JPH0357935U - - Google Patents

Info

Publication number
JPH0357935U
JPH0357935U JP1989118456U JP11845689U JPH0357935U JP H0357935 U JPH0357935 U JP H0357935U JP 1989118456 U JP1989118456 U JP 1989118456U JP 11845689 U JP11845689 U JP 11845689U JP H0357935 U JPH0357935 U JP H0357935U
Authority
JP
Japan
Prior art keywords
thin film
vessel
rotating shaft
vertical axis
liquid material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989118456U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989118456U priority Critical patent/JPH0357935U/ja
Publication of JPH0357935U publication Critical patent/JPH0357935U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H01L2224/49173—Radial fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の１実施例の薄膜蒸発装置の全
体的構成を示す縦断側面図、第２図はその回転部
材の平面図、第３図はその第２図―線断面矢
視の縦断側面図、第４図は本考案と対比される先
行技術の薄膜蒸発装置の縦断側面図である。 １……蒸発器本体、２……器内面、加熱蒸発面
、３……ジヤケツト、４，５……熱媒ノズル、６
……蒸気出口ノズル、７，８……軸受、９，９Ａ
……回転軸、９ａ……外側流路、９ｂ……中心流
路、１０，１０Ａ……分散ユニツト、１１，１１
Ａ……薄膜化ユニツト、１２……液材料入口ノズ
ル、１３……薄膜化翼、１４……製品出口、１５
，１５Ａ……蒸気通路、１６……基体円筒部、１
７……フイン、１８……上板部、１９……下板部
、２０……マニホールド、２１……支持部、２３
，２７……熱媒径路、２４，２５，２６……通孔
、Ｘ……中心縦軸線、Ａ……薄膜化蒸発部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 中心縦軸線のまわりに円筒形の減圧可能な密閉
    式蒸発器本体の器内面を加熱蒸発面に形成し、中
    心縦軸線位置の回転軸に取付けられて回転する上
    位の分散ユニツトがその高さで器内に供給される
    液材料を器内面の全周に一次的に分散し、下位の
    強制薄膜化ユニツトが分剤され移送された液材料
    を加熱蒸発面上に二次的に薄膜状に展開させる薄
    膜化蒸発器において、前記薄膜化ユニツトの薄膜
    化翼を支持する支持部および回転軸を中空として
    中空内を熱媒循環流路に形成したことを特徴とす
    る薄膜蒸発装置。
JP1989118456U 1989-10-09 1989-10-09 Pending JPH0357935U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989118456U JPH0357935U (ja) 1989-10-09 1989-10-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989118456U JPH0357935U (ja) 1989-10-09 1989-10-09

Publications (1)

Publication Number Publication Date
JPH0357935U true JPH0357935U (ja) 1991-06-05

Family

ID=31666620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989118456U Pending JPH0357935U (ja) 1989-10-09 1989-10-09

Country Status (1)

Country Link
JP (1) JPH0357935U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4490644B2 (ja) * 2003-04-04 2010-06-30 有限会社岩佐電機製作所 重量物を収容する容器運搬用台車及びその台車を使った容器の運搬方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607160A (ja) * 1983-06-24 1985-01-14 Fujitsu Ltd 半導体装置
JPH01261837A (ja) * 1988-04-12 1989-10-18 Nec Corp 半導体集積回路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607160A (ja) * 1983-06-24 1985-01-14 Fujitsu Ltd 半導体装置
JPH01261837A (ja) * 1988-04-12 1989-10-18 Nec Corp 半導体集積回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4490644B2 (ja) * 2003-04-04 2010-06-30 有限会社岩佐電機製作所 重量物を収容する容器運搬用台車及びその台車を使った容器の運搬方法

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