JPH0353887U - - Google Patents
Info
- Publication number
- JPH0353887U JPH0353887U JP11534389U JP11534389U JPH0353887U JP H0353887 U JPH0353887 U JP H0353887U JP 11534389 U JP11534389 U JP 11534389U JP 11534389 U JP11534389 U JP 11534389U JP H0353887 U JPH0353887 U JP H0353887U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting bracket
- flexible printed
- printed board
- reinforcing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims 3
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11534389U JPH0353887U (en:Method) | 1989-09-30 | 1989-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11534389U JPH0353887U (en:Method) | 1989-09-30 | 1989-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353887U true JPH0353887U (en:Method) | 1991-05-24 |
Family
ID=31663673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11534389U Pending JPH0353887U (en:Method) | 1989-09-30 | 1989-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353887U (en:Method) |
-
1989
- 1989-09-30 JP JP11534389U patent/JPH0353887U/ja active Pending
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