
。Ni cathode electrode 2 on back plate 1 (soda quartz glass)
was formed by thick film printing. As a partition wall material, lead oxide glass such as 52% by weight of silica (SiO2),
Potassium oxide (K2O) 6% by weight, lead oxide (p
b○) 35% by weight, sodium oxide (Na20
) 5% by weight, the remainder being trace components. The flat plate 5, the lower mold 3 (thickness: 1 mm), the thin glass plate 4, and the flat mold 5 were sandwiched in this order, and the glass was pushed into the slit-like spaces of the lower mold 3. Next, remove the flat mold 5, invert the lower mold 3, press the lower mold 3 against the back plate 1, and press the upper mold 3.
The partition walls 7 were transferred to the back plate 1 by press molding, and the partition walls 7 (height: 0.7 mm) were formed on the back plate 1. In order to prevent the cathode electrode 2 from being deformed due to contact between the cathode electrode 2 and the lower mold 3, a notch is provided in the lower mold 3.
プレス成形の条件は、金型温度510″c1プレス圧力
10kg/cIIl、プレス時間1分、窒素ガス雰囲気
中であり、プレス成形後300°Cまで徐冷した。The press molding conditions were as follows: mold temperature: 510''c, press pressure: 10 kg/cIIl, press time: 1 minute, in a nitrogen gas atmosphere, and after press molding, it was slowly cooled to 300°C.
第2図において前面板11の対向面側には、アノード電
極12と螢光体13が形成されている。In FIG. 2, an anode electrode 12 and a phosphor 13 are formed on the opposite side of the front plate 11.
アノード電極12はBa合金を、螢光体13は(Gd、
Y)BO2:Eu(赤色) 、Zn2SiO4:Mn(
緑色)、B a M g A f u Oa : E
u (青色)を用い、所定の間隔でスクリーン印刷し4
50°Cで坑底した。前面板11と背面板1とをガラス
フリットによって接合し、周知の方法で真空排気後、ガ
ス放電表示素子内に放電ガスとしてヘリウム(He)9
9重重量、キセノン(Xe)0.9重量%、水銀(Hg
)0.1重量%の混合ガスを30Torr+7)圧力に
なるまで導入した。The anode electrode 12 is made of Ba alloy, and the phosphor 13 is made of (Gd,
Y) BO2:Eu (red), Zn2SiO4:Mn(
green), B a M g A f u Oa: E
Screen print using u (blue) at predetermined intervals 4
The bottom of the hole was reached at 50°C. The front plate 11 and the back plate 1 are bonded together using a glass frit, and after evacuation using a well-known method, helium (He) 9 is added as a discharge gas into the gas discharge display element.
9wt, xenon (Xe) 0.9wt%, mercury (Hg
) 0.1% by weight of mixed gas was introduced until the pressure reached 30 Torr+7).
誘電体層16と背面板1との間に設けたトリガー電極1
7とアノード電極12との間に250ボルトを印加して
放電させると、アノード電極12の近傍に荷電粒子が集
まるために放電しやす(なり、30ボルトの駆動回路で
ガス放電表示素子を動作させることができた。放電空間
にはプラズマ放電15に伴う紫外線14が放射され、紫
外線14が螢光体13を励起発光させた。このようにし
て動作させたガス放電表示素子の輝度は約150fLと
いう優れた結果が得られた。また多数の均質な隔壁7を
シャープなパターンで形成することができ、表示セル間
のクロストークがなく、確実な放電を行わせることがで
きた。Trigger electrode 1 provided between dielectric layer 16 and back plate 1
When 250 volts are applied between 7 and the anode electrode 12 to cause a discharge, charged particles gather near the anode electrode 12 and the discharge tends to occur. The ultraviolet rays 14 accompanying the plasma discharge 15 were emitted into the discharge space, and the ultraviolet rays 14 excited the phosphor 13 to emit light.The luminance of the gas discharge display element operated in this manner was approximately 150 fL. Excellent results were obtained. Also, a large number of homogeneous barrier ribs 7 could be formed in a sharp pattern, there was no crosstalk between display cells, and reliable discharge could be performed.
実施例2
第4図は本発明の一例として隔壁の形成方法を示したも
のであり、第5図は前記方法によるガス放電表示素子の
構成図である。プレス成形用金型の母材としてサーメッ
ト(T i C−10M o−9N i)のブロックを
第3図の形状にワイヤー放電加工した。プレス成形面を
さらに超微細なダイヤモンド粉末を用いて、約1時間で
表面の表面粗さ(RMS)が約30人の鏡面にした。鏡
面となったプレス成形用金型に、スパッタ法で白金−タ
ンクルーレニウム合金(Pt−Ta−Re)の薄膜を被
覆した。Embodiment 2 FIG. 4 shows a method of forming barrier ribs as an example of the present invention, and FIG. 5 is a block diagram of a gas discharge display element according to the method. A block of cermet (T i C-10Mo-9N i) was wire electrical discharge machined into the shape shown in FIG. 3 as a base material for a press mold. The press-molded surface was further made into a mirror surface with a surface roughness (RMS) of about 30 in about 1 hour using ultrafine diamond powder. The mirror-finished press mold was coated with a thin film of platinum-tank rhenium alloy (Pt-Ta-Re) by sputtering.
前面板11(ソーダ石英ガラス)に隔壁用材料を膜厚2
肋の厚膜を形成した。隔壁用材料として、シ!J力(S
iO2)65重量パーセント、酸化カリウム(K2O)
9重量パーセント、ホウ酸(B203)10重量パーセ
ント、酸化ナトリウム(Na20)10重量パーセント
、残部が微量成分からなるホウケイ酸ガラスを用いた。The thickness of the partition wall material is 2 on the front plate 11 (soda quartz glass).
A thick membrane formed on the ribs. As a material for bulkheads, Shi! J force (S
iO2) 65% by weight, potassium oxide (K2O)
A borosilicate glass containing 9% by weight, 10% by weight of boric acid (B203), 10% by weight of sodium oxide (Na20), and the balance being trace components was used.
隔壁用材料を被覆した前面板11を上型6によりプレス
成形して、前面板11上に隔壁7(高さ1.5mm)を
形成した。プレス成形の条件は、金型温度610°C1
プレス圧力10kg/c+Il、プレス時間1分、アル
ゴンガス雰囲気中であり、プレス成形後350°Cまで
徐冷した。The front plate 11 coated with the partition wall material was press-molded using the upper die 6 to form the partition wall 7 (height: 1.5 mm) on the front plate 11. Press molding conditions are mold temperature 610°C1
The press pressure was 10 kg/c+Il, the press time was 1 minute, and the press was in an argon gas atmosphere, and after press molding, it was gradually cooled to 350°C.
隔壁7を形成した前面板11上にマスクパター\ ンを使用してスプレー法で螢光体I3を塗布した。A mask pattern is placed on the front plate 11 on which the partition wall 7 is formed. Fluorescent material I3 was applied by spray method using a spray gun.
螢光体13は(Gd、Y)BO2:Eu(赤色)、Ba
A/!120.:Mn(緑色)、BaMgAl u O
a :Eu(青色)を用い、所定の間隔でスクリーン印
刷し450°Cで燃焼酸した。The phosphor 13 is (Gd, Y)BO2:Eu (red), Ba
A/! 120. :Mn (green), BaMgAl u O
a: Using Eu (blue), screen printing was performed at predetermined intervals, and combustion acid was applied at 450°C.
一方、第5図に示したように背面板1上には行電極22
と列電極24とが誘電体層23を介して直交した状態で
設けである。これらの電極の上には誘電体層21が、さ
らにその上にはMgOの保護膜(図示せず)を設けた。On the other hand, as shown in FIG.
The column electrodes 24 and 24 are provided so as to be orthogonal to each other with the dielectric layer 23 interposed therebetween. A dielectric layer 21 was provided on these electrodes, and an MgO protective film (not shown) was further provided thereon.
これらの電極、誘電体層、保護膜は印刷法、蒸着法ある
いはスパッタ法によって形成することができる。These electrodes, dielectric layers, and protective films can be formed by printing, vapor deposition, or sputtering.
このような方法で作製した前面板11と背面板1とをガ
ラスフリットによって接合し、周知の方法で真空排気後
、ガス放電表示素子内に放電ガスとしてヘリウム(He
)99重量%、キセノン(Xe)1重量%の混合ガスを
l QTo r rの圧力になるまで導入した。The front plate 11 and the back plate 1 manufactured by this method are joined together using a glass frit, and after evacuation by a well-known method, helium (He) is introduced as a discharge gas into the gas discharge display element.
A mixed gas of 99% by weight) and 1% by weight of xenon (Xe) was introduced until the pressure reached 1QTorr.
行電極22と列電極24には、それぞれ位相が反転した
150ポルトの高周波パルスが印加されて、ガス放電表
示素子を動作させることができた。High frequency pulses of 150 ports with opposite phases were applied to the row electrodes 22 and the column electrodes 24, respectively, to operate the gas discharge display element.
1
放電空間にはプラズマ放電15に伴う紫外線14が放射
され、紫外線14が螢光体13を励起発光させた。この
ようにして動作させたガス放電表示素子の輝度は約13
0fLという優れた結果が得られた。また多数の均質な
隔壁7をシャープなパターンで形成することができ、表
示セル間のクロストークがなく、確実な放電を行わせる
ことができた。1 Ultraviolet rays 14 accompanying plasma discharge 15 were emitted into the discharge space, and the ultraviolet rays 14 excited the phosphor 13 to emit light. The luminance of the gas discharge display element operated in this manner was approximately 13
An excellent result of 0 fL was obtained. Furthermore, a large number of homogeneous partition walls 7 could be formed in a sharp pattern, and there would be no crosstalk between display cells, allowing reliable discharge to occur.
なお本発明のガス放電表示素子及びその製造方法並びに
その方法に用いるプレス成形用金型は、ガス放電表示素
子においては、少なくとも300ξクロンより高い隔壁
によって放電空間が形成されたものであり、少なくとも
300ミクロンより高い隔壁をプレス成形用金型により
熱間でプレス成形する製造方法により比較的長ギャップ
の放電空間を形成することが可能となる。プレス成形に
用いるプレス成形用金型は、所望の隔壁形状および鏡面
状に加工され、かつ化学的に安定な薄膜で被覆されたも
のであることを特徴とするものであり、成形の雰囲気、
ガラス組成、プレス成形用金2
型に被覆する薄膜組成、プレス成形の温度と時間、ある
いはガラス層の膜厚等の条件は本実施例に限定されるも
のではない。The gas discharge display element of the present invention, the method for manufacturing the same, and the press-molding mold used in the method are those in which a discharge space is formed by partition walls that are higher than at least 300 ξcm. By using a manufacturing method in which barrier ribs with a height of more than a micron are hot press-formed using a press-forming die, it is possible to form a discharge space with a relatively long gap. The press molding mold used for press molding is characterized by being processed into a desired partition wall shape and mirror finish, and coated with a chemically stable thin film,
Conditions such as the glass composition, the composition of the thin film coated on the press molding die 2, the temperature and time of press molding, and the thickness of the glass layer are not limited to those in this example.
発明の詳細
な説明したように、本発明のガス放電表示素子及びその
製造方法並びにその方法に用いるプレス成形用金型は、
ガス放電表示素子においては、少なくとも300旦クロ
ンより高い隔壁によって放電空間が形成されたものであ
り、少なくとも300ミクロンより高い隔壁をプレス成
形用金型により熱間でプレス成形することにより、長ギ
ャップの放電空間を形成することが可能となる。As described in detail, the gas discharge display element of the present invention, the method for manufacturing the same, and the press molding die used in the method include:
In a gas discharge display element, a discharge space is formed by barrier ribs higher than at least 300 μm, and a long gap is formed by hot press-forming the barrier ribs higher than at least 300 μm using a press mold. It becomes possible to form a discharge space.
すなわち、本発明によって高輝度、高精細度なガス放電
表示素子の大量生産が可能になった。That is, the present invention has made it possible to mass-produce high-luminance, high-definition gas discharge display elements.
第1図は本発明の一例として隔壁の形成方法を示した工
程図、第2図は前記方法によるガス放電表示素子の構成
図、第3図はプレス成形用金型の断面図、第4図は本発
明の一例として隔壁の形成方法を示した工程図、第5図
は前記方法によるガス放電表示素子の構成図である。
1・・・・・・背面板、2・・・・・・カソード電極、
3・・・・・・下型、4・・・・・・ガラス薄板、5・
・・・・・平型、6・・・・・・上型、7・・・・・・
隔壁、11・・・・・・前面板、12・・・・・・アノ
ード電極、13・・・・・・螢光体、14・・・・・・
紫外線、15・・・・・・プラズマ放電、16・・・・
・・誘電体層、17・・・・・・トリガー電極、21・
・・・・・誘電体層、22・・・・・・行電極、23・
・・・・・誘電体層、24・・・・・・列電極。FIG. 1 is a process diagram showing a method for forming partition walls as an example of the present invention, FIG. 2 is a configuration diagram of a gas discharge display element according to the method, FIG. 3 is a cross-sectional view of a press molding die, and FIG. 4 5 is a process diagram showing a method for forming barrier ribs as an example of the present invention, and FIG. 5 is a diagram showing the configuration of a gas discharge display element according to the method. 1... Rear plate, 2... Cathode electrode,
3...Lower mold, 4...Thin glass plate, 5.
...Flat type, 6...Top type, 7...
Partition wall, 11... Front plate, 12... Anode electrode, 13... Fluorescent material, 14...
Ultraviolet light, 15...Plasma discharge, 16...
...Dielectric layer, 17...Trigger electrode, 21.
... Dielectric layer, 22 ... Row electrode, 23.
...Dielectric layer, 24...Column electrode.
Claims (4)
放電空間が形成されたガス放電表示素子。(1) A gas discharge display element in which a discharge space is formed by barrier ribs having a height of at least 300 microns.
したガス放電表示素子の製造方法。(2) A method for manufacturing a gas discharge display element in which partition walls are hot press-molded using a press-molding die.
状に加工され、かつ化学的に安定な薄膜で被覆されたプ
レス成形用金型。(3) A press molding die processed into a desired partition wall shape and mirror finish, and coated with a chemically stable thin film.
ム、ハフニウムの単体あるいはそれらの合金である請求
項(3)記載のプレス成形用金型。(4) The press molding die according to claim (3), wherein the thin film is made of a noble metal, tungsten, tantalum, rhenium, or hafnium, or an alloy thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1195920A JPH0359928A (en) | 1989-07-27 | 1989-07-27 | Gas discharge display element and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1195920A JPH0359928A (en) | 1989-07-27 | 1989-07-27 | Gas discharge display element and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0359928A true JPH0359928A (en) | 1991-03-14 |
Family
ID=16349182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1195920A Pending JPH0359928A (en) | 1989-07-27 | 1989-07-27 | Gas discharge display element and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0359928A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998044531A1 (en) * | 1997-03-31 | 1998-10-08 | Mitsubishi Denki Kabushiki Kaisha | Plane display panel, method for manufacturing the same, controller for controlling the same, and method for driving the same |
JP2007165329A (en) * | 1996-10-30 | 2007-06-28 | Toray Ind Inc | Manufacturing method of plasma display panel |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01115033A (en) * | 1987-10-28 | 1989-05-08 | Hitachi Ltd | Gas discharge display device |
JPH01145342A (en) * | 1987-11-30 | 1989-06-07 | Matsushita Electric Ind Co Ltd | Production of optical element |
-
1989
- 1989-07-27 JP JP1195920A patent/JPH0359928A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01115033A (en) * | 1987-10-28 | 1989-05-08 | Hitachi Ltd | Gas discharge display device |
JPH01145342A (en) * | 1987-11-30 | 1989-06-07 | Matsushita Electric Ind Co Ltd | Production of optical element |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007165329A (en) * | 1996-10-30 | 2007-06-28 | Toray Ind Inc | Manufacturing method of plasma display panel |
JP4578489B2 (en) * | 1996-10-30 | 2010-11-10 | パナソニック株式会社 | Method for manufacturing plasma display panel |
WO1998044531A1 (en) * | 1997-03-31 | 1998-10-08 | Mitsubishi Denki Kabushiki Kaisha | Plane display panel, method for manufacturing the same, controller for controlling the same, and method for driving the same |
US6323596B1 (en) | 1997-03-31 | 2001-11-27 | Mitsubishi Denki Kabushiki Kaisha | Planar display panel and panel manufacturing method |
US6483249B2 (en) | 1997-03-31 | 2002-11-19 | Mitsubishi Denki Kabushiki Kaisha | Planar display panel driving method |
US6794823B2 (en) | 1997-03-31 | 2004-09-21 | Mitsubishi Denki Kabushiki Kaisha | Planar display panel controller |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2000133144A (en) | Substrate for plasma display panel and its manufacture | |
KR100838669B1 (en) | Alternating current driven type plasma display device | |
KR100877736B1 (en) | Plasma display and method for manufacturing the same | |
CN100472702C (en) | A.c.driving plasma display and its mfg.method | |
JPH0359928A (en) | Gas discharge display element and its manufacture | |
US5836798A (en) | Method of making a plasma display panel | |
CN102099886A (en) | Plasma display panel | |
JPH10326571A (en) | Barrier rib for plasma display panel and manufacture thereof | |
JP2012255060A (en) | Phosphor material and plasma display panel using the same | |
JPH11185631A (en) | Plasma display panel | |
JP2002170494A (en) | Gas-discharge display device and discharge lamp | |
KR100444500B1 (en) | Back Plate of Plasma Display Panel and Method of Fabricating Thereof | |
KR100297547B1 (en) | Plasma Display Panel and Method of Appling Phosphor in the same | |
CN100356500C (en) | Plasma display panel | |
JP2002042663A (en) | Ac drive plasma display device and method of manufacturing the same | |
KR100565190B1 (en) | Method of Fabricating Barrier Rib and Mold for Forming Barrier Rib | |
JPH11162362A (en) | Manufacture of plasma display panel | |
KR100548239B1 (en) | Method Of Fabricating Lower Plate In Plasma Display Panel | |
JP2001057152A (en) | Manufacture of color pdp | |
KR100477608B1 (en) | Back Plate of Plasma Display Panel and Method of Fabricating the same | |
KR20000003384A (en) | Method of fabricating partition wall for plasma display panel and plasma display panel device using thereof | |
KR100444520B1 (en) | Barrier Rib Material of Plasma Display Panel and Method of Fabricating Barrier Rib | |
KR100433220B1 (en) | Method of Fabricating Back Plate in Plasma Display Panel | |
JP2001135241A (en) | Gas-discharge panel and manufacturing method therefor | |
JP2002063847A (en) | Plasma display panel |