JPH0356154U - - Google Patents
Info
- Publication number
- JPH0356154U JPH0356154U JP11666089U JP11666089U JPH0356154U JP H0356154 U JPH0356154 U JP H0356154U JP 11666089 U JP11666089 U JP 11666089U JP 11666089 U JP11666089 U JP 11666089U JP H0356154 U JPH0356154 U JP H0356154U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- power module
- wiring
- magnitude
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11666089U JPH0356154U (sv) | 1989-10-05 | 1989-10-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11666089U JPH0356154U (sv) | 1989-10-05 | 1989-10-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0356154U true JPH0356154U (sv) | 1991-05-30 |
Family
ID=31664927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11666089U Pending JPH0356154U (sv) | 1989-10-05 | 1989-10-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0356154U (sv) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4530886B2 (ja) * | 2005-03-11 | 2010-08-25 | 株式会社Comfort Lab | 簡易装具 |
-
1989
- 1989-10-05 JP JP11666089U patent/JPH0356154U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4530886B2 (ja) * | 2005-03-11 | 2010-08-25 | 株式会社Comfort Lab | 簡易装具 |