JPH0359495B2 - - Google Patents

Info

Publication number
JPH0359495B2
JPH0359495B2 JP59086699A JP8669984A JPH0359495B2 JP H0359495 B2 JPH0359495 B2 JP H0359495B2 JP 59086699 A JP59086699 A JP 59086699A JP 8669984 A JP8669984 A JP 8669984A JP H0359495 B2 JPH0359495 B2 JP H0359495B2
Authority
JP
Japan
Prior art keywords
adhesive
recording layer
spacer member
transparent
optical memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59086699A
Other languages
Japanese (ja)
Other versions
JPS60229256A (en
Inventor
Kenji Oota
Akira Takahashi
Hiroyuki Katayama
Junji Hirokane
Yoshiteru Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP59086699A priority Critical patent/JPS60229256A/en
Publication of JPS60229256A publication Critical patent/JPS60229256A/en
Priority to US07/061,034 priority patent/US4740947A/en
Publication of JPH0359495B2 publication Critical patent/JPH0359495B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing
    • G11B11/10582—Record carriers characterised by the selection of the material or by the structure or form
    • G11B11/10586—Record carriers characterised by the selection of the material or by the structure or form characterised by the selection of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1448—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface radiating the edges of the parts to be joined, e.g. for curing a layer of adhesive placed between two flat parts to be joined, e.g. for making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
    • B29C65/487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
    • B29C65/4875—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical being spherical, e.g. particles or powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
    • B29C65/7826—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being non-integral with the parts to be joined, e.g. particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
    • B29C65/4885—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their composition being non-plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s

Description

【発明の詳細な説明】 ＜発明の技術分野＞ 本発明は光学的に情報の記録・再生／消去等を
行なう光メモリ素子の製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION <Technical Field of the Invention> The present invention relates to a method of manufacturing an optical memory element that optically records, reproduces, erases, etc. information.

＜発明の技術的背景とその問題点＞ 近年、光メモリ素子は高密度大容量メモリとし
て注目されており、中でも特に光メモリ円板は磁
気テープ等に比べて情報のアクセスが速いため、
特に研究開発が活発に行なわれている。<Technical background of the invention and its problems> In recent years, optical memory devices have attracted attention as high-density, large-capacity memories, and optical memory disks in particular have faster access to information than magnetic tapes, etc.
Research and development is particularly active.

従来より提案されている情報の消去も可能な光
磁気メモリ円板の構造の断面一部拡大図を第５図
に示す。 FIG. 5 shows a partially enlarged cross-sectional view of the structure of a conventionally proposed magneto-optical memory disk capable of erasing information.

第５図において、１及び５はそれぞれPMMA
等の樹脂基板あるいはガラス基板等から成る透明
円板であり、２及び４はそれぞれ単層磁性膜また
は誘電体膜，磁性膜，反射膜等より成る多層膜の
記録層であり、３は紫外線硬化剤等の接着剤層で
ある。 In Figure 5, 1 and 5 are PMMA, respectively.
2 and 4 are recording layers of a single-layer magnetic film or a multilayer film consisting of a dielectric film, a magnetic film, a reflective film, etc., and 3 is an ultraviolet curing recording layer. This is an adhesive layer such as an adhesive.

このような構成にあつては２枚重ねの円板にす
ることにより、円板の両面に情報を入れることが
出来るため、円板当りの情報量が２倍になるメリ
ツトがあると共に、透明円板１及び５として
PMMA等の樹脂基板を用いた場合には基板のそ
り等の形状変化を抑えることが出来るという利点
もある。 In such a configuration, by stacking two discs, information can be stored on both sides of the disc, which has the advantage of doubling the amount of information per disc. As plates 1 and 5
When a resin substrate such as PMMA is used, there is an advantage that changes in shape such as warping of the substrate can be suppressed.

しかし、一方円板の回転による振れまわりを低
減するために、円板の厚み公差及び接着層３の厚
みむら等を厳しく管理して円板状の光メモリ素子
を製作する必要がある。 However, in order to reduce the whirling caused by the rotation of the disk, it is necessary to strictly control the thickness tolerance of the disk, the thickness unevenness of the adhesive layer 3, etc. to manufacture a disk-shaped optical memory element.

＜発明の目的＞ 本発明は上記諸点に鑑みて成されたものであ
り、２枚重ねの光メモリ素子において接着層の厚
みむらを無くすることが可能な光メモリ素子の製
造方法を提供することを目的とし、この目的を達
成するため、本発明は第１及び第２の透明基板上
にそれぞれ記録層を形成する工程と、前記第１及
び第２の透明基板の少なくとも一方の透明基板の
記録層の形成された面に、未硬化の接着剤中にス
ペーサ部材の混入された紫外線硬化性の接着剤を
塗布する工程と、前記記録層を挾んで前記第１及
び第２の透明基板を向かい合わせ、前記第１の透
明基板よりも小さな押さえ部材を前記第１の透明
基板に当接し、該押さえ部材で前記第１及び第２
の透明基板間に圧力を加えて前記スペーサ部材で
決定される厚みを出す工程と、前記押さえ部材を
保持した状態で前記第１の透明基板の側から紫外
線を照射して前記接着剤を硬化せしめる工程とを
備えたことを特徴とする光メモリ素子の製造方法
である。<Object of the invention> The present invention has been made in view of the above points, and an object thereof is to provide a method for manufacturing an optical memory element that can eliminate uneven thickness of the adhesive layer in a two-layer optical memory element. In order to achieve this object, the present invention includes a step of forming a recording layer on each of a first and second transparent substrate, and a step of forming a recording layer on at least one of the first and second transparent substrates. a step of applying an ultraviolet curable adhesive in which a spacer member is mixed in an uncured adhesive to the formed surface; and facing the first and second transparent substrates with the recording layer sandwiched therebetween; A pressing member smaller than the first transparent substrate is brought into contact with the first transparent substrate, and the pressing member is used to press the first and second transparent substrates.
applying pressure between the transparent substrates to obtain a thickness determined by the spacer member, and irradiating ultraviolet rays from the side of the first transparent substrate while holding the pressing member to cure the adhesive. 1. A method of manufacturing an optical memory element, comprising the steps of:

＜発明の実施例＞ 以下、本発明を図面を参照して詳細に説明す
る。<Embodiments of the Invention> The present invention will be described in detail below with reference to the drawings.

第１図は本発明に従つて製造された光メモリ素
子の一実施例の構造を示す一部拡大断面図であ
る。 FIG. 1 is a partially enlarged sectional view showing the structure of an embodiment of an optical memory device manufactured according to the present invention.

第１図において１及び５はそれぞれPMMA等
の樹脂基板あるいはガラス基板等から成る透明円
板、２及び４はそれぞれ上記の透明円板１及び５
の対向する面上に形成された単層磁性膜または誘
電体膜，磁性膜，反射膜等より成る多層膜の記録
層、３は紫外線硬化型の接着剤層であり、この接
着剤層３中に本発明の特徴である球状のスペーサ
部材６が散在されている。 In FIG. 1, 1 and 5 are transparent disks made of a resin substrate such as PMMA or a glass substrate, and 2 and 4 are transparent disks 1 and 5, respectively.
A recording layer 3 is a multilayer film consisting of a single-layer magnetic film or a dielectric film, a magnetic film, a reflective film, etc. formed on the opposing surfaces of the Spherical spacer members 6, which are a feature of the present invention, are scattered throughout.

上記スペーサ部材６を屈折率が1.4〜1.6程度の
透明体で構成することにより、紫外線硬化型の接
着剤の屈折率とほぼ同じ値を示すことになり、こ
の結果、この球状のスペーサ部材６の存在を光学
的には検出できなくなり、見かけ上、第５図に示
した従来の接着層のみのものと同じになり、かつ
接着層の厚みの最小値は、この球状のスペーサ部
材６の直径精度によつて正確に設定されることに
なる。 By constructing the spacer member 6 with a transparent material having a refractive index of about 1.4 to 1.6, it will exhibit a refractive index that is almost the same as that of an ultraviolet curing adhesive, and as a result, the spherical spacer member 6 Its presence cannot be optically detected, and the appearance is the same as that of the conventional adhesive layer shown in FIG. 5, and the minimum thickness of the adhesive layer depends on the diameter accuracy of this spherical spacer member 6. It will be set accurately by

なお、スペーサ部材６の材質としてはガラスあ
るいはPMMA等の樹脂部材等が良く、また大き
さは50〜100μCmの直径であることが望ましい。 The material of the spacer member 6 is preferably glass or a resin member such as PMMA, and the size thereof is preferably 50 to 100 μCm in diameter.

次に本発明にしたがつて上記第１図に示した光
メモリ素子を作る製造方法について説明すると、
その工程は次の通りである。 Next, a manufacturing method for manufacturing the optical memory element shown in FIG. 1 above according to the present invention will be explained.
The process is as follows.

第１の透明基板１及び第２の透明基板５上に
それぞれ磁性膜を含む記録層２及び４を形成す
る。なお、この場合光メモリ素子が円板状の場
合には円板外周部には記録層２及び４に形成し
ないように成す。 Recording layers 2 and 4 including magnetic films are formed on the first transparent substrate 1 and the second transparent substrate 5, respectively. In this case, if the optical memory element is disc-shaped, the recording layers 2 and 4 are not formed on the outer periphery of the disc.

紫外線硬化型の未硬化の接着剤に上記の球状
スペーサ部材６を体積比100：１〜10：１（接着
剤：スペーサ）で混入させて、よく撹拌する。 The above-mentioned spherical spacer member 6 is mixed into an uncured ultraviolet curable adhesive at a volume ratio of 100:1 to 10:1 (adhesive:spacer) and stirred well.

上記スペーサ部材６の入つた接着剤中に含ま
れる気泡を例えば真空引き等によつて抜く。 Air bubbles contained in the adhesive containing the spacer member 6 are removed by, for example, vacuuming.

上記第１の透明基板１及び第２の透明基板５
の記録層２及び４を有するそれぞれの面あるい
は一方の面に上記の工程を経たスペーサ部材
６の混入された接着剤３を全面塗布する。 The first transparent substrate 1 and the second transparent substrate 5
The adhesive 3 mixed with the spacer member 6 which has gone through the above process is applied to each surface or one surface having the recording layers 2 and 4 on the entire surface.

２枚の透明基板１及び５を記録層２及び４が
相対峙する形で重ねて位置合せを行ない、第２
図に示すように押え板７及び８を介して上下面
から圧力を加える。このとき圧力を加えるため
の押え板７は基板１及び５が円板状の場合には
円板直径よりも小さい直径を有する円形をして
いるものが望ましい。 The two transparent substrates 1 and 5 are aligned so that the recording layers 2 and 4 face each other, and the second
As shown in the figure, pressure is applied from the upper and lower surfaces via the presser plates 7 and 8. When the substrates 1 and 5 are disk-shaped, the presser plate 7 for applying pressure at this time is desirably circular and has a smaller diameter than the disk diameter.

接着層３′の厚みがスペーサ部材６で決定さ
れるに充分な圧力を押え板７及び８間に加えた
後、紫外線９を基板１の全面に照射する。な
お、このとき円板状基板１及び５は第３図に示
すように外周部に記録膜が無く光が通過する構
造に成しており、このような構造により、スペ
ーサの混入された接着層３′のうち光の照射さ
れる１０の部分が硬化接着して、円板状基板１
及び５が滑らなくなる。 After applying sufficient pressure between the presser plates 7 and 8 so that the thickness of the adhesive layer 3' is determined by the spacer member 6, the entire surface of the substrate 1 is irradiated with ultraviolet rays 9. At this time, as shown in FIG. 3, the disk-shaped substrates 1 and 5 have a structure in which there is no recording film on the outer periphery and light passes through. 10 portions of 3' that are irradiated with light are cured and bonded to form a disk-shaped substrate 1.
and 5 will not slip.

以上のようにして第１図に示した構造の光メモ
リ素子が作られることになる。 In the manner described above, an optical memory element having the structure shown in FIG. 1 is manufactured.

なお、接着剤として嫌気硬化性のものを使用す
ることにより、時間経過と共に未硬化部分が硬化
するために更に好都合である。 Note that it is more convenient to use an anaerobically curable adhesive because the uncured portions will harden over time.

本発明は上記実施例に限定されるものではな
く、種々の変形が可能である。 The present invention is not limited to the above embodiments, and various modifications are possible.

例えばスペーサ部材６は球形である必要がな
く、第４図に示すように円柱状のスペーサ部材
６′を用いることも可能である。このような円柱
状のスペーサ部材６′をガラスで構成した場合に
は第４図における矢印ａの方向から力を加えても
形状が容易に変化しないのに対し、矢印ｂのよう
に斜めから力を加えた場合には円柱６′が折れて
より短い円柱となり、従つて適当な圧力を加える
ことで最終的には円柱の直径にまで間隔が縮まる
ことになる。 For example, the spacer member 6 does not have to be spherical, and a cylindrical spacer member 6' may be used as shown in FIG. If such a cylindrical spacer member 6' is made of glass, its shape will not change easily even if force is applied from the direction of arrow a in FIG. If pressure is applied, the cylinder 6' will break and become a shorter cylinder, so that by applying an appropriate pressure, the spacing will eventually be reduced to the diameter of the cylinder.

またPMMA等の樹脂材料をスペーサ部材６′と
して用いる場合には円柱の高さを長くすることに
より、円柱が全て第４図に示すように倒れた形と
なり、最少間隔が容易に決定されることになる。 In addition, when a resin material such as PMMA is used as the spacer member 6', by increasing the height of the cylinders, all the cylinders are in a collapsed shape as shown in Fig. 4, and the minimum spacing can be easily determined. become.

また第２図における押え板７は必ずしも円形で
ある必要はなく、要は円板外周部あるいは内周部
に設けられた記録膜のない透明部分の一部に光が
照射され得る形状であれば良い。 Furthermore, the presser plate 7 in FIG. 2 does not necessarily have to be circular, but it should have a shape that allows light to be irradiated to a part of the transparent portion provided on the outer or inner circumference of the disk where there is no recording film. good.

＜発明の効果＞ 以上説明したように、本発明によれば、第１の
透明基板よりも小さな押さえ部材を第１の透明基
板に当接して、記録層を挾んで第１及び第２の透
明基板間にこの押さえ部材で圧力を加えてスペー
サ部材で決定される厚みを出した後、押さえ部材
を保持した状態で第１の透明基板の側から紫外線
を照射して接着剤を硬化せしめるので、記録層の
形成された透明基板間の接着層の厚みを容易に、
かつ、精度良く均一にすることが可能となると共
に、透明基板よりも小さな押さえ部材で押さえた
状態を保持して紫外線で接着剤を硬化せしめるの
で基板の周辺部の硬化を確実に行うことができ、
基板相互のずれを防ぐことが可能となり、この結
果、例えば、円板状の光メモリ素子の振れまわり
に対する影響を大幅に低減し、かつ２枚の基板の
ずれを防止した光メモリ素子を容易に製造するこ
とができる。<Effects of the Invention> As explained above, according to the present invention, a pressing member smaller than the first transparent substrate is brought into contact with the first transparent substrate, and the recording layer is sandwiched between the first and second transparent substrates. After applying pressure between the substrates with this holding member to create the thickness determined by the spacer member, ultraviolet rays are irradiated from the side of the first transparent substrate while holding the holding member to harden the adhesive. Easily adjust the thickness of the adhesive layer between the transparent substrates on which the recording layer is formed.
In addition, it is possible to uniformize the adhesive with high precision, and since the adhesive is cured with ultraviolet light while being held in place by a pressing member smaller than the transparent substrate, it is possible to reliably cure the peripheral area of the substrate. ,
It becomes possible to prevent mutual displacement of the substrates, and as a result, for example, the influence on the wobbling of a disc-shaped optical memory element is greatly reduced, and an optical memory element that prevents displacement of two substrates can be easily manufactured. be able to.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明にしたがつて製造される光メモ
リ素子の一例の構造を示す断面一部拡大図、第２
図は本発明の光メモリ素子の製造方法の一実施例
を示す概略図、第３図は第２図の製造方法によつ
て接着をした場合に硬化する部分を示す一部拡大
断面図、第４図はスペーサ部材の他の一例を示す
図、第５図は従来の光メモリ素子の構造を示す断
面一部拡大図である。 １…第１の透明基板、２…記録層、３…接着
層、３′…スペーサ部材を含んだ接着層、４…記
録層、５…第２の透明基板、６…スペーサ部材、
７及び８…押え板、９…紫外線光、１０…硬化部
分。 FIG. 1 is a partially enlarged cross-sectional view showing the structure of an example of an optical memory element manufactured according to the present invention, and FIG.
The figures are a schematic diagram showing an embodiment of the method for manufacturing an optical memory element of the present invention, FIG. This figure shows another example of a spacer member, and FIG. 5 is a partially enlarged cross-sectional view showing the structure of a conventional optical memory element. DESCRIPTION OF SYMBOLS 1... First transparent substrate, 2... Recording layer, 3... Adhesive layer, 3'... Adhesive layer containing a spacer member, 4... Recording layer, 5... Second transparent substrate, 6... Spacer member,
7 and 8...pressing plate, 9...ultraviolet light, 10...curing portion.

Claims (1)

【特許請求の範囲】 １ 第１及び第２の透明基板上にそれぞれ記録層
を形成する工程と、 前記第１及び第２の透明基板の少なくとも一方
の透明基板の記録層の形成された面に、未硬化の
接着剤中にスペーサ部材の混入された紫外線硬化
性の接着剤を塗布する工程と、 前記記録層を挾んで前記第１及び第２の透明基
板を向かい合わせ、前記第１の透明基板よりも小
さな押さえ部材を前記第１の透明基板に当接し、
該押さえ部材で前記第１及び第２の透明基板間に
圧力を加えて前記スペーサ部材で決定される厚み
を出す工程と、 前記押さえ部材を保持した状態で前記第１の透
明基板の側から紫外線を照射して前記接着剤を硬
化せしめる工程と を備えたことを特徴とする光メモリ素子の製造方
法。[Scope of Claims] 1. A step of forming a recording layer on each of the first and second transparent substrates, and a step of forming a recording layer on the surface of at least one of the first and second transparent substrates on which the recording layer is formed. , applying an ultraviolet curable adhesive in which a spacer member is mixed into an uncured adhesive, and placing the first and second transparent substrates facing each other with the recording layer sandwiched therebetween; abutting a holding member smaller than the substrate against the first transparent substrate;
applying pressure between the first and second transparent substrates with the holding member to obtain a thickness determined by the spacer member; and applying ultraviolet rays from the first transparent substrate side while holding the holding member. A method for manufacturing an optical memory element, comprising the step of curing the adhesive by irradiating with.
JP59086699A 1984-04-25 1984-04-26 Manufacture of optical memory element Granted JPS60229256A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59086699A JPS60229256A (en) 1984-04-26 1984-04-26 Manufacture of optical memory element
US07/061,034 US4740947A (en) 1984-04-25 1987-06-12 Dual surface optical memory disc

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59086699A JPS60229256A (en) 1984-04-26 1984-04-26 Manufacture of optical memory element

Publications (2)

Publication Number Publication Date
JPS60229256A JPS60229256A (en) 1985-11-14
JPH0359495B2 true JPH0359495B2 (en) 1991-09-10

Family

ID=13894190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59086699A Granted JPS60229256A (en) 1984-04-25 1984-04-26 Manufacture of optical memory element

Country Status (1)

Country Link
JP (1) JPS60229256A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5991215B2 (en) * 2013-01-31 2016-09-14 富士通株式会社 Photocuring resin curing monitoring method and optical component connecting method

Also Published As

Publication number Publication date
JPS60229256A (en) 1985-11-14

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