JPH0356136U - - Google Patents
Info
- Publication number
- JPH0356136U JPH0356136U JP1989115968U JP11596889U JPH0356136U JP H0356136 U JPH0356136 U JP H0356136U JP 1989115968 U JP1989115968 U JP 1989115968U JP 11596889 U JP11596889 U JP 11596889U JP H0356136 U JPH0356136 U JP H0356136U
- Authority
- JP
- Japan
- Prior art keywords
- mating terminal
- bump electrodes
- pressure contact
- bump
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000013011 mating Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/1147—Manufacturing methods using a lift-off mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989115968U JPH0356136U (fr) | 1989-10-02 | 1989-10-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989115968U JPH0356136U (fr) | 1989-10-02 | 1989-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0356136U true JPH0356136U (fr) | 1991-05-30 |
Family
ID=31664277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989115968U Pending JPH0356136U (fr) | 1989-10-02 | 1989-10-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0356136U (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004127974A (ja) * | 2002-09-30 | 2004-04-22 | Oki Electric Ind Co Ltd | Cofテープキャリア、半導体素子、半導体装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5494872A (en) * | 1978-01-11 | 1979-07-26 | Cho Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
JPS58175849A (ja) * | 1982-04-08 | 1983-10-15 | Agency Of Ind Science & Technol | 半導体装置 |
JPS63289844A (ja) * | 1987-05-21 | 1988-11-28 | Fuji Electric Co Ltd | 半導体装置のバンプ電極 |
-
1989
- 1989-10-02 JP JP1989115968U patent/JPH0356136U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5494872A (en) * | 1978-01-11 | 1979-07-26 | Cho Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
JPS58175849A (ja) * | 1982-04-08 | 1983-10-15 | Agency Of Ind Science & Technol | 半導体装置 |
JPS63289844A (ja) * | 1987-05-21 | 1988-11-28 | Fuji Electric Co Ltd | 半導体装置のバンプ電極 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004127974A (ja) * | 2002-09-30 | 2004-04-22 | Oki Electric Ind Co Ltd | Cofテープキャリア、半導体素子、半導体装置 |