JPH0356123U - - Google Patents
Info
- Publication number
- JPH0356123U JPH0356123U JP11124789U JP11124789U JPH0356123U JP H0356123 U JPH0356123 U JP H0356123U JP 11124789 U JP11124789 U JP 11124789U JP 11124789 U JP11124789 U JP 11124789U JP H0356123 U JPH0356123 U JP H0356123U
- Authority
- JP
- Japan
- Prior art keywords
- double layer
- layer capacitor
- electric double
- insertion end
- plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims 5
- 238000003780 insertion Methods 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Electric Double-Layer Capacitors Or The Like (AREA)
Description
図はいずれもこの考案の実施例に関するもので
、第1図はコンデンサセル積層体と各リード端子
とを分離して示した第1実施例の斜視図、第2図
は同実施例の側断面図、第3図および第4図は他
の実施例に係る一対のリード端子を示した斜視図
、第5図は第4図の変形例に係る斜視図、第6図
はリード端子の捻り部分を回路基板の取付孔に挿
通した状態を示す横断面図である。
図中、1……電気二重層コンデンサ、2,3…
…コンデンサセル、4……ホルダー、5……スリ
ーブ、6〜11……リード端子、6a〜11a…
…差込み端部、10b……捻り部分、12……回
路基板、13……取付孔である。
The figures all relate to embodiments of this invention; Fig. 1 is a perspective view of the first embodiment showing the capacitor cell laminate and each lead terminal separated, and Fig. 2 is a side cross-sectional view of the same embodiment. Figures 3 and 4 are perspective views showing a pair of lead terminals according to other embodiments, Figure 5 is a perspective view of a modification of Figure 4, and Figure 6 is a twisted portion of the lead terminal. FIG. 3 is a cross-sectional view showing a state in which the circuit board is inserted into a mounting hole of a circuit board. In the figure, 1... electric double layer capacitor, 2, 3...
...Capacitor cell, 4...Holder, 5...Sleeve, 6-11...Lead terminal, 6a-11a...
...Plug-in end, 10b...Twisted portion, 12...Circuit board, 13...Mounting hole.
Claims (1)
陰極面の各々にリード端子を取付けてなる電気二
重層コンデンサにおいて、 回路基板に穿設されている取付孔に対する上記
各リード端子の差込み端部をそれぞれ異なる形状
としたことを特徴とする電気二重層コンデンサ。 (2) 上記各リード端子の差込み端部はそれぞれ
幅の異なる板状に形成されている請求項1に記載
の電気二重層コンデンサ。 (3) 上記各リード端子の差込み端部はほぼ同一
幅の板状体からなり、その一方の差込み端部は他
方の差込み端部に対して所定角度捻られている請
求項1に記載の電気二重層コンデンサ。 (4) 上記一方の差込み端部に形成された捻り部
分を回路基板の取付孔内に位置させてハンダなど
にて固定する請求項3に記載の電気二重層コンデ
ンサ。 (5) 上記リード端子の一方の差込み端部は板状
に形成され、他方の差込み端部は円柱状に形成さ
れている請求項1に記載の電気二重層コンデンサ
。[Scope of Claim for Utility Model Registration] (1) In an electric double layer capacitor in which lead terminals are attached to each of the anode and cathode surfaces of a coin-shaped capacitor cell, the above-mentioned claim for a mounting hole drilled in a circuit board An electric double layer capacitor characterized by having the insertion end of each lead terminal in a different shape. (2) The electric double layer capacitor according to claim 1, wherein the insertion end portions of each of the lead terminals are formed into plate shapes having different widths. (3) The plug-in end of each of the lead terminals is made of a plate-shaped body having approximately the same width, and one of the plug-in ends is twisted at a predetermined angle with respect to the other plug-in end. double layer capacitor. (4) The electric double layer capacitor according to claim 3, wherein the twisted portion formed at the one insertion end is positioned within the mounting hole of the circuit board and fixed with solder or the like. (5) The electric double layer capacitor according to claim 1, wherein one insertion end of the lead terminal is formed into a plate shape, and the other insertion end is formed into a columnar shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11124789U JPH0356123U (en) | 1989-06-02 | 1989-09-22 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6481689 | 1989-06-02 | ||
JP11124789U JPH0356123U (en) | 1989-06-02 | 1989-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0356123U true JPH0356123U (en) | 1991-05-30 |
Family
ID=31718311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11124789U Pending JPH0356123U (en) | 1989-06-02 | 1989-09-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0356123U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006179840A (en) * | 2004-11-25 | 2006-07-06 | Matsushita Electric Ind Co Ltd | Coin-shaped electrochemical element and its manufacturing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6030529B2 (en) * | 1977-04-28 | 1985-07-17 | 日本コンタクトレンズ製造株式会社 | Molding mold for manufacturing silicone resin contact lenses |
JPS61206291A (en) * | 1985-03-09 | 1986-09-12 | 松下電器産業株式会社 | Small electronic component |
JPS6310540B2 (en) * | 1985-05-28 | 1988-03-08 | Chisso Eng Co Ltd | |
JPS63296329A (en) * | 1987-05-28 | 1988-12-02 | Matsushita Electric Ind Co Ltd | Dipole domain capacitor |
-
1989
- 1989-09-22 JP JP11124789U patent/JPH0356123U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6030529B2 (en) * | 1977-04-28 | 1985-07-17 | 日本コンタクトレンズ製造株式会社 | Molding mold for manufacturing silicone resin contact lenses |
JPS61206291A (en) * | 1985-03-09 | 1986-09-12 | 松下電器産業株式会社 | Small electronic component |
JPS6310540B2 (en) * | 1985-05-28 | 1988-03-08 | Chisso Eng Co Ltd | |
JPS63296329A (en) * | 1987-05-28 | 1988-12-02 | Matsushita Electric Ind Co Ltd | Dipole domain capacitor |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006179840A (en) * | 2004-11-25 | 2006-07-06 | Matsushita Electric Ind Co Ltd | Coin-shaped electrochemical element and its manufacturing method |
JP4665513B2 (en) * | 2004-11-25 | 2011-04-06 | パナソニック株式会社 | Method for producing coin-type electrochemical device |