JPH0350340U - - Google Patents
Info
- Publication number
- JPH0350340U JPH0350340U JP11220089U JP11220089U JPH0350340U JP H0350340 U JPH0350340 U JP H0350340U JP 11220089 U JP11220089 U JP 11220089U JP 11220089 U JP11220089 U JP 11220089U JP H0350340 U JPH0350340 U JP H0350340U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor element
- lead
- dissipation structure
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220089U JPH0350340U (el) | 1989-09-25 | 1989-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220089U JPH0350340U (el) | 1989-09-25 | 1989-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350340U true JPH0350340U (el) | 1991-05-16 |
Family
ID=31660648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11220089U Pending JPH0350340U (el) | 1989-09-25 | 1989-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350340U (el) |
-
1989
- 1989-09-25 JP JP11220089U patent/JPH0350340U/ja active Pending