JPH0348254U - - Google Patents

Info

Publication number
JPH0348254U
JPH0348254U JP10846789U JP10846789U JPH0348254U JP H0348254 U JPH0348254 U JP H0348254U JP 10846789 U JP10846789 U JP 10846789U JP 10846789 U JP10846789 U JP 10846789U JP H0348254 U JPH0348254 U JP H0348254U
Authority
JP
Japan
Prior art keywords
lens
light emitting
emitting diode
molded
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10846789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10846789U priority Critical patent/JPH0348254U/ja
Publication of JPH0348254U publication Critical patent/JPH0348254U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
JP10846789U 1989-09-16 1989-09-16 Pending JPH0348254U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10846789U JPH0348254U (ko) 1989-09-16 1989-09-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10846789U JPH0348254U (ko) 1989-09-16 1989-09-16

Publications (1)

Publication Number Publication Date
JPH0348254U true JPH0348254U (ko) 1991-05-08

Family

ID=31657108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10846789U Pending JPH0348254U (ko) 1989-09-16 1989-09-16

Country Status (1)

Country Link
JP (1) JPH0348254U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027822A (ja) * 2001-07-16 2003-01-29 Misawa Homes Co Ltd 窓サッシのレール構造および窓サッシの再生方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270766A (en) * 1975-12-10 1977-06-13 Toshiba Corp Semiconductor device
JPS60208715A (ja) * 1984-04-02 1985-10-21 Nec Corp 光半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270766A (en) * 1975-12-10 1977-06-13 Toshiba Corp Semiconductor device
JPS60208715A (ja) * 1984-04-02 1985-10-21 Nec Corp 光半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027822A (ja) * 2001-07-16 2003-01-29 Misawa Homes Co Ltd 窓サッシのレール構造および窓サッシの再生方法

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