JPH0351552B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a polishing device for polishing flat surfaces of metal parts, ceramic substrates, and the like.

(Prior art) In order to polish flat surfaces such as metal parts, there are two methods: a lapping method that uses alundum, carborundum, etc. as free abrasive grains, and a fixed abrasive method in which the abrasive grains are fixed in a lapping disk by embedding or the like. Generally, the lapping method using a grinder and the grinding method using a surface grinder are adopted, but in the lapping method using free abrasive grains, many workpieces are processed in batches for a long time, so only one workpiece is polished. It is not possible to perform in-line processing by processing one piece, and therefore it is difficult to process workpieces in a short time while stably maintaining dimensional accuracy and finishing performance. Since these are held between disks and polished simultaneously by batch processing for a long time, a large amount of semi-finished products are required to be stocked during processing or between processes, resulting in an increase in the amount of inventory. Moreover, since a large amount of fine abrasive grains are used,
Running costs are high and the working environment deteriorates due to the generation of dust, which makes it difficult to create a line that can be linked with precision processing machines. Furthermore, there is a lot of uneven wear on the lapping disc, and correcting this is troublesome and time consuming, lowering the operating rate and further increasing running costs.Moreover, it is difficult to manage the lapping fluid used during machining. There are disadvantages such as the need for short-time adjustment. In addition, this method requires a small amount of processing per unit time, and generally requires two or more processing steps such as rough wrapping and precise wrapping, and the processing equipment as a whole becomes large and expensive. On the other hand, in the fixed abrasive lapping method, the lapping disk in the previous method is simply replaced with a lapping disk containing abrasive grains, so there are virtually no distinguishing features;
It is prone to clogging, and even if a thin-film grindstone similar to sandpaper is used, it wears out quickly, requiring frequent replacement, which significantly increases running costs, and it is extremely difficult to correct wear, making it difficult to process. The amount is also not much different from that of free abrasive grains. Furthermore,
In the grinding method using a surface grinder, both the workpiece and the grinding wheel are firmly fixed, so the accuracy of the mechanical equipment directly reflects the accuracy of the finished surface of the workpiece.
Mechanical equipment becomes expensive. In addition, it is quite difficult to achieve a finished surface roughness comparable to that of the lapping method, and even with the grinding method using a disc-shaped grindstone, if the machining allowance is large and the machining is performed for a short time, the wear of the grindstone is severe, and the finished surface accuracy is poor. There are also problems such as difficulty in discharging.

(Problems to be Solved by the Invention) The present invention aims to solve the above-mentioned problems and to sequentially transfer workpieces from a supply device to a grinding wheel and a carry-out device using a one-piece processing method instead of a batch method. The workpiece is transferred to a fixed abrasive grinding wheel with the polishing surface facing upward, and brought into contact with the grinding wheel via a pressurizing device, giving the workpiece rotation and oscillating motion, and appropriately setting and controlling the processing pressure. It is an object of the present invention to provide a polishing device that can be incorporated into the polishing device to efficiently obtain a good finished surface roughness.

(Means for Solving the Problems) A polishing apparatus according to the present invention that attempts to solve the above-mentioned problems has a workpiece supply device, a polishing wheel, and a carry-out device disposed on a machine stand, and a A swinging arm is provided that passes above each of the supply device, the polishing grindstone, and the carrying-out device while horizontally swinging above the grindstone, and the swing arm has an autorotation device for the workpiece that can be moved up and down via the processing device. and a gripping device for gripping a workpiece below the rotating device, wherein the pressing device has a downward vertical axis rotatable in forward and reverse directions on the swinging arm. The ball screw part formed in the lower part of the shaft is screwed into the vertical pressurizing hole formed in the casing to the elevating body inserted so that it can only slide up and down. A coil spring for increasing/decreasing the pressing force is inserted into the lower side of the elevating body, and the workpiece gripped by the gripping device during polishing is expanded by the expansion of the coil spring as the elevating body moves up and down as the vertical axis rotates. It is characterized in that the applied processing pressure can be controlled arbitrarily.

(Examples) Next, the present invention will be described in detail based on illustrated examples.

In Figures 1 and 2, reference numeral 1 denotes a box-shaped machine base with an inclined top plate 2, and a support 3 is vertically installed on the machine base 1. As shown, a workpiece supply device 4 and a polishing wheel 5 delivery device 6 are arranged around the support 3, respectively.
The supply device 4 and the removal device 6 are both in the form of a vibrating conveyor or a chute, and are located on the top plate 2. The grinding wheel 5 is in the form of a rotating disk such as a metal bond grinding wheel, and is supported by a bearing 7 held on the top plate 2 so as to be horizontally rotatable with the polishing surface facing upward. , is connected to a vertical drive shaft 9 supported within a gearbox 8 connected below the bearing 7. A V pulley 10 is fixed to this drive shaft 9, and the V pulley 10 is connected to the V pulley 13 of the motor 12 attached to the side wall 11 of the machine base 1.
They are connected by a belt 14, whereby the abrasive wheel 5 is rotated by a motor 12 via a gearbox 8. Reference numeral 15 denotes a swinging arm attached to the support column 3, and its cylindrical base 16 is rotatably fitted onto the support column 3 by a bearing (not shown). It is configured to horizontally rotate around the support 3 so that it is sequentially positioned over the supply device 4, the polishing wheel 5, and the carry-out device 6. As shown in FIG. 2, this rotation is achieved by attaching a sector gear 18 horizontally fixed to the upper end of the support column 3 to a base 19 projecting horizontally from the upper end of the base 16 of the swing arm 15. This is performed by a rotation mechanism formed by engaging the pinion 21 of the drive shaft of the motor 20.
That is, the pinion 21 is driven by the motor 20.
When the pinion 21 rotates, the pinion 21 is meshed with the sector gear 18 fixed to the support column 3, so it rolls along the tooth profile of the sector gear 18. Therefore, the swing arm 15 moves along the tooth surface of the sector gear 18. , motor 20
The arm part 17 is positioned on the supply device 4, the polishing wheel 5, and the carry-out device 6 in sequence. In particular, as shown in FIG. 3, when the arm part 17 is positioned on the polishing wheel 5, the control circuit of the motor 20 is set so that the motor 20 can be rotated in forward and reverse directions by a predetermined number of rotations. 17 is configured to perform horizontal swinging motion on the polishing whetstone 5. Reference numeral 22 denotes a pressure device that lifts and lowers a rotating device for the workpiece, which will be described later, in order to press the workpiece against the polishing wheel 5 with an appropriate pressure;
As shown in the figure, it is provided on the swing arm 15. A vertical pressurizing hole 24 is formed in the casing 23 of the pressurizing device 22, and a lid 25 is fixed to the upper opening thereof. An elevating body 26 having a ball screw portion formed in the center is inserted into the intermediate portion of the pressurizing hole portion 24 so as to be able to slide vertically. A rotation prevention mechanism (not shown) provided between the pressurizing hole 24 and the pressurizing hole 24 prevents rotation. In addition, a coil spring 27 for balancing the weight of the casing 23 including the rotation device of the workpiece, the lid 25, the lifting body 26, etc. is housed in the upper part of the pressurizing hole 24 defined by the lifting body 26. On the other hand, a coil spring 28 for polishing is housed in the lower part, and is loosely fitted into the lid 25 and inserted into the ball screw part of the elevating body 26 located in the middle of the springs. A vertical shaft 29 is threadedly inserted through a ball screw portion formed on the outer periphery of the vertical shaft 29.
The upper side of the base 30 is rotatably suspended from the base 30 through a bearing 32 held by a cover 31 in a hole in the base 30 horizontally protruding from the arm 17. . That is, the casing 23 and the like including the rotation device are suspended from the base 30, that is, the swing arm 15, by the elastic force of the coil spring 27 on the elevating body 26 screwed onto the vertical shaft 29. Further, as shown in FIG. 2, a sliding engagement portion 33 is protruded on the surface of the casing 23 facing the arm portion 17, and a sliding engagement portion 33 is provided on the surface of the arm portion 17 opposite to this. Joint part 33
A guide groove 34 corresponding to the vertical direction is formed,
Due to this engagement between the two, the casing 23 can be moved up and down in the vertical direction along the arm portion 17.
The upper end of the vertical shaft 29 is connected to the drive shaft of a motor 35 attached to the base 30 via a joint (not shown), and the forward and reverse rotation of the motor 35 causes the elevating body to
6 ascends and descends along the vertical axis 29, and when the elevating body 26 descends, the lower coil spring 28 is pressurized, this pressurizing force is transmitted to the casing 23, and the casing 23 is guided by the guide groove 34 and descends. However, when the elevating body 26 rises, the pressure applied to the coil spring 28 begins to decrease, and the upper coil spring 27 is pressurized. When the force, the elastic force of the coil spring 28, and the weight of the casing 23 and the like are balanced, the casing 23 stops and is suspended from the vertical shaft 29. Reference numeral 36 denotes an autorotation device for the workpiece held in the casing 23 on the side of the pressurizing device 22, and the autorotating device 36 is provided so as to be movable up and down via the pressurizing device 22. This rotation device 36 is connected to the casing 23
The rotation shaft 39 is supported by a pair of bearings 38 in the rotation hole 37 formed in parallel with the pressure hole 24, and the upper end of the rotation shaft 39 is connected to the casing 2.
It is connected via a joint 42 to the drive shaft of a motor 41 attached to a bracket 40 protruding from 4.
3 are upper and lower lid bodies, respectively. Also, the rotation axis 3
A protector 46, which has a spherical joint 44 protruding from the center and has a cylindrical side wall 45 spaced apart from the side surface of the spherical joint 44, is concentrically fixed to the lower end of the 9 with bolts or the like. side wall 4
5 includes a housing 47 whose upper side is fitted and held so as to be movable such as rotation and tilting around the spherical joint 44.
A locking portion 48 for positioning the workpiece is provided on the lower side of the housing 47, and the upper surface of the workpiece is locked to the locking portion 48, and the rotation device 36 is rotated by the pressurizing device 22. At the same time, the workpiece is attached to the upper surface of the grinding wheel 5 using the spherical joint 44 while rotating the rotating shaft 39 by the motor 41.
As a result, the workpiece is rotated and polished by the rotation of the rotation shaft 39. Reference numeral 50 denotes a gripping device for gripping the workpiece below the rotation device 36, and is provided at the lower part of the swinging arm 15. The gripping device 50 is composed of a pair of gripping arms 52 that are opened by a fluid cylinder 51. has been done. Further, a cooling liquid tank 53 is installed on the side of the machine stand 1, and the cooling liquid in the tank 53 is sent by an attached pump 54 through a cooling liquid pipe 55 to the polishing section by the polishing wheel 5. After injection, the liquid is refluxed into the tank 53 from the inclined upper surface liquid 2, and 56 is a stirrer,
W indicates a workpiece.

(Function) In a device configured in this way, first, the motor 1
2 to rotate the drive shaft 9 via the V-pulley 13, V-belt 14, and V-pulley 10, and rotate the grindstone shaft via the gearbox 8 at a speed of, for example, 50 to 500 m/min.
While rotating the polishing wheel 5 and driving the pump 54 to supply and circulate the coolant to the polishing section through the coolant pipe 55, the swing arm 1
5 is placed on the supply device 4. Next, the workpiece W is fed to a predetermined position by the feeding device 4, and then the motor 35 of the pressurizing device 22 is started to rotate the vertical shaft 29 and the elevating body 26 is lowered. As a result, the lower coil spring 28 inside the pressurizing hole 24
is pressurized and the casing 23 is lowered by its elastic force, and at the lower end, the fluid cylinder 51 of the gripping device 50 is operated and the workpiece W is gripped between the gripping arms 52. After that, the vertical shaft 29 is
is rotated in the opposite direction to raise the elevating body 26, and by releasing the pressure on the coil spring 28, the casing 23 returns to its original position together with the gripping device 50 that grips the workpiece W. Subsequently, the motor 20 is started, and the swing arm 15 is moved to the sector gear 18 and the pinion 2.
1, the casing 23 horizontally rotates about the support 3 and is positioned on the polishing wheel 5 as shown in FIG. At the lower end, the fluid cylinder 51 operates in reverse and the gripping arm 5
2 is opened, and the workpiece W is released and placed on the polishing wheel 5. At the same time, the motor 35 is further rotated slightly, and the vertical shaft 29, the elevating body 26, and the coil spring 28 are rotated.
The casing 23 and the rotating shaft 39 are slightly lowered through the
4. It is uniformly pressed against the upper surface of the polishing wheel 5 via the housing 47. Furthermore, at the same time, motor 2
0 is rotated forward and backward by a predetermined number of rotations, and the swinging arm 1
5 performs a rocking motion as indicated by the arrow T in FIG. 3, and the motor 41 is started to rotate the rotation shaft 39. As a result of the above, the workpiece W rotates while swinging on the polishing whetstone 5, and is subjected to polishing in the first low pressure state. After the predetermined polishing time has elapsed in this manner, the motor 35 is rotated again to remove the casing 23 and the rotating shaft 39 in the same manner as described above.
is lowered by a predetermined distance, and the pressing force of the workpiece W against the polishing wheel 5 is increased compared to the general level to perform secondary processing. During the above period, the swinging arm 15 continues its swinging motion. After a predetermined period of time has elapsed, the motor 35 is rotated slightly in the reverse direction to slightly raise the rotating shaft 39 together with the casing 23, and the machining pressure applied to the workpiece W is slightly reduced, and the polishing work is performed in this reduced pressure state. When this is completed, the motor 41 is stopped to stop the rotating shaft 39, and the fluid ring 51 is activated to stop the workpiece W.
is gripped by the gripping arm 52. Thereafter, the forward and reverse rotation of the motor 20 is stopped to stop the swinging of the swinging arm 15, and the vertical shaft 29 of the pressurizing device 22 is reversely rotated by the motor 35 to raise the casing 23, thereby completing the polishing process. The object W also rises and leaves the top of the polishing wheel 5, and at the rising end, the motor 20
is started in reverse rotation. Now, the pinion 21 rolls on the sector gear 18 in the opposite direction to the above, the swing arm 15 horizontally rotates in the opposite direction about the support 3, and the workpiece W rotates onto the unloading device 6. At this point, the motor 20 is stopped and the swing arm 15 is stopped. At this position, the motor 35 is rotated, the gripping device 50 is lowered together with the casing 23, and the workpiece W is
is placed on the unloading device 6, and the fluid cylinder 51 is operated in reverse to release the workpiece W. The workpiece W is now delivered to a predetermined location by the operation of the delivery device 6. Thereafter, the motor 35 is reversely rotated to raise the casing 23, and after being raised, the motor 20 is rotated to return the swinging arm 15 onto the supply device 4. Thereafter, the above-described operations are repeated to continue polishing the workpieces W that are sequentially fed onto the supply device 4.

As is clear from the above explanation, the present invention does not use a polishing method that uses free abrasive grains as the main polishing agent, but mainly uses a rotating disk-shaped polishing wheel such as a metal bonded grindstone, so there is no generation of dust. Therefore, the work environment can be maintained in a good condition, and therefore it can be installed in the equipment line of precision machinery, and the rotation speed of the abrasive wheel is relatively lower than that of the wheel rotation speed for general grinding work. There is less vibration and coolant scattering, which is advantageous in terms of safety, and the whetstone has less wear and can maintain its flatness for a long time, so it can be used for a long time, lowering running costs, and it maintains sharpness and maintains a moderate level of sharpness. Has dressing properties. In addition, the workpiece is rotated and oscillated in close contact with the upper surface of the grinding wheel, which is rotating on a vertical axis, and the processing pressure can be increased or decreased during the polishing process, so the wear of the grinding wheel is uniform. In addition, the polishing trajectory of the workpiece becomes in an unspecified direction, and the finished surface roughness is made uniform and good flatness is obtained, and the machining time can be shortened by pressure machining. The structure is such that the elevating body is lowered by rotation, which lowers the rotational axis via a coil spring, and presses the workpiece closely against the grinding wheel, so it is possible to properly set and control the processing pressure to achieve a good finish. Surface roughness can be obtained efficiently, machining pressure can be easily controlled, precision polishing conditions can be easily selected to suit any workpiece, and polishing can be achieved without applying excessive load to the workpiece or the grinding wheel. By increasing or decreasing the processing pressure during processing, the roughness of the finished surface can be made finer, and it is also possible to omit steps. In other words, in free abrasive lapping, the machining area per unit is 50~
In contrast to applying a processing pressure of 500 g/cm ² , in the present invention, the processing pressure is controlled and increased or decreased during ^the polishing process. The material can be pressurized up to about 10,000 g/cm ² , which makes it possible to apply processing pressure appropriate for the required finished surface, increase the amount of processing per unit time, and shorten processing time. In addition, the grain size of the abrasive grains used is fine, and although the finished surface roughness is fine, the processing speed is fast, compared to the conventional 2
It is also possible to finish the process in one step, and a workpiece with a relatively rough surface after milling or lathe processing can be processed with high precision to a mirror finish in one pass. Furthermore, by using servo motors or stepping motors in operating parts such as the swing arm, pressure device, and rotation device to make these operations variable, processing conditions can be easily varied. It can easily handle workpieces with different processing conditions.
In addition, as mentioned above, it is possible to process in a short time,
One-piece processing method can be adopted, the stock of work-in-progress items can be reduced, and the loading/unloading, processing, and transport of workpieces can be automated, making it easy to process workpieces with single-piece processing. Processing of irregularly shaped workpieces is easy, and the entire device is compact and can be manufactured at low cost, and can be easily incorporated into a production line.

(Effects of the Invention) In this way, the present invention sequentially transfers the workpiece from the supply device to the polishing wheel and the carrying-out device using a single-piece processing method rather than a batch method, and transfers the workpiece onto a fixed abrasive-type polishing wheel with the polished surface facing upward. The workpiece is brought into contact with the workpiece through a pressurizing device to impart rotational and oscillating motion to the workpiece, and the processing pressure is appropriately set and controlled to efficiently obtain a good finished surface roughness. In particular, As a pressurizing device, the processing pressure applied to the workpiece gripped by the gripping device during polishing is arbitrarily controlled by the expansion of a coil spring as the elevating body moves up and down as the vertical axis rotates, which is different from the conventional method. This is something that cannot be found in polishing equipment, and it has an extremely significant contribution to the development of the industry as it solves the problems of conventional polishing equipment.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention; Fig. 1 is a partially cutaway front view, Fig. 2 is a plan view, and Fig. 3 is a plan view of the main part when the swinging arm is moved above the grinding wheel. 4 are partially cutaway front views of the pressurizing device and the rotating device. 1: Machine stand, 4: Supply device, 5: Grinding wheel, 6:
Unloading device, 15: Swing arm, 22: Pressurizing device,
23: Casing, 24: Pressure hole, 26: Elevating body, 28: Coil spring, 29: Vertical shaft, 36: Rotating device, 50: Gripping device.

Claims (1)

[Claims] 1 A workpiece supply device 4 and a grinding wheel 5 are placed on the machine stand 1.
and a carry-out device 6, and the polishing wheel 5
A swing arm 15 is provided which passes above each of the supply device 4, the polishing wheel 5, and the carry-out device 6 while swinging horizontally above the swing arm 15.
The polishing apparatus is provided with an autorotation device 36 for a workpiece that can be moved up and down via a shaft 2, and a gripping device 50 for grasping the workpiece below the autorotation device 36, wherein the pressure device 22 is moving arm 1
A vertical shaft 29 that can be rotated in forward and reverse directions is provided downward in the casing 23, and a ball screw portion formed below the vertical shaft 29 is connected to a vertical pressurizing hole 2 formed in the casing 23.
4, and a coil spring 28 for increasing and decreasing the pressing force is inserted into the lower side of the elevating body 26 in the pressurizing hole 24. The processing pressure applied to the workpiece gripped by the gripping device 50 during the polishing process can be arbitrarily controlled by the expansion of the coil spring 28 due to the lifting and lowering of the elevating body 26 as the vertical shaft 29 rotates. A polishing device featuring: