JPH0348259U - - Google Patents
Info
- Publication number
- JPH0348259U JPH0348259U JP10869989U JP10869989U JPH0348259U JP H0348259 U JPH0348259 U JP H0348259U JP 10869989 U JP10869989 U JP 10869989U JP 10869989 U JP10869989 U JP 10869989U JP H0348259 U JPH0348259 U JP H0348259U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- snap line
- substrate
- lattice
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10869989U JPH0348259U (it) | 1989-09-18 | 1989-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10869989U JPH0348259U (it) | 1989-09-18 | 1989-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348259U true JPH0348259U (it) | 1991-05-08 |
Family
ID=31657323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10869989U Pending JPH0348259U (it) | 1989-09-18 | 1989-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348259U (it) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014200896A (ja) * | 2013-04-08 | 2014-10-27 | 三菱マテリアル株式会社 | 分割体の製造方法及び製造装置 |
| JP2014204031A (ja) * | 2013-04-08 | 2014-10-27 | 三菱マテリアル株式会社 | パワーモジュール製造用セラミックス原板及びパワーモジュール製造用積層基板 |
| WO2022131337A1 (ja) * | 2020-12-17 | 2022-06-23 | デンカ株式会社 | セラミック板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 |
-
1989
- 1989-09-18 JP JP10869989U patent/JPH0348259U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014200896A (ja) * | 2013-04-08 | 2014-10-27 | 三菱マテリアル株式会社 | 分割体の製造方法及び製造装置 |
| JP2014204031A (ja) * | 2013-04-08 | 2014-10-27 | 三菱マテリアル株式会社 | パワーモジュール製造用セラミックス原板及びパワーモジュール製造用積層基板 |
| WO2022131337A1 (ja) * | 2020-12-17 | 2022-06-23 | デンカ株式会社 | セラミック板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 |
| JPWO2022131337A1 (it) * | 2020-12-17 | 2022-06-23 |