JPH0353854U - - Google Patents

Info

Publication number
JPH0353854U
JPH0353854U JP11537189U JP11537189U JPH0353854U JP H0353854 U JPH0353854 U JP H0353854U JP 11537189 U JP11537189 U JP 11537189U JP 11537189 U JP11537189 U JP 11537189U JP H0353854 U JPH0353854 U JP H0353854U
Authority
JP
Japan
Prior art keywords
insulating layer
semiconductor element
lead frame
chip component
discrete chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11537189U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11537189U priority Critical patent/JPH0353854U/ja
Publication of JPH0353854U publication Critical patent/JPH0353854U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
JP11537189U 1989-09-29 1989-09-29 Pending JPH0353854U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11537189U JPH0353854U (fr) 1989-09-29 1989-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11537189U JPH0353854U (fr) 1989-09-29 1989-09-29

Publications (1)

Publication Number Publication Date
JPH0353854U true JPH0353854U (fr) 1991-05-24

Family

ID=31663702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11537189U Pending JPH0353854U (fr) 1989-09-29 1989-09-29

Country Status (1)

Country Link
JP (1) JPH0353854U (fr)

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