JPH0348299U - - Google Patents
Info
- Publication number
- JPH0348299U JPH0348299U JP10924389U JP10924389U JPH0348299U JP H0348299 U JPH0348299 U JP H0348299U JP 10924389 U JP10924389 U JP 10924389U JP 10924389 U JP10924389 U JP 10924389U JP H0348299 U JPH0348299 U JP H0348299U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- shielding structure
- radiation shielding
- shield cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 2
Landscapes
- Details Of Measuring And Other Instruments (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図ａ，ｂは本考案による二つの実施例の縦
断面図、（同図ａはデバイスがトランジスタの場
合、同図ｂはデバイスがＣ−ＭＯＳ ＩＣの場合
）、第２図は従来の放射線シールド構造の一例の
斜視図である。
１……デバイス、２……金属製のシールドキヤ
ツプ、３……金属製のシールド板、４……プリン
ト基板、５……接着剤、６……ケース筺体、６ａ
……ケース筺体の肉厚、７……カバー。
Figures 1a and 1b are longitudinal sectional views of two embodiments according to the present invention (Figure 1a is a case where the device is a transistor, Figure 1b is a case where the device is a C-MOS IC), and Figure 2 is a conventional one. FIG. 2 is a perspective view of an example of a radiation shield structure. DESCRIPTION OF SYMBOLS 1... Device, 2... Metal shield cap, 3... Metal shield plate, 4... Printed circuit board, 5... Adhesive, 6... Case housing, 6a
...Thickness of the case housing, 7...Cover.
Claims (1)
バイスを覆うようにシールドするシールドキヤツ
プと、前記プリント基板と前記デバイスの間に設
けられたシールド板とを備えることを特徴とする
デバイスの放射線シールド構造。 ２ 前記デバイスと前記シールドキヤツプとが接
着剤で固着されていることを特徴とする請求項１
記載のデバイスの放射線シールド構造。[Claims for Utility Model Registration] 1. A device mounted on a printed circuit board, a shield cap that covers and shields the device, and a shield plate provided between the printed circuit board and the device. Radiation shielding structure for devices. 2. Claim 1, wherein the device and the shield cap are fixed with an adhesive.
Radiation shielding structure of the described device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10924389U JPH0348299U (en) | 1989-09-18 | 1989-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10924389U JPH0348299U (en) | 1989-09-18 | 1989-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348299U true JPH0348299U (en) | 1991-05-08 |
Family
ID=31657843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10924389U Pending JPH0348299U (en) | 1989-09-18 | 1989-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348299U (en) |
-
1989
- 1989-09-18 JP JP10924389U patent/JPH0348299U/ja active Pending
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