JPH0359795B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a moving device for a processing head of a laser processing device.

[Conventional technology]

Figure 3 is a side view and a plan view of a conventional laser processing device, in which 1 is an L-shaped saddle, 2 is a Y-axis table, 3 is a beam of the saddle, 4 is an X-axis table, 5 is a processing head, and 6 7 is a reflecting mirror, 7 is a condensing lens, 8 is a laser beam, and 9 is a workpiece.

The Y-axis table 2 on which the workpiece 9 is placed moves on the saddle 1 in the direction of the arrow Y in the figure, while the X-axis table 4 on which the machining head 5 is mounted moves on the beam 3 of the saddle in the direction of the arrow Y in the figure. It is configured to move in the X direction. By moving the X-axis table 4 and Y-axis table 2 in the X and Y directions, the machining head 5 is positioned at a predetermined position on the workpiece 9, and the laser beam 8 emitted from the machining head 5 causes The workpiece 9 is processed.

[Problem that the invention seeks to solve]

By the way, in the conventional apparatus shown in FIG. 3, as the workpiece 8 becomes larger, the Y-axis table 2 also becomes larger in proportion to the workpiece, and the amount of movement of the Y-axis table 2 also increases in proportion to the size of the workpiece. Therefore, the installation area of the laser processing apparatus is required to be equal to the length of the Y-axis table 2 and the amount of movement of the table. In other words, if the length of the Y-axis table 2 is L, the installation dimension of the laser processing device must be 2L or more,
The problem was that the installation area became large.

The present invention has been made in order to solve the above-mentioned problems, and aims to provide a laser processing device that is smaller in size and has a smaller installation area.

[Means to solve the problem]

A laser processing apparatus is configured to move a processing head simultaneously in a direction opposite to a direction in which a workpiece moves.

[Effect]

With the above configuration, the movement of the Y-axis table on which the workpiece is placed in the Y-axis direction is halved compared to conventional equipment, and the laser processing equipment is also smaller and its installation area is smaller. That will happen.

[Embodiments of the invention]

FIG. 1 is a side view of a laser processing apparatus showing an embodiment of the present invention, and FIG. 2 is a plan view thereof. In the figure, numerals 1 to 9 indicate the same parts as the conventional device. 10
11 is a fixed table, 11 is a movable beam, and 12 is a reflecting mirror.

As shown in the figure, the L-shaped saddle of the conventional device is divided into two parts, a fixed table 10 and a movable beam 11, and the movable beam 11 is configured to be movable in the Y direction on the fixed table 10, and A reflecting mirror was provided at the end of the beam 11.

As a result, the movement of the moving beam 11 in the Y-axis direction is
By always moving simultaneously in the opposite direction to the movement of the Y-axis table 2, the maximum amount of movement of the Y-axis table 2 in the Y direction for setting the processing position of the workpiece 9 is It will only need to be 1.5 times the length L. Therefore, the dimensions of the laser processing device can be reduced, and the installation area can be reduced.

Note that if the Y-axis table is fixed and only the movable beam 11 is moved in the Y direction, the installation can be further miniaturized.
This type is called the optical scanning type. However, as a result, the optical path of the laser 8 becomes longer, and the displacement of the beam due to mounting errors of the reflecting mirrors in the middle of the optical path increases, resulting in a reduction in processing accuracy.

In this respect, the present invention is characterized in that it is possible to reduce the size of the apparatus while maintaining machining accuracy compared to the optical scanning type.

〔Effect of the invention〕

The present invention has a laser processing device configured so that the workpiece and the processing head can be moved simultaneously in opposite directions, making the device smaller and more compact than conventional devices that only move the workpiece. We were able to achieve the excellent effect of reducing the installation area by more than 25%.

[Brief explanation of drawings]

FIG. 1 is a side view of a laser processing apparatus showing an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a side view of a conventional apparatus, and b a plan view thereof. In the figure, 2 is the Y-axis table, 5 is the processing head, and 10
1 is a fixed table, and 11 is a movable beam. In each figure, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Claims] 1. A laser processing device characterized in that a table on which a workpiece is placed and a beam on which a processing head is attached can be moved simultaneously in opposite directions.