JPH0356567U - - Google Patents

Info

Publication number

JPH0356567U

JPH0356567U JP11671589U JP11671589U JPH0356567U JP H0356567 U JPH0356567 U JP H0356567U JP 11671589 U JP11671589 U JP 11671589U JP 11671589 U JP11671589 U JP 11671589U JP H0356567 U JPH0356567 U JP H0356567U

Authority

JP

Japan

Prior art keywords

resin layer

heat

blister package

sealing resin

bottom material

Prior art date

1989-10-04

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000463 material Substances 0.000 claims description 22
• 229920005989 resin Polymers 0.000 claims description 6
• 239000011347 resin Substances 0.000 claims description 6
• 229920005672 polyolefin resin Polymers 0.000 claims description 5
• 238000007789 sealing Methods 0.000 claims 4
• 230000035699 permeability Effects 0.000 claims 1
• 229920003002 synthetic resin Polymers 0.000 claims 1
• 239000000057 synthetic resin Substances 0.000 claims 1
• 239000012778 molding material Substances 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1

Cited By (2)