JPH0356148U - - Google Patents

Info

Publication number
JPH0356148U
JPH0356148U JP1989116670U JP11667089U JPH0356148U JP H0356148 U JPH0356148 U JP H0356148U JP 1989116670 U JP1989116670 U JP 1989116670U JP 11667089 U JP11667089 U JP 11667089U JP H0356148 U JPH0356148 U JP H0356148U
Authority
JP
Japan
Prior art keywords
semiconductor device
package
heat dissipating
package structure
heat absorbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989116670U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989116670U priority Critical patent/JPH0356148U/ja
Publication of JPH0356148U publication Critical patent/JPH0356148U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/536
    • H10W72/5363
    • H10W72/884
    • H10W90/756
JP1989116670U 1989-10-05 1989-10-05 Pending JPH0356148U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989116670U JPH0356148U (enExample) 1989-10-05 1989-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989116670U JPH0356148U (enExample) 1989-10-05 1989-10-05

Publications (1)

Publication Number Publication Date
JPH0356148U true JPH0356148U (enExample) 1991-05-30

Family

ID=31664937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989116670U Pending JPH0356148U (enExample) 1989-10-05 1989-10-05

Country Status (1)

Country Link
JP (1) JPH0356148U (enExample)

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