JPH0351840U - - Google Patents
Info
- Publication number
- JPH0351840U JPH0351840U JP11307989U JP11307989U JPH0351840U JP H0351840 U JPH0351840 U JP H0351840U JP 11307989 U JP11307989 U JP 11307989U JP 11307989 U JP11307989 U JP 11307989U JP H0351840 U JPH0351840 U JP H0351840U
- Authority
- JP
- Japan
- Prior art keywords
- back side
- chip
- semiconductor device
- conductive material
- penetrating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11307989U JPH0351840U (tr) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11307989U JPH0351840U (tr) | 1989-09-26 | 1989-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351840U true JPH0351840U (tr) | 1991-05-20 |
Family
ID=31661505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11307989U Pending JPH0351840U (tr) | 1989-09-26 | 1989-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351840U (tr) |
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1989
- 1989-09-26 JP JP11307989U patent/JPH0351840U/ja active Pending