JPH0354219A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPH0354219A JPH0354219A JP19119589A JP19119589A JPH0354219A JP H0354219 A JPH0354219 A JP H0354219A JP 19119589 A JP19119589 A JP 19119589A JP 19119589 A JP19119589 A JP 19119589A JP H0354219 A JPH0354219 A JP H0354219A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- epoxy
- polyolefin
- molding material
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 42
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 42
- 239000012778 molding material Substances 0.000 title claims description 24
- 229920000098 polyolefin Polymers 0.000 claims abstract description 20
- 239000005011 phenolic resin Substances 0.000 claims abstract description 9
- -1 polyethylene Polymers 0.000 claims abstract description 9
- 239000004698 Polyethylene Substances 0.000 claims abstract description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 7
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 7
- 229920000573 polyethylene Polymers 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims abstract description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 4
- 239000011256 inorganic filler Substances 0.000 claims description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 8
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 8
- 229920003986 novolac Polymers 0.000 abstract description 7
- 238000000465 moulding Methods 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 239000003086 colorant Substances 0.000 abstract description 3
- 239000005350 fused silica glass Substances 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 3
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野］
本発明は、エポキシ樹脂成形材料に関するものである．
特に射出成形用のエポキシ樹脂成形材料に関するもので
ある．
〔従来技術〕
エポキシ樹脂成形材料は、電気特性、耐湿性、成形性な
どが優れるために、抵抗器、コンデンサトランジスター
ＩＣ，ＬＳＩなどの電子部品の封止に用いられている
．これらの封正方法としては、トランスファー成形によ
る方法が主流となっているが、近年、生産性を向上させ
るために射出成形が検討されている．しかしエポキシ樹
脂成形材料を射出成形すると射出量が安定せず、未充填
が多発するなどの問題があり、実用化されていない．
特に、射出成形に用いられる射出成形材料には、１シッ
ットごとの材料供給量のばらつきが少なく安定した成形
を行うことができることが強く求められている．このた
めに射出成形機のシリンダー内において熱に対して安定
な特性を持ち、均一に溶融する成形材料が期待されてい
る．
〔発明が解決しようとする課題〕
本発明は、射出成形において１シゴットごとの材料供給
量のばらつきが少なく安定した成形を行うことができる
エポキシ樹脂成形材料の射出成形材料を提供することに
ある．
〔課題を解決するための手段〕
本発明者は、上記課題を解決するため、研究を重ねた結
果、射出成形機の溶融バレル内での滑性が不足するため
に射出量が安定しないことをつきとめ、本発明に至った
。すなわち、本発明は（イ）１分子中に２個以上のエポ
キシ基をもつエポキシ樹脂であり、エポキシ当量１８０
〜２２０、軟化点６０〜１００℃のエポキシ樹脂、（ロ
）１分子中に２個以上の水酸基をもつフェノール樹脂で
あり、水酸基当量８０〜１２０、軟化点６０〜１２０℃
のフェノール樹脂、（ハ）無機質充填材、
（二）および、滴点が６０〜１５０″Ｃの範囲にあるポ
リオレフィンで、このポリオレフィンがポリエチレン又
は、ポリプロピレンからなる、および、それらの酸化物
のうち少なくとも１つの化合物をエポキシ樹脂１００重
量部に対して０．１〜１０重量部を含有することを特徴
とするエポキシ樹脂成形材料に係るものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an epoxy resin molding material.
In particular, it concerns epoxy resin molding materials for injection molding. [Prior Art] Epoxy resin molding materials have excellent electrical properties, moisture resistance, moldability, etc., and are therefore used for encapsulating electronic components such as resistors, capacitor transistors, ICs, and LSIs. Transfer molding is the mainstream method for sealing these products, but injection molding has recently been considered to improve productivity. However, when injection molding epoxy resin molding materials are used, there are problems such as unstable injection quantity and frequent unfilling, so it has not been put to practical use. In particular, there is a strong demand for injection molding materials used in injection molding to be able to perform stable molding with little variation in the amount of material supplied from one shot to another. For this reason, there is a need for molding materials that are stable against heat and melt uniformly in the cylinder of an injection molding machine. [Problems to be Solved by the Invention] The object of the present invention is to provide an injection molding material of an epoxy resin molding material that can perform stable molding with little variation in the amount of material supplied from one job to another in injection molding. [Means for Solving the Problems] In order to solve the above problems, the present inventor has conducted repeated research and found that the injection amount is unstable due to lack of lubricity within the melting barrel of an injection molding machine. This discovery led to the present invention. That is, the present invention is (a) an epoxy resin having two or more epoxy groups in one molecule, and having an epoxy equivalent of 180
~220, an epoxy resin with a softening point of 60 to 100°C, (b) a phenolic resin having two or more hydroxyl groups in one molecule, with a hydroxyl equivalent of 80 to 120, and a softening point of 60 to 120°C
(c) an inorganic filler; (ii) a polyolefin having a dropping point in the range of 60 to 150"C, which polyolefin is made of polyethylene or polypropylene; and at least one of their oxides. The present invention relates to an epoxy resin molding material containing 0.1 to 10 parts by weight of one compound per 100 parts by weight of the epoxy resin.
以下、この発明を詳しく説明する．
エポキシ樹脂としては、フェノールノボラソク型エポキ
シ樹脂、タレゾールノボラック型エポキシ樹脂、ビスフ
ェノールＡ型エポキシ樹脂または、これらのハロゲン化
エポキシ樹脂などがあげられ例えば、その中でも１分子
中に２個以上のエポキシ基をもつエポキシ樹脂であり、
エポキシ当量１８０〜２２０、軟化点６０〜１００℃の
ものを単独、もしくは組み合わせて用いることができる
．エポキシ樹脂がこれらに限定されるのは、成形材料と
して混合、加熱、溶融、混練するのに均一性が損なわれ
たり取扱性が悪くなったりするからである．
フェノール樹脂としては、フェノールノボラック樹脂、
タレゾールノボラック樹脂、レゾール樹脂などがあげら
れ例えば、その中でも１分子中に２個以上の水酸基をも
つフェノール樹脂であり、水ｆＩＩ基当量８０〜１２０
、軟化点６０〜１２０℃のものを単独、もしくは組み合
わせて用いることができる．フェノール樹脂がこれらに
限定されるのは、成形材料として混合、加熱、溶融、混
練するのに均一性が損なわれたり取扱性が悪くなったり
するからである．
無機質充填材としては、例えば、溶融シリカ、結晶シリ
カ、タルク、アルミナ、珪酸カルシュウム、炭酸カルシ
ュウム、窒化硅素などの粉末があげられ、単独、もしく
は組み合わせて用いることができる．しかし、電子部品
の封正に供するものであるため、無機質充填材５ｇを純
水４５ｇで９５℃、２０時間抽出したときの抽出水の電
気伝導度が１００μｓ／ ｃｍ以下の高純度な無機質充
填材が好ましい．．
ポリオレフィンは、射出成形機のバレル内での滑性を増
し、成形加工における充填不足の不良を削減するために
必須の戒分てあり、滴点が６０〜１５０“Ｃの範囲のも
のが用いられる。なぜなら、滴点が６０℃未満では、ポ
リオレフィン自体の微粉化が困難で、エポキシ樹脂成形
材料中に均一に混入することができない．１５０’Ｃを
越えるものは、溶融バレル温度６０〜１００″Ｃの範囲
において滑性効果が弱いからである。また、ポリオレフ
ィンの種類としては、ポリエチレン又は、ポリブロビレ
ンおよび、これらの酸化物を挙げることができ、これら
いずれかの単独または、組合せで用いることができ、ポ
リオレフィンの配合量としては、エポキシ樹脂１００重
量部に対して０．１〜１０重量部の範囲で用いることが
できる．なぜなら、０．１重量部未満では、溶融バレル
内での滑性を高める効果が認められず、１０重量部を越
えると素子、リー ドフレームなどを含む電子部品との
密着性が著しく低下し、その結果、電子部品の耐湿性が
悪くなり封止効果に乏しいからである．なお、本発明の
エポキシ樹脂成形材料の配合戒分としては、以上の他に
、硬化促進剤、離型剤、着色剤としては通常使用される
ものをそのまま適用することができる。This invention will be explained in detail below. Examples of epoxy resins include phenol novolac type epoxy resins, talesol novolak type epoxy resins, bisphenol A type epoxy resins, and halogenated epoxy resins thereof. It is an epoxy resin with a group of
Those having an epoxy equivalent of 180 to 220 and a softening point of 60 to 100°C can be used alone or in combination. The reason why epoxy resins are limited to these is that when mixed, heated, melted, and kneaded as a molding material, uniformity is impaired and handling becomes difficult. Examples of phenolic resins include phenol novolak resin,
Talesol novolac resin, resol resin, etc. are mentioned, and among them, for example, it is a phenol resin having two or more hydroxyl groups in one molecule, and has a water fII group equivalent of 80 to 120.
, those having a softening point of 60 to 120°C can be used alone or in combination. The reason why phenolic resins are limited to these is that when mixed, heated, melted, and kneaded as a molding material, uniformity is impaired and handling becomes difficult. Examples of inorganic fillers include powders such as fused silica, crystalline silica, talc, alumina, calcium silicate, calcium carbonate, and silicon nitride, which can be used alone or in combination. However, since it is used for sealing electronic parts, it is a high-purity inorganic filler whose electrical conductivity of the extracted water is 100 μs/cm or less when 5 g of inorganic filler is extracted with 45 g of pure water at 95°C for 20 hours. is preferable. ．． Polyolefin is essential for increasing lubricity within the barrel of an injection molding machine and reducing defects due to insufficient filling during the molding process, and polyolefins with a dropping point in the range of 60 to 150"C are used. This is because if the dropping point is less than 60°C, it is difficult to micronize the polyolefin itself and it cannot be mixed uniformly into the epoxy resin molding material.If the dropping point exceeds 150'C, the melting barrel temperature is 60 to 100'C. This is because the lubricity effect is weak in the range of . Further, the types of polyolefins include polyethylene, polybrobylene, and oxides thereof, and any of these can be used alone or in combination, and the amount of polyolefin blended is 100 parts by weight of the epoxy resin. It can be used in the range of 0.1 to 10 parts by weight. This is because if the amount is less than 0.1 part by weight, no effect of increasing the slipperiness within the melting barrel will be observed, and if it exceeds 10 parts by weight, the adhesion to electronic components including elements, lead frames, etc. will be significantly reduced. As a result, the moisture resistance of electronic components deteriorates and the sealing effect is poor. In addition to the above-mentioned ingredients, commonly used curing accelerators, mold release agents, and coloring agents can be used as they are in the epoxy resin molding material of the present invention.
また、以上の配合戒分をエポキシ樹脂成形材料とするの
には、配合威分を均一に混合し、加熱溶融、冷却、粉砕
の通常のプロセスで製造することができ、この際に使用
される装置も通常使用されるものをそのまま適用するこ
とができる．次に本発明を実施例と比較例によって具体
的に説明する．
〔実施例〕
実施例 １〜５
（イ）のエポキシ樹脂としては、エポキシ当１２００、
軟化点８０℃のオルソータレゾールノボランクエポキシ
樹脂（０−ＣＮエポキシ樹脂）を単独またはこれにエポ
キシ当量２８５、軟化点８５℃のブロム化エポキシ樹脂
でを組合せて用いた．（口）のフェノール樹脂としては
、水酸基当量１０５、軟化点１００℃のフェノールノボ
ラック樹脂を用いた．
（ハ）の無機質充填材としては、平均粒子径ｌ４μ−、
抽出水の電気伝導度３ Ｂ．ｓ ／ ｃｍ の溶融シ
リカまたは、平均粒子径１４μ慣、抽出水の電気伝導度
８μｓ／ ｃｍ の結晶シリカを用いた。In addition, in order to make the above compounded ingredients into an epoxy resin molding material, the compounded ingredients can be uniformly mixed and manufactured by the usual process of heating and melting, cooling, and pulverizing. The equipment that is normally used can be used as is. Next, the present invention will be specifically explained using examples and comparative examples. [Example] Examples 1 to 5 The epoxy resin of (a) was epoxy 1200,
An orthotalesol novolanque epoxy resin (0-CN epoxy resin) with a softening point of 80°C was used alone or in combination with a brominated epoxy resin with an epoxy equivalent of 285 and a softening point of 85°C. As the phenol resin (portion), a phenol novolak resin with a hydroxyl equivalent of 105 and a softening point of 100°C was used. The inorganic filler (c) has an average particle diameter of 14μ-,
Electrical conductivity of extracted water 3 B. Fused silica with a particle diameter of 14 μs/cm or crystalline silica with an average particle size of 14 μs/cm and an electrical conductivity of extracted water of 8 μs/cm was used.
（二）ポリオレフィンとしては、ポリエヂレン（ＰＥ）
、酸化１８の酸化ポリエチレン（ＯＰＥ）ン、ポリプロ
ピレン（ＰＰ）で所定の滴点のものをいずれか１つ用い
た．
その他、硬化促進剤としてトリフエニルホスフィン，難
燃剤どして三酸化アンチモン、着色剤としてカーボンフ
゛ランク、カンフ゛リング剤としＴ−グリシドキシブロ
ビルトリメトキシラン、離型剤としてステアリン酸亜鉛
をそれぞれ用いた．以上の配合或分の配合量を各実施例
ごとにそれぞれ第１表の上段に示した．各実施例の配合
戒分を均一に混合し、ロール温度１０Ｏ℃のミキシング
ロールで加熱、溶融、混練した後、冷却し、粉砕して各
エポキシ樹脂成形材料を得た．
以上で得た各エポキシ樹脂成形材料を用いて１５０トン
射出成形機で１シッ７｝ごとの材料供給量のばらつきを
、１５０トン射出成形機のバレル温度８０゛Ｃ、スクリ
ュウ回転数３０ｒｐｍ、背圧３０ ｋｇ／ｃｄの条件で
射出．１ｔｉｔ１００ｇになるように設定し、空射出に
よって得られた２５回の射出成形物の重量を精秤し、そ
の重量ばらつき（σ．，）を求めた．これらの結果を第
１表下段に示した。(2) As polyolefin, polyethylene (PE)
, oxidized polyethylene (OPE) with oxidation level 18, and polypropylene (PP) with a specified dropping point were used. In addition, triphenylphosphine is used as a curing accelerator, antimony trioxide is used as a flame retardant, carbon black is used as a coloring agent, T-glycidoxybrobyltrimethoxylane is used as a camping agent, and zinc stearate is used as a mold release agent. there was. The proportions of the above formulations are shown in the upper row of Table 1 for each example. The ingredients of each example were uniformly mixed, heated, melted, and kneaded using a mixing roll at a roll temperature of 100°C, cooled, and pulverized to obtain each epoxy resin molding material. Using each of the epoxy resin molding materials obtained above, the variation in the amount of material fed per 150 ton injection molding machine was measured at a barrel temperature of 80°C, a screw rotation speed of 30 rpm, and a back pressure of the 150 ton injection molding machine. Injection under the condition of 30 kg/cd. The weight of the injection molded products obtained by blank injection was accurately weighed 25 times, and the weight variation (σ.,) was determined. These results are shown in the lower part of Table 1.
また同し射出成形機に１６０ＩＰ成形品の４０個取り金
型を取付け、金型温度１８０℃，成形時間６０秒で成形
し、この１６０ｒＰ成形品を３０倍顕微鏡で検査を行い
、外観の未充填を評価した．この結果も第１表下段に示
した．さらに、５μ一幅のアルミニウム配線回路を表面
に配設したシリコンチップの評価用素子を１５０ＩＰ成
形品として成形し、この１６ＤＩＰ成形品をプレンシャ
ーク・Ｉカテスト（ＰＣＴ）の３気圧（１３１℃）下で
５００時間処理し、５μ増幅のアルミニウム配線回路の
導通不良で成形品の耐湿性の評価した．ここで、導通不
良率は、（導通不良の回路数／全回路数）ＸＩＯＯで求
めた．これらの結果も第１表下段に示した．
比較例 ｌ
実施例１の配合からポリオレフィンを除いた以外は、実
施例１と同様に実施した。In addition, a 40-cavity mold for a 160 IP molded product was attached to the same injection molding machine, and molding was performed at a mold temperature of 180°C and a molding time of 60 seconds. was evaluated. The results are also shown in the lower part of Table 1. Furthermore, a silicon chip evaluation element with a 5μ width aluminum wiring circuit arranged on the surface was molded as a 150IP molded product, and this 16DIP molded product was heated to 3 atm (131°C) using Prenshark I-Katest (PCT). The molded product was treated for 500 hours and the moisture resistance of the molded product was evaluated based on poor conductivity in the aluminum wiring circuit with 5μ amplification. Here, the continuity failure rate was determined by (number of circuits with failure continuity/total number of circuits) XIOO. These results are also shown in the lower part of Table 1. Comparative Example 1 The same procedure as in Example 1 was carried out except that the polyolefin was removed from the formulation in Example 1.
比較例 ２〜４
実施例ｌのポリオレフＡンの種類、滴点、配合量を変え
るとともに、他に二酸化アンチモン、ステアリン酸亜鉛
の添加の有無、無機質充填材の種類をそれぞれ第１表に
示した配合或分に変えて実施例ｌと同様に実施た．
第１表下段の評価結果より、ポリオレフィンを離型剤と
併用した実施例ｌ、５やポリオレフィンを用いた実施例
２、３、４においては、比較例１に比べ、射出成形機で
の１シッットごとの材料供給量のばらつき、成形品の未
充填の発生率、成形品の耐湿性を示す導通不良率のいず
れの評価においても著しく向上していることが確認でき
た．しかし、これらポリオレフィンの使用にあたって、
配合量がエポキシ樹脂１００重量部に対して０．１〜１
０重量部の範囲外、すなわち、比較例３、４の場合、ポ
リオレフィンの演点が６０〜１５０℃の範囲外、すなわ
ち、比較例２の場合は、実施例に比べていずれも射出成
形機での１ショットごとの材料供給量のばらつきは大き
く、また成形品の未充填の発生率、成形品の耐湿性を示
す導通不良率についても悪い場合があり、ポリオレフィ
ンは前記の配合量と滴点の範囲に限定される必要がある
．
（以 下 余 白）
〔発明の効果］
本発明による新規なエポキシ樹脂成形材料は、射出成形
において１ショットごとの材料供給量のばらつきが少な
いので、安定して射出成形を行うことができる効果をも
つ．さらに、このために得られる成形品に未充填の発生
が無く、素子、リードフレームなどを含む電子部品成形
品での密着性も良好なことから耐湿性に優れた成形品を
得ることができるのである。Comparative Examples 2 to 4 In addition to changing the type, dropping point, and blending amount of polyolefin A in Example 1, the presence or absence of addition of antimony dioxide and zinc stearate, and the type of inorganic filler are shown in Table 1. The same procedure as in Example 1 was carried out with some changes in the formulation. From the evaluation results in the lower row of Table 1, it can be seen that in Examples 1 and 5, in which polyolefin was used in combination with a mold release agent, and in Examples 2, 3, and 4, in which polyolefin was used, 1-sit performance with an injection molding machine was lower than in Comparative Example 1. It was confirmed that there was a significant improvement in the evaluation of variations in the amount of material supplied, the incidence of unfilled molded products, and the conductivity failure rate, which indicates the moisture resistance of molded products. However, when using these polyolefins,
The blending amount is 0.1 to 1 per 100 parts by weight of epoxy resin.
0 parts by weight, that is, in Comparative Examples 3 and 4, and the point of polyolefin was outside the range of 60 to 150°C, that is, in Comparative Example 2, compared to Examples, both injection molding machines There is a large variation in the amount of material supplied per shot, and the rate of unfilled molded products and the conductivity failure rate, which indicates the moisture resistance of molded products, may also be poor. It needs to be limited in scope. (Margins below) [Effects of the Invention] The novel epoxy resin molding material of the present invention has the effect of stably performing injection molding because there is little variation in the amount of material supplied from one shot to another during injection molding. Motsu. Furthermore, the resulting molded product does not have any unfilled parts and has good adhesion to electronic component molded products including elements, lead frames, etc., making it possible to obtain molded products with excellent moisture resistance. be.
Claims (5)
ポキシ樹脂であり、エポキシ当量１８０〜２２０、軟化
点６０〜１００℃のエポキシ樹脂、（ロ）１分子中に２
個以上の水酸基をもつフェノール樹脂であり、水酸基当
量８０〜１２０、軟化点６０〜１２０℃のフェノール樹
脂、 （ハ）無機質充填材、 （ニ）および、滴点が６０〜１５０℃の範囲にあるポリ
オレフィンを含有し、エポキシ樹脂１００重量部に対し
て０．１〜１０重量部を含有することを特徴とするエポ
キシ樹脂成形材料。(1) (a) An epoxy resin having two or more epoxy groups in one molecule, with an epoxy equivalent of 180 to 220 and a softening point of 60 to 100°C, (b) An epoxy resin with two or more epoxy groups in one molecule.
A phenolic resin having a hydroxyl group of 80 to 120, a softening point of 60 to 120°C, (c) an inorganic filler, and (d) a dropping point in the range of 60 to 150°C. An epoxy resin molding material containing polyolefin in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of an epoxy resin.
ール樹脂５〜１０重量部、前記無機質充填材を７０〜８
５重量部の範囲によって配合してなることを特徴とする
請求項１記載のエポキシ樹脂成形材料。(2) 10 to 20 parts by weight of the epoxy resin, 5 to 10 parts by weight of the phenolic resin, and 70 to 8 parts by weight of the inorganic filler.
The epoxy resin molding material according to claim 1, wherein the epoxy resin molding material is blended in a range of 5 parts by weight.
する請求項１または、２記載のエポキシ樹脂成形材料。(3) The epoxy resin molding material according to claim 1 or 2, wherein the polyolefin is an oxide.
特徴とする請求項１、２、または、３のいずれか記載の
エポキシ樹脂成形材料。(4) The epoxy resin molding material according to any one of claims 1, 2, or 3, wherein the polyolefin is polyethylene.
を特徴とする請求項１、２、または、３のいずれか記載
のエポキシ樹脂成形材料。(5) The epoxy resin molding material according to any one of claims 1, 2, or 3, wherein the polyolefin is polypropylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19119589A JPH0354219A (en) | 1989-07-24 | 1989-07-24 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19119589A JPH0354219A (en) | 1989-07-24 | 1989-07-24 | Epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0354219A true JPH0354219A (en) | 1991-03-08 |
Family
ID=16270487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19119589A Pending JPH0354219A (en) | 1989-07-24 | 1989-07-24 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0354219A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011132408A1 (en) * | 2010-04-23 | 2011-10-27 | パナソニック電工株式会社 | Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6155151A (en) * | 1984-08-27 | 1986-03-19 | Mitsui Toatsu Chem Inc | Thermosetting resin molding material |
| JPS61138618A (en) * | 1984-12-10 | 1986-06-26 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor |
| JPS63210121A (en) * | 1987-02-27 | 1988-08-31 | Mitsui Petrochem Ind Ltd | Injection-moldable epoxy resin composition |
-
1989
- 1989-07-24 JP JP19119589A patent/JPH0354219A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6155151A (en) * | 1984-08-27 | 1986-03-19 | Mitsui Toatsu Chem Inc | Thermosetting resin molding material |
| JPS61138618A (en) * | 1984-12-10 | 1986-06-26 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor |
| JPS63210121A (en) * | 1987-02-27 | 1988-08-31 | Mitsui Petrochem Ind Ltd | Injection-moldable epoxy resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011132408A1 (en) * | 2010-04-23 | 2011-10-27 | パナソニック電工株式会社 | Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board |
| TWI449749B (en) * | 2010-04-23 | 2014-08-21 | Panasonic Corp | Epoxy resin composition, prepreg, metal-clad laminate and print wiring board |
| JP5651169B2 (en) * | 2010-04-23 | 2015-01-07 | パナソニック株式会社 | Epoxy resin composition, prepreg, metal-clad laminate and printed wiring board |
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