JPH0351333Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Industrial application field The present invention relates to a heating element for film forming equipment, particularly for vacuum evaporation equipment, sputtering equipment, CVD equipment, etc.
The present invention relates to a heating element for a film forming apparatus used in an apparatus for forming a film on a substrate surface in a vacuum or in a generated gas.

(B) Prior Art An infrared heater is used as a heating means for a substrate, and a heat label or the like is used to measure the temperature of the substrate surface at that time.

However, it is generally difficult to accurately measure or control the temperature of such heating means.

Another method is to bring the substrate into direct contact with a fixed heating element such as a fixed heater, but while the accuracy of temperature measurement is better than with the above-mentioned infrared heater, the heating element gets dirty more quickly due to the evaporated metal surrounding it. This often resulted in a decrease in film-forming performance and a deterioration in the quality of the substrate on which the film was formed.

To this end, some types have taken measures such as surrounding the heat source with an anti-adhesion plate, but there is no perfect solution yet.

In recent years, film deposition equipment has gradually become larger. For example, large-scale automatic deposition systems are equipped with multiple independent film deposition chambers installed vertically, and are equipped with automatic transport carts that pass through the deposition chambers to process substrates automatically. Membrane devices are emerging. In such equipment, it is common to disconnect the heating power source while the cart is transferred to the adjacent film forming chamber, so from the viewpoint of maintaining the temperature of the heating element constant, it is necessary to disconnect the substrate placed on the automatic transfer cart. The heating element that heats the is required to have a large heat capacity.

Despite the above requirements, there has been no heating element with a large heat capacity.

(c) Purpose The purpose of the present invention is to provide a heating element for a film forming apparatus that has good temperature measurement accuracy and can be easily cleaned after becoming dirty.

Another object of the present invention is to provide a heating element with a large heat capacity.

(D) Structure The present invention embeds a sheathed heater with a built-in heating wire as a heat source in a thermally conductive material, and attaches it to a sealed container to increase heat capacity. It is designed to prevent temperature drop.

Further, in order to improve temperature accuracy, the mounting surface of the substrate is mirror-finished, and is of the type of a closed container so that it can be cleaned as needed.

(E) Embodiment FIG. 1 is a partially cutaway perspective view of an embodiment of a heating element for a film forming apparatus according to the present invention, and FIG. 2 is a sectional view taken along the line -- in FIG. 1.

In the figure, reference numeral 1 denotes a closed container made of heat-resistant and corrosion-resistant metal such as stainless steel and formed into a substantially rectangular parallelepiped shape, and has a substrate mounting surface 11 at its bottom. and,
The outer surface 11 of the board mounting surface 10 is finished in a mirror finish.

On this outer surface 11, the substrate A to be coated by vapor deposition is attached using a clamp 14 and screws.

Inside the closed container 1, a sheath heater 2 having a built-in heating wire 21, such as a nichrome wire, is housed in a spiral or meandering shape. A good thermal conductor 6 made of aluminum or the like is cast so as to surround the sheath heater 2, and the good thermal conductor 6 is cast so as to be in sufficient contact with the board mounting surface. Furthermore, the heating wire 21 of the sheath heater
The end portion of the terminal 3 is brazed to a ceramic 4 which hermetically seals the current-carrying terminal 3, and the ceramic is hermetically sealed to the upper surface of the airtight container.

Reference numeral 7 denotes a gap between the heat conductor 6 and the upper surface of the closed container, and this gap is filled with an inert gas such as dry nitrogen to prevent oxidation of the metal contained therein.

To fill and seal this gas, clean the entire container once,
After heat treatment at an appropriate temperature, exhaust while degassing,
Thereafter, the sealed pipe 15 made of copper or the like is filled with the gas and then airtightly attached to the sealed container.
This is done by closing off the

Reference numeral 5 denotes a temperature sensing element provided approximately at the center of the heating element for the film forming apparatus, and the tip of this temperature sensing element 5 is in close contact with the thermal conductor 6 and penetrates through it to be in close contact with the inner surface of the substrate mounting surface. ing. And the temperature detection body 5
The other end protrudes to the outside of the sealed container, and a temperature sensing element (not shown) comes into contact with this protrusion.

Reference numeral 8 denotes a shielding cover that is detachably attached to the upper part of the sealed container and covers the entire sealed container, and a retainer 13 is provided at an appropriate location on the shielding cover 8 for attaching the entire heating element for the film forming apparatus to the main body of the film forming apparatus. is attached.

In this embodiment, the heating body for the film forming apparatus is generally rectangular parallelepiped, and the substrate is attached to the lower part of the heating body for the film forming apparatus. However, the present invention is not particularly limited to the overall shape; for example, It may be cylindrical, and the mounting direction of the substrate may be upward or sideways.

(f) Effects According to the heating element for a film forming apparatus of the present invention, its heat capacity is large, so that it can be used in a film forming apparatus when moving a substrate attached to the heating element to an adjacent film forming chamber. A drop in temperature of the heating element or the substrate can be prevented.

Furthermore, since the entire structure is sealed, cleaning after use is possible, and since it is filled with inert gas, oxidation of the internal metal can be prevented.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view of an embodiment of a heating element for a film forming apparatus according to the present invention, and FIG. 2 is a sectional view taken along the line -- in FIG. 1. 1...Airtight container, 2...Sheath heater, 3...
Current-carrying terminal, 5...Temperature sensing object, 6...Good thermal conductor,
7... air gap, 8... shielding cover, 10... board mounting surface, 15... sealing pipe.

Claims (1)

[Scope of utility model registration request] An airtight container having a mirror-finished outer surface and having a substrate mounting surface as one side, a sheath heater that heats the substrate mounting surface, and a thermally conductive material surrounding the sheath heater and bonding to the inner surface of the substrate mounting surface. In the heating element for a membrane device, the airtight container is filled with an inert gas, and the temperature sensor is embedded in the thermal conductor and has its tip outside the airtight container, and a removable device that covers the upper part of the airtight container. A heating element for a film forming apparatus, characterized in that it is equipped with a flexible shielding cover.