JPH0351829U - - Google Patents
Info
- Publication number
- JPH0351829U JPH0351829U JP11465889U JP11465889U JPH0351829U JP H0351829 U JPH0351829 U JP H0351829U JP 11465889 U JP11465889 U JP 11465889U JP 11465889 U JP11465889 U JP 11465889U JP H0351829 U JPH0351829 U JP H0351829U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- surface mounting
- component body
- solder resist
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11465889U JPH0351829U (en18) | 1989-09-28 | 1989-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11465889U JPH0351829U (en18) | 1989-09-28 | 1989-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351829U true JPH0351829U (en18) | 1991-05-20 |
Family
ID=31663014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11465889U Pending JPH0351829U (en18) | 1989-09-28 | 1989-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351829U (en18) |
-
1989
- 1989-09-28 JP JP11465889U patent/JPH0351829U/ja active Pending