JPH0356137U - - Google Patents
Info
- Publication number
- JPH0356137U JPH0356137U JP1989116369U JP11636989U JPH0356137U JP H0356137 U JPH0356137 U JP H0356137U JP 1989116369 U JP1989116369 U JP 1989116369U JP 11636989 U JP11636989 U JP 11636989U JP H0356137 U JPH0356137 U JP H0356137U
- Authority
- JP
- Japan
- Prior art keywords
- flip chip
- substrate
- integrated circuit
- injection hole
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989116369U JPH0356137U (OSRAM) | 1989-10-03 | 1989-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989116369U JPH0356137U (OSRAM) | 1989-10-03 | 1989-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0356137U true JPH0356137U (OSRAM) | 1991-05-30 |
Family
ID=31664648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989116369U Pending JPH0356137U (OSRAM) | 1989-10-03 | 1989-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356137U (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006290447A (ja) * | 2005-04-14 | 2006-10-26 | Dainippon Printing Co Ltd | 封筒糊付部検査装置 |
| JP2007062795A (ja) * | 2005-08-31 | 2007-03-15 | Kinoshita Seisakusho:Kk | 封緘部の糊付け検査方法及び装置 |
| JP2023549141A (ja) * | 2020-11-17 | 2023-11-22 | インターナショナル・ビジネス・マシーンズ・コーポレーション | キャピラリアンダーフィルを有するブリッジチップアセンブリについての構造および方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57187955A (en) * | 1981-05-14 | 1982-11-18 | Nitto Electric Ind Co Ltd | Sealing structure of semiconductor element |
-
1989
- 1989-10-03 JP JP1989116369U patent/JPH0356137U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57187955A (en) * | 1981-05-14 | 1982-11-18 | Nitto Electric Ind Co Ltd | Sealing structure of semiconductor element |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006290447A (ja) * | 2005-04-14 | 2006-10-26 | Dainippon Printing Co Ltd | 封筒糊付部検査装置 |
| JP2007062795A (ja) * | 2005-08-31 | 2007-03-15 | Kinoshita Seisakusho:Kk | 封緘部の糊付け検査方法及び装置 |
| JP2023549141A (ja) * | 2020-11-17 | 2023-11-22 | インターナショナル・ビジネス・マシーンズ・コーポレーション | キャピラリアンダーフィルを有するブリッジチップアセンブリについての構造および方法 |