JPH0348259U - - Google Patents
Info
- Publication number
- JPH0348259U JPH0348259U JP10869989U JP10869989U JPH0348259U JP H0348259 U JPH0348259 U JP H0348259U JP 10869989 U JP10869989 U JP 10869989U JP 10869989 U JP10869989 U JP 10869989U JP H0348259 U JPH0348259 U JP H0348259U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- snap line
- substrate
- lattice
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案実施例に係る基板形成用セラミ
ツクシート示す斜視図、第２図は第１図中Ａ部分
の拡大平面図である。第３図ａ，ｂは、第１図中
Ａ部分の他の実施例を示す拡大平面図である。第
４図ａは第２図中のＸ−Ｘ線断面図、第４図ｂは
第２図中のＹ−Ｙ線断面図である。第４図ｃ，ｄ
はそれぞれスナツプラインの他の実施例を示す断
面である。第５図は従来の基板形成用セラミツク
シートを示す斜視図、第６図は分割したセラミツ
ク基板を示す斜視図である。
１，１１……セラミツクシート、２，１２……
セラミツク基板、３，１３……格子状のスナツプ
ライン、４……角取り用のスナツプライン、１４
……貫通孔、５，１５……スルーホール。
FIG. 1 is a perspective view showing a ceramic sheet for forming a substrate according to an embodiment of the present invention, and FIG. 2 is an enlarged plan view of portion A in FIG. 1. FIGS. 3a and 3b are enlarged plan views showing another embodiment of the portion A in FIG. 1. FIG. FIG. 4a is a sectional view taken along line XX in FIG. 2, and FIG. 4b is a sectional view taken along line Y-Y in FIG. 2. Figure 4 c, d
are cross sections showing other embodiments of the snap line. FIG. 5 is a perspective view showing a conventional ceramic sheet for forming a substrate, and FIG. 6 is a perspective view showing a divided ceramic substrate. 1, 11... Ceramic sheet, 2, 12...
Ceramic substrate, 3, 13... Lattice snap line, 4... Snap line for corner cutting, 14
...Through hole, 5,15...Through hole.
Claims (1)
スナツプラインを形成するとともに、分割後のセ
ラミツク基板の角となる部分に、前記格子状のス
ナツプラインの深さｄ１以上の深さｄ２を有する
角取り用のスナツプラインを形成したことを特徴
とする基板形成用セラミツクシート。 A lattice-shaped snap line is formed in order to divide the ceramic substrate into a plurality of ceramic substrates, and a corner-cutting snap line having a depth d2 greater than the depth d1 of the lattice-shaped snap line is formed at the corners of the divided ceramic substrate. A ceramic sheet for forming a substrate, characterized in that it is formed with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10869989U JPH0348259U (en) | 1989-09-18 | 1989-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10869989U JPH0348259U (en) | 1989-09-18 | 1989-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348259U true JPH0348259U (en) | 1991-05-08 |
Family
ID=31657323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10869989U Pending JPH0348259U (en) | 1989-09-18 | 1989-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348259U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014204031A (en) * | 2013-04-08 | 2014-10-27 | 三菱マテリアル株式会社 | Ceramics original plate for manufacturing power module and multilayer substrate for manufacturing power module |
| JP2014200896A (en) * | 2013-04-08 | 2014-10-27 | 三菱マテリアル株式会社 | Manufacturing method and manufacturing apparatus of split body |
| JPWO2022131337A1 (en) * | 2020-12-17 | 2022-06-23 |
-
1989
- 1989-09-18 JP JP10869989U patent/JPH0348259U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014204031A (en) * | 2013-04-08 | 2014-10-27 | 三菱マテリアル株式会社 | Ceramics original plate for manufacturing power module and multilayer substrate for manufacturing power module |
| JP2014200896A (en) * | 2013-04-08 | 2014-10-27 | 三菱マテリアル株式会社 | Manufacturing method and manufacturing apparatus of split body |
| JPWO2022131337A1 (en) * | 2020-12-17 | 2022-06-23 | ||
| WO2022131337A1 (en) * | 2020-12-17 | 2022-06-23 | デンカ株式会社 | Ceramic plate and method for manufacturing same, composite board and method for manufacturing same, and circuit board and method for manufacturing same |