JPH0356673A - Vapor deposition device - Google Patents
Vapor deposition deviceInfo
- Publication number
- JPH0356673A JPH0356673A JP19098489A JP19098489A JPH0356673A JP H0356673 A JPH0356673 A JP H0356673A JP 19098489 A JP19098489 A JP 19098489A JP 19098489 A JP19098489 A JP 19098489A JP H0356673 A JPH0356673 A JP H0356673A
- Authority
- JP
- Japan
- Prior art keywords
- resistance
- vapor deposition
- evaporated
- substrate
- shutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 abstract description 8
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- 239000010408 film Substances 0.000 abstract description 8
- 239000010409 thin film Substances 0.000 abstract description 7
- 238000001704 evaporation Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- 230000008020 evaporation Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は薄膜抵抗体等の成膜を行う蒸着装置に関する。[Detailed description of the invention] Industrial applications The present invention relates to a vapor deposition apparatus for forming films such as thin film resistors.
従来の技術
従来のこの種の蒸着装置は第４図のような運転方法をと
っていた。BACKGROUND OF THE INVENTION Conventional vapor deposition apparatuses of this type have operated as shown in FIG.
すなわち真空チャンバー１内において、材料２を蒸発さ
せ、基板３に蒸着させる。このとき水晶振動子を応用し
た膜厚計５により、戒膜速度と最終膜厚を管理するよう
になっている。That is, in the vacuum chamber 1, the material 2 is evaporated and deposited on the substrate 3. At this time, a film thickness gauge 5 using a crystal oscillator is used to control the film speed and final film thickness.
発明が解決しようとする課題
しかしながら上記のような方式では合金の蒸着膜を得よ
うとする場合、合金成分の平衡蒸気圧と質量が異なるた
め、もとの材料の組成と一致しない。しかも、蒸発によ
って時間とともに合金の組成が変わるため、できる薄膜
の組成もまた時間とともに変わり、抵抗体として使用が
難しいという問題点を有していた。Problems to be Solved by the Invention However, when attempting to obtain a vapor deposited film of an alloy using the method described above, the equilibrium vapor pressure and mass of the alloy components differ, so the composition does not match the composition of the original material. Moreover, since the composition of the alloy changes over time due to evaporation, the composition of the resulting thin film also changes over time, making it difficult to use as a resistor.
本発明は蒸気問題点に鑑み、合金を蒸着して抵抗体を得
る場合にも、所定の特性を再現性良く得られるようにす
るものである。In view of the steam problem, the present invention makes it possible to obtain predetermined characteristics with good reproducibility even when obtaining a resistor by vapor depositing an alloy.
課題を解決するための手段
そして上記問題点を解決する本発明の技術的な手段は、
真空チャンバー内に面抵抗を測定する威膜モニタ等のセ
ンサ部を備えて、蒸着を行うものである。Means for solving the problems and technical means of the present invention for solving the above problems are as follows:
Vapor deposition is performed using a vacuum chamber equipped with a sensor unit such as a film monitor that measures sheet resistance.
作 用
本発明は上記した構成によって、蒸着薄膜の面抵抗を測
定，監視することにより、所定の面抵抗をもった合金薄
膜抵抗の成満が可能となる。Operation According to the present invention, by measuring and monitoring the sheet resistance of the vapor-deposited thin film with the above-described configuration, it is possible to achieve an alloy thin film resistance having a predetermined sheet resistance.
実施例
以下、本発明の一実施例を添付図面にもとづいて説明す
る。Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.
第１図において、真空チャンバー１内に蒸着材料２と基
板３、その間にシャッター４が配置されている。In FIG. 1, a vapor deposition material 2 and a substrate 3 are placed in a vacuum chamber 1, and a shutter 4 is placed between them.
また、チャンバー内の抵抗センサー６からの信号により
、制御回路７がシャッター駆動用電磁弁１１に接続され
ている。Further, a control circuit 7 is connected to a shutter driving electromagnetic valve 11 based on a signal from a resistance sensor 6 in the chamber.
以上のように構成された蒸着制御回路について、以下第
１図及び第２図を用いてその動作を説明する。蒸着材料
６を加熱蒸発を開始し、蒸着材料表面の酸化物等を除去
した後、シャッター４を開け、基板３に材料２を蒸着し
始める。抵抗センサー６には蒸発金属が指積し、第３図
のように時間とともに、その膜圧が増加するので、抵抗
値が減少する。この抵抗値を制御回路７により計測する
とともに、第２図に示す抵抗センサ６の幅と長さより面
抵抗を計量する。所望の面抵抗が得られた時点で、電磁
弁８に信号を送り、シャッター４を閉し、蒸着を終了す
る。The operation of the vapor deposition control circuit configured as above will be described below with reference to FIGS. 1 and 2. After heating and evaporating the vapor deposition material 6 to remove oxides and the like on the surface of the vapor deposition material, the shutter 4 is opened and the vapor deposition of the material 2 onto the substrate 3 is started. Evaporated metal accumulates on the resistance sensor 6, and the film pressure increases over time as shown in FIG. 3, so that the resistance value decreases. This resistance value is measured by the control circuit 7, and the sheet resistance is measured from the width and length of the resistance sensor 6 shown in FIG. When the desired sheet resistance is obtained, a signal is sent to the electromagnetic valve 8, the shutter 4 is closed, and the vapor deposition is completed.
発明の効果
以上のように本発明は真空蒸着装置において、蒸着モニ
タとして面抵抗測定装置を設けることにより、蒸気圧の
異なる合金を蒸着して、所望の電気特性を持つ薄膜抵抗
体を作製することができる。Effects of the Invention As described above, the present invention provides a vacuum evaporation apparatus with a sheet resistance measuring device as a evaporation monitor, thereby making it possible to evaporate alloys with different vapor pressures and produce a thin film resistor having desired electrical characteristics. I can do it.
第１図は本発明の一実施例における真空蒸着装置のブロ
ック図、第２図は抵抗センサーの要部斜視図、第３図は
面抵抗と時間との関係図、第４図は従来の真空蒸着装置
のブロック図である。
６・・・・・・抵抗センサー、７・・・・・・制御回路
。Fig. 1 is a block diagram of a vacuum evaporation apparatus according to an embodiment of the present invention, Fig. 2 is a perspective view of the main parts of a resistance sensor, Fig. 3 is a diagram of the relationship between sheet resistance and time, and Fig. 4 is a conventional vacuum evaporation device. It is a block diagram of a vapor deposition apparatus. 6... Resistance sensor, 7... Control circuit.
Claims (1)
設けられた蒸発可能な材料と、この材料と対向して設け
られ、蒸発した材料の蒸着膜を形成可能な対象部と、こ
の対象部と材料との間に設けられた開閉可能なシャッタ
ー部と、このシャッター部を開閉可能に制御する制御部
と、蒸発膜を形成可能で、かつこの蒸発膜の幅と長さよ
り面対向を算出し、所定値の時、制御部に信号を送信可
能なセンサ部とを有した蒸着装置。A sealed chamber that maintains a vacuum, a material that can be evaporated provided in the chamber, a target part that is provided opposite to the material and can form a deposited film of the evaporated material, and the target part and the material. a shutter section that can be opened and closed between the shutter section and a control section that controls the shutter section so that it can be opened and closed; A vapor deposition apparatus having a sensor unit capable of transmitting a signal to a control unit when the value is reached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19098489A JPH0356673A (en) | 1989-07-24 | 1989-07-24 | Vapor deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19098489A JPH0356673A (en) | 1989-07-24 | 1989-07-24 | Vapor deposition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0356673A true JPH0356673A (en) | 1991-03-12 |
Family
ID=16266927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19098489A Pending JPH0356673A (en) | 1989-07-24 | 1989-07-24 | Vapor deposition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356673A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018529014A (en) * | 2015-09-21 | 2018-10-04 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Measuring assembly and method for measuring deposition rate |
-
1989
- 1989-07-24 JP JP19098489A patent/JPH0356673A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018529014A (en) * | 2015-09-21 | 2018-10-04 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Measuring assembly and method for measuring deposition rate |
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