JPH0355242U - - Google Patents
Info
- Publication number
- JPH0355242U JPH0355242U JP11420789U JP11420789U JPH0355242U JP H0355242 U JPH0355242 U JP H0355242U JP 11420789 U JP11420789 U JP 11420789U JP 11420789 U JP11420789 U JP 11420789U JP H0355242 U JPH0355242 U JP H0355242U
- Authority
- JP
- Japan
- Prior art keywords
- circuit configuration
- led
- terminals
- drive
- array chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第１図はこの考案の実施例を示す平面図、第２
図はその側面図、第３図は従来例を示す平面図で
ある。
１１……下側基板、１１１……上側基板、２ａ
〜２ｃ，１２ａ〜１２ｄ……ＬＥＤアレイチツプ
、１３ａ，１３ｂ……ドライブＩＣ、６０〜６３
……端子部、７，７０〜７１……ボンデイングワ
イヤ、８，８０……回路構成。
Figure 1 is a plan view showing an embodiment of this invention, Figure 2 is a plan view showing an embodiment of this invention.
The figure is a side view thereof, and FIG. 3 is a plan view showing a conventional example. 11...Lower substrate, 111...Upper substrate, 2a
~2c, 12a~12d...LED array chip, 13a, 13b...Drive IC, 60~63
...Terminal section, 7,70-71...Bonding wire, 8,80...Circuit configuration.
Claims (1)
たガラスエポキシ樹脂などからなり、回路構成を
備えた下側基板上に同様の素材からなり、同様の
回路構成を具備する上側基板を積層して連着し、
一端をドライブＩＣに結線した前記の回路構成の
一連の端子部を千鳥状に配置させると共に、ボン
デイングワイヤ手段によりこれらの端子部をＬＥ
ＤアレイチツプのＬＥＤ電極部に結線させてなる
ことを特徴とするＬＥＤプリンタにおける基板装
置。 An upper substrate made of the same material and having a similar circuit configuration is laminated and attached on a lower substrate made of glass epoxy resin or the like and having a circuit configuration on which an LED array chip and a drive IC are disposed,
A series of terminals of the circuit configuration described above, one end of which is connected to the drive IC, are arranged in a staggered manner, and these terminals are connected to the LE by means of bonding wires.
A substrate device for an LED printer, characterized in that it is connected to an LED electrode portion of a D-array chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11420789U JPH0355242U (en) | 1989-09-30 | 1989-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11420789U JPH0355242U (en) | 1989-09-30 | 1989-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0355242U true JPH0355242U (en) | 1991-05-28 |
Family
ID=31662586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11420789U Pending JPH0355242U (en) | 1989-09-30 | 1989-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0355242U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003079865A1 (en) * | 2002-03-25 | 2003-10-02 | Toto Ltd. | Make-up mirror unit |
-
1989
- 1989-09-30 JP JP11420789U patent/JPH0355242U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003079865A1 (en) * | 2002-03-25 | 2003-10-02 | Toto Ltd. | Make-up mirror unit |
| CN1294867C (en) * | 2002-03-25 | 2007-01-17 | 东陶机器株式会社 | Dressing mirror unit |
| US7316460B2 (en) | 2002-03-25 | 2008-01-08 | Toto Ltd. | Makeup mirror unit |