JPH0348263U - - Google Patents
Info
- Publication number
- JPH0348263U JPH0348263U JP10849689U JP10849689U JPH0348263U JP H0348263 U JPH0348263 U JP H0348263U JP 10849689 U JP10849689 U JP 10849689U JP 10849689 U JP10849689 U JP 10849689U JP H0348263 U JPH0348263 U JP H0348263U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- conductive pattern
- base material
- solder resist
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10849689U JPH0348263U (sh) | 1989-09-16 | 1989-09-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10849689U JPH0348263U (sh) | 1989-09-16 | 1989-09-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0348263U true JPH0348263U (sh) | 1991-05-08 |
Family
ID=31657135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10849689U Pending JPH0348263U (sh) | 1989-09-16 | 1989-09-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0348263U (sh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002204050A (ja) * | 2000-12-27 | 2002-07-19 | Toray Eng Co Ltd | 金属配線回路基板及びその製造方法 |
JP2003064509A (ja) * | 2001-08-27 | 2003-03-05 | Hiroko Komoda | 合成樹脂製手袋 |
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1989
- 1989-09-16 JP JP10849689U patent/JPH0348263U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002204050A (ja) * | 2000-12-27 | 2002-07-19 | Toray Eng Co Ltd | 金属配線回路基板及びその製造方法 |
JP2003064509A (ja) * | 2001-08-27 | 2003-03-05 | Hiroko Komoda | 合成樹脂製手袋 |