JPH0348878Y2 - - Google Patents
Info
- Publication number
- JPH0348878Y2 JPH0348878Y2 JP1985180340U JP18034085U JPH0348878Y2 JP H0348878 Y2 JPH0348878 Y2 JP H0348878Y2 JP 1985180340 U JP1985180340 U JP 1985180340U JP 18034085 U JP18034085 U JP 18034085U JP H0348878 Y2 JPH0348878 Y2 JP H0348878Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- lead
- synthetic resin
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 10
- 239000000057 synthetic resin Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims 1
- 238000005401 electroluminescence Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、EL（Electro−Luminescence）素子
の構造に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the structure of an EL (Electro-Luminescence) element.
この種EL素子は従来例えば第１２図及び第１
３図の如く、Al箔等でなる一方の背面電極１と
酸化インジウム（I.T.O）等の蒸着されたポリエ
ステルフイルム等で成る他方の透明電極フイルム
２との間に、チタン酸バリウム（BaTiO4）等の
無機誘電体物質を熱可塑性バインダーに分散させ
て成る絶縁層３及びZnS等の螢光体を熱可塑性バ
インダーに分散させて成る発光層４等が間挿され
た積層構造を有し、又背面電極１及び透明電極フ
イルム２の夫々端部にはリード端子６，６′が取
り付けられると共に、これら全体を例えば三弗化
エチレン等で成る防湿フイルム７により被覆され
該防湿フイルム７の周囲を熱融着することによつ
て素子内部はシールされている。
This kind of EL element has conventionally been used, for example, as shown in Fig. 12 and 1.
As shown in Figure 3, barium titanate (BaTiO 4 ) or the like is placed between one back electrode 1 made of Al foil or the like and the other transparent electrode film 2 made of polyester film or the like on which indium oxide (ITO) or the like is vapor-deposited. It has a laminated structure in which an insulating layer 3 made of an inorganic dielectric material dispersed in a thermoplastic binder and a light emitting layer 4 made of a phosphor such as ZnS dispersed in a thermoplastic binder are interposed. Lead terminals 6, 6' are attached to the ends of the electrode 1 and the transparent electrode film 2, respectively, and the whole is covered with a moisture-proof film 7 made of trifluoroethylene, etc., and the periphery of the moisture-proof film 7 is heated. The inside of the element is sealed by wearing it.
従来のリード端子６，６′には、銅性のメツシ
ユリードフレーム又は燐青銅箔等が用いられてい
るが、銅性メツシユの場合は曲げに対する強度の
不十分なためリード端子としての信頼性に乏し
く、又かかる強度を確保するためにリードフレー
ムを用いた場合には逆にフレキシブリテイに欠け
るという問題があつた。更に、端子材料として用
いられる銅又は燐青銅は何れも高価であり、又、
打ち抜きあるいはエツチング等の手法によりリー
ドフレームを製作するとその製造コストは更に増
大するという不都合があつた。本考案はかかる実
情に鑑み、リードフレームとしての強度及びこれ
に基づく信頼性が確保されると共に、リード端子
の形成に際し製造コストの低減が図られ得るEL
素子を提供することを目的とする。
Conventional lead terminals 6, 6' use a copper mesh lead frame or phosphor bronze foil, but copper mesh has insufficient strength against bending, making it unreliable as a lead terminal. Moreover, when a lead frame is used to ensure such strength, there is a problem of a lack of flexibility. Furthermore, copper or phosphor bronze used as terminal materials are both expensive;
When a lead frame is manufactured by a method such as punching or etching, there is a disadvantage that the manufacturing cost further increases. In view of these circumstances, the present invention has been developed to ensure the strength and reliability of the lead frame as well as to reduce manufacturing costs when forming lead terminals.
The purpose is to provide an element.
本考案によるEL素子では、第１図に示される
如く、リード端子６，６′は合成樹脂フイルム上
に積層された金属膜がエツチング又はラミネート
等の手法によつてパターン成形されて成り、背面
電極１おらび透明電極２の夫々端部へ接続せしめ
られ、その後EL素子本体は防湿フイルム７によ
つて被覆されている。又、端子パターン成形に際
し、リード端子６，６′の対を所定のピツチで合
成樹脂上に複数形成すれば、各々のリード端子を
対応するEL素子本体と夫々接続せしめることに
より複数個取りがなされ得る。従つてリード端子
６，６′は合成樹脂フイルムにより補強され且つ
保護されているのでその強度が向上すると共に、
EL素子本体との接続に際し量産化等が図られ得
る。
In the EL element according to the present invention, as shown in FIG. 1, the lead terminals 6, 6' are formed by patterning a metal film laminated on a synthetic resin film by etching or laminating, and the back electrode 1 and transparent electrode 2, and then the EL element body is covered with a moisture-proof film 7. Furthermore, when forming a terminal pattern, if a plurality of pairs of lead terminals 6 and 6' are formed on the synthetic resin at a predetermined pitch, a plurality of pairs can be formed by connecting each lead terminal to the corresponding EL element body. obtain. Therefore, since the lead terminals 6, 6' are reinforced and protected by the synthetic resin film, their strength is improved, and
Mass production can be achieved when connecting to the EL element main body.
第２図乃至第１１図は本考案に係るEL素子の
一実施例を示す図であり、まず、第２図乃至第７
図によりリード端子６，６′のパターン成形につ
いて説明すると、８はアルミニウム等の金属膜が
蒸着又はラミネート等の手法によりその表面上に
形成されるポリエステル等でなる合成樹脂フイル
ムであり、後金属膜はホトエツチング又は印刷エ
ツチング等によつてパターン成形され、これによ
つて合成樹脂フイルム８上には複数対のリード端
子６，６′が所定のピツチで形成される。また、
この時リード端子６，６′の形状は第２図または
第４図乃至第７図の如く種々のパターンが用いら
れ得る。
FIGS. 2 to 11 are diagrams showing one embodiment of the EL element according to the present invention. First, FIGS.
To explain the pattern forming of the lead terminals 6 and 6' with reference to the figure, 8 is a synthetic resin film made of polyester or the like on which a metal film such as aluminum is formed by vapor deposition or lamination. are pattern-formed by photo-etching, printing etching, etc., thereby forming a plurality of pairs of lead terminals 6, 6' on the synthetic resin film 8 at predetermined pitches. Also,
At this time, various patterns can be used for the shape of the lead terminals 6, 6' as shown in FIG. 2 or FIGS. 4 to 7.
次に、リード端子６，６′は、端部において例
えば第８図乃至第１１図に示される如く、プレス
等の打ち抜き加工によりリード端子６，６′の各
対毎にその間に夫々切り欠き部９が形成されて
後、透明電極フイルム２上に連続して形成された
EL素子本体E1，E2，E3，E4，……の背面電極１
及び銀電極５を介して透明電極フイルム２と夫々
接続せしめられる。又、この接続の際、銀ペイン
ト等を用いてリード端子６，６′の固定がなされ
得る。更にリード端子６，６′の接続された本体
E1，E2，E3，E4，……は線l1，l2，l3，l4，……
に沿つてプレス等の裁断によつて相互に切り離さ
れ、この後防湿フイルムで個々に被覆されること
により、EL素子として完成される。 Next, at the end portions of the lead terminals 6, 6', as shown in FIGS. 8 to 11, cutouts are formed between each pair of lead terminals 6, 6' by punching using a press or the like. 9 was formed, continuously formed on the transparent electrode film 2.
Back electrode 1 of EL element body E 1 , E 2 , E 3 , E 4 , ...
and the transparent electrode film 2 via silver electrodes 5, respectively. Further, during this connection, the lead terminals 6, 6' may be fixed using silver paint or the like. Furthermore, the main body to which lead terminals 6, 6' are connected
E 1 , E 2 , E 3 , E 4 , ... are lines l 1 , l 2 , l 3 , l 4 , ...
They are separated from each other by cutting using a press or the like, and then individually covered with a moisture-proof film to complete the EL element.
尚、各リード端子６，６′の先端部にハトメ１
０等が接続され得（第１図参照）、これによりハ
ンダ付等によつて外部との接続が容易となる。 In addition, there is an eyelet 1 at the tip of each lead terminal 6, 6'.
0 etc. can be connected (see FIG. 1), which facilitates connection to the outside by soldering or the like.
本考案によるEL素子は上記の如く構成されて
いるので、リード端子６，６′の取り付けに際し、
その自動化が図られ得、これにより量産性が向上
して製造コストの低減が達成され得る。又、リー
ド端子６，６′は合成樹脂フイルム８と一体的に
形成されているので、従来のものに比し曲げ強度
等の向上が図られ得、実験によれば例えば従来の
ものは360゜の折り曲げによつてほぼ二回程度で折
損してしまうのに対し十回以上の折り曲げによつ
ても折損せず優れた耐久性が確保された。更に、
合成樹脂フイルム８はリード端子６，６′を衝撃
等から保護すると共に、該合成樹脂フイルム８の
片側においてのみリード端子６，６′によつて導
通させられるから、EL素子を実装するに際しそ
の反対側を金属板等に貼り付けてもシヨートが生
ずることはない。又、従来困難とされていたリー
ド端子の長さを増大することも可能となり、同時
にその厚みは薄くなされ得るので防湿フイルム７
による防湿効果は更に向上され得る。 Since the EL element according to the present invention is constructed as described above, when attaching the lead terminals 6, 6',
It can be automated, thereby improving mass productivity and reducing manufacturing costs. In addition, since the lead terminals 6, 6' are integrally formed with the synthetic resin film 8, it is possible to improve the bending strength, etc., compared to the conventional one, and according to experiments, for example, the conventional one can Although it would break after about two bendings, it did not break even after being bent ten times or more, and excellent durability was ensured. Furthermore,
The synthetic resin film 8 protects the lead terminals 6, 6' from shocks, etc., and conducts only on one side of the synthetic resin film 8 through the lead terminals 6, 6'. Even if the side is attached to a metal plate, etc., no shortening will occur. In addition, it is now possible to increase the length of the lead terminal, which was previously considered difficult, and at the same time, the thickness can be reduced, making it possible to use moisture-proof film 7.
The moisture-proofing effect can be further improved.
上述のように本考案によるEL素子では、リー
ド端子の強度が向上され、信頼性が増大されると
共に、製造コストの低減が図られ得る等の効果が
ある。
As described above, the EL element according to the present invention has advantages such as improved lead terminal strength, increased reliability, and reduced manufacturing costs.
第１図は本考案に係るEL素子の一実施例の全
体的構造を示す平面図、第２図及び第３図は本考
案によるリード端子の製造過程について説明する
斜視図及び断面図、第４図乃至第７図は本考案に
よるリード端子のパターン形状の種類を示す平面
図、第８図乃至第１１図はリード端子とEL素子
本体との接続を示す夫々平面図、断面図及び部分
拡大図、第１２図及び第１３図は従来のEL素子
の構造を示す全体斜視図及び縦断面図である。
１……背面電極、２……透明電極フイルム、３
………絶縁層、４……発光層、５……銀電極、
６，６′……リード端子、８……合成樹脂フイル
ム、９……切り欠、１０……ハトメ。
FIG. 1 is a plan view showing the overall structure of an embodiment of the EL element according to the present invention, FIGS. 2 and 3 are perspective views and cross-sectional views illustrating the manufacturing process of the lead terminal according to the present invention, and FIG. 7 to 7 are plan views showing types of pattern shapes of lead terminals according to the present invention, and FIGS. 8 to 11 are plan views, cross-sectional views, and partially enlarged views showing connections between lead terminals and the EL element body, respectively. , FIG. 12, and FIG. 13 are an overall perspective view and a vertical sectional view showing the structure of a conventional EL element. 1...Back electrode, 2...Transparent electrode film, 3
......Insulating layer, 4...Light emitting layer, 5...Silver electrode,
6, 6'... Lead terminal, 8... Synthetic resin film, 9... Notch, 10... Eyelet.
Claims (1)
層を介在せしめ、上記両電極の夫々にリード端
子が接続されて成るEL素子において、合成樹
脂フイルム上に積層された金属膜によつて複数
個同時に形成され、且つ上記電極に接合された
リード端子を有することを特徴とするEL素子。 (2) 前記リード端子の先端部にはこれに接続され
たハトメが取付けられていることを特徴とする
実用新案登録請求の範囲(1)に記載のEL素子。 (3) マスクを用いた蒸着又はスパツタリングによ
り合成樹脂フイルム上に複数個同時に形成さ
れ、且つ接続されるべき前記電極に対応して切
断されたリード端子を有することを特徴とする
実用新案登録請求の範囲(1)に記載のEL素子。[Claims for Utility Model Registration] (1) In an EL device, which has a light-emitting layer and an insulating layer interposed between a transparent electrode and a back electrode, and a lead terminal is connected to each of the above-mentioned electrodes, What is claimed is: 1. An EL element characterized in that it has a plurality of lead terminals simultaneously formed by laminated metal films and connected to the electrodes. (2) The EL device according to claim (1) of the utility model registration, characterized in that an eyelet connected to the tip of the lead terminal is attached. (3) A utility model registration request characterized in that a plurality of lead terminals are simultaneously formed on a synthetic resin film by vapor deposition or sputtering using a mask, and are cut in correspondence with the electrodes to be connected. The EL element described in range (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985180340U JPH0348878Y2 (en) | 1985-11-22 | 1985-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985180340U JPH0348878Y2 (en) | 1985-11-22 | 1985-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6288395U JPS6288395U (en) | 1987-06-05 |
| JPH0348878Y2 true JPH0348878Y2 (en) | 1991-10-18 |
Family
ID=31124206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985180340U Expired JPH0348878Y2 (en) | 1985-11-22 | 1985-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348878Y2 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4312111Y1 (en) * | 1967-05-04 | 1968-05-24 | ||
| JPS56145680A (en) * | 1980-04-14 | 1981-11-12 | Nippon Kokuen Kogyo Kk | Method of manufacturing film-shaped electrode connector for electrochromatic display (ecd) |
| JPS5875186A (en) * | 1981-10-28 | 1983-05-06 | 富士通株式会社 | Display panel |
| JPS594556U (en) * | 1982-06-28 | 1984-01-12 | コニカ株式会社 | Developer receiving device in electrostatic recording device |
| JPS5911437U (en) * | 1982-07-15 | 1984-01-24 | 日本電気ホームエレクトロニクス株式会社 | electronic components |
| JPS6039791A (en) * | 1983-08-12 | 1985-03-01 | 関西日本電気株式会社 | El producing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58179298U (en) * | 1982-05-25 | 1983-11-30 | 株式会社東芝 | Redundant reaction wheel motor coil device |
-
1985
- 1985-11-22 JP JP1985180340U patent/JPH0348878Y2/ja not_active Expired
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4312111Y1 (en) * | 1967-05-04 | 1968-05-24 | ||
| JPS56145680A (en) * | 1980-04-14 | 1981-11-12 | Nippon Kokuen Kogyo Kk | Method of manufacturing film-shaped electrode connector for electrochromatic display (ecd) |
| JPS5875186A (en) * | 1981-10-28 | 1983-05-06 | 富士通株式会社 | Display panel |
| JPS594556U (en) * | 1982-06-28 | 1984-01-12 | コニカ株式会社 | Developer receiving device in electrostatic recording device |
| JPS5911437U (en) * | 1982-07-15 | 1984-01-24 | 日本電気ホームエレクトロニクス株式会社 | electronic components |
| JPS6039791A (en) * | 1983-08-12 | 1985-03-01 | 関西日本電気株式会社 | El producing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6288395U (en) | 1987-06-05 |
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