JPH0357964A - Method for measuring resistance value of electronic part - Google Patents

Abstract

PURPOSE:To accurately bring a probe into contact with an electrode and to accurately measure the resistance value of each element piece by using the probe having the contact surface inclined with respect to the electrode surface on a substrate and brought into contact with the electrode on the end surface corner part of the substrate and bringing the same into contact with the corner part of the electrode from above. CONSTITUTION:A probe 11 has the contact surface 12 inclined to the surface of the electrode 2 on a substrate 1 and brought into contact with the electrode 2 on the end surface corner part of the substrate 1 provided at the leading end thereof and is brought into contact with the corner part of the electrode 2 from above. The probe 11 measures the resistance value of a part series wherein a plurality of electronic parts are arranged in parallel. By measuring the resistance value using the probe, no adverse effect is applied to the electrical contact state of the probe 11 and the electrode 2 with respect to the positional shift of the electronic parts and the positional shift at the time of the formation of a protective film 4 and accurate measurement can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for measuring the resistance value of each component of a strip-shaped electronic component in which a plurality of chip-shaped electronic components are arranged in parallel.

BACKGROUND OF THE INVENTION Conventionally, this type of resistance measurement method has been carried out as shown in FIG. In FIG. 3, reference numeral 1 denotes an electrically insulating substrate, and a pair of opposing electrodes 2 are provided on the upper surface of the substrate. A resistor 3 is formed between the electrodes 2 so that its end overlaps with the electrode 2.
It has an impressive appearance with several of them placed side by side. In addition, a strip-shaped protective film 4 is provided to protect the resistor 3. A plate groove 6 is provided between each piece of a component in which electronic components including the electrode 2 and the resistor 3 are arranged in parallel. When measuring the resistance value of a plurality of these electronic components arranged in a row, the probe 6 was brought into contact with the upper surface of the pair of electrodes 2 to perform the measurement.

Problems to be Solved by the Invention In this conventional structure, printing accuracy of the protective film is insufficient. When a positional shift occurs due to a factor in the positioning accuracy of the electronic component itself, the area of the electrode on the side of the shifted electrode becomes minute, resulting in the problem that the probe comes into contact with the protective film and does not measure the resistance value.

The present invention solves these problems by making it possible to accurately measure the resistance value of each element by bringing the glove into precise contact with the electrode even if the positioning accuracy of the protective film printing position on the housing or the electronic component itself is poor. The purpose is to

Means for Solving the Problems In order to solve this problem, the present invention uses a probe having a contact surface that is inclined with respect to the electrode surface on the substrate and contacts the electrode on the corner of the end face of the substrate. The contact is made from above the corner.

Function: This structure enables accurate measurement without being affected by misalignment of the protective film or poor positioning accuracy of the electronic component itself.

Embodiment FIGS. 1 and 2 show a state in which a resistance value measurement method according to an embodiment of the present invention is being carried out. In the figures, the same parts as those shown in FIG. 3 are designated by the same numbers. are doing.

11 A probe for measuring the resistance value of a series of electronic components arranged in parallel. A contact surface 12 is provided to contact the electrode 2 from above the corner of the electrode 2.

By measuring the resistance value using the probe 11 with this structure, the state of electrical contact between the globe 11 and the electrode 2 can be checked even when the position of the electronic component or the position of the protective film 4 is shifted. Accurate measurements can be made without being adversely affected by

Effects of the Invention As described above, according to the present invention, when measuring the resistance value of each element in which a plurality of electronic components are arranged in parallel, the positional shift of the protective film that protects the resistor, or the electronic Accurate measurement is always possible without being affected by misalignment of the parts themselves, improving the reliability of measured values, reducing the time (man-hours) spent on measurements during the production process, and improving yield and productivity. Both will improve.

[Brief explanation of drawings]

1 and 2 are a perspective view and a sectional view showing a resistance measuring method according to an embodiment of the present invention, and FIG. 3 is a perspective view showing a conventional measuring method for chip-shaped electronic components. DESCRIPTION OF SYMBOLS 1... Electric insulating substrate, 2... Electrode, 3... Resistor, 4... Protective film, 11
...Brobe, 12...Contact surface.

Claims (1)

[Claims] Measures the resistance value of a series of electronic components arranged in parallel, each having a film-like resistance element formed on an electrically insulating substrate and film-like electrodes formed on both sides of this resistance element. A method for measuring the resistance value of an electronic component using a probe having a contact surface that is inclined with respect to the electrode surface on the substrate and in contact with an electrode on an end face corner of the substrate.