JPH0351860U - - Google Patents
Info
- Publication number
- JPH0351860U JPH0351860U JP11365089U JP11365089U JPH0351860U JP H0351860 U JPH0351860 U JP H0351860U JP 11365089 U JP11365089 U JP 11365089U JP 11365089 U JP11365089 U JP 11365089U JP H0351860 U JPH0351860 U JP H0351860U
- Authority
- JP
- Japan
- Prior art keywords
- view
- showing
- hybrid
- perspective
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11365089U JPH0351860U (bg) | 1989-09-28 | 1989-09-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11365089U JPH0351860U (bg) | 1989-09-28 | 1989-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0351860U true JPH0351860U (bg) | 1991-05-20 |
Family
ID=31662057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11365089U Pending JPH0351860U (bg) | 1989-09-28 | 1989-09-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0351860U (bg) |
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1989
- 1989-09-28 JP JP11365089U patent/JPH0351860U/ja active Pending