JPH0359664U - - Google Patents
Info
- Publication number
- JPH0359664U JPH0359664U JP12146189U JP12146189U JPH0359664U JP H0359664 U JPH0359664 U JP H0359664U JP 12146189 U JP12146189 U JP 12146189U JP 12146189 U JP12146189 U JP 12146189U JP H0359664 U JPH0359664 U JP H0359664U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pattern wiring
- piece
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12146189U JPH0359664U (pt) | 1989-10-16 | 1989-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12146189U JPH0359664U (pt) | 1989-10-16 | 1989-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0359664U true JPH0359664U (pt) | 1991-06-12 |
Family
ID=31669494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12146189U Pending JPH0359664U (pt) | 1989-10-16 | 1989-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0359664U (pt) |
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1989
- 1989-10-16 JP JP12146189U patent/JPH0359664U/ja active Pending