JPH0350754U - - Google Patents
Info
- Publication number
- JPH0350754U JPH0350754U JP11115389U JP11115389U JPH0350754U JP H0350754 U JPH0350754 U JP H0350754U JP 11115389 U JP11115389 U JP 11115389U JP 11115389 U JP11115389 U JP 11115389U JP H0350754 U JPH0350754 U JP H0350754U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electrode part
- solder
- connection
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Details Of Resistors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11115389U JPH0350754U (xx) | 1989-09-22 | 1989-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11115389U JPH0350754U (xx) | 1989-09-22 | 1989-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350754U true JPH0350754U (xx) | 1991-05-17 |
Family
ID=31659650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11115389U Pending JPH0350754U (xx) | 1989-09-22 | 1989-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350754U (xx) |
-
1989
- 1989-09-22 JP JP11115389U patent/JPH0350754U/ja active Pending