JPH0348235U - - Google Patents
Info
- Publication number
- JPH0348235U JPH0348235U JP10826289U JP10826289U JPH0348235U JP H0348235 U JPH0348235 U JP H0348235U JP 10826289 U JP10826289 U JP 10826289U JP 10826289 U JP10826289 U JP 10826289U JP H0348235 U JPH0348235 U JP H0348235U
- Authority
- JP
- Japan
- Prior art keywords
- case lid
- semiconductor device
- package
- epoxy resin
- silicone gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10826289U JPH0348235U (no) | 1989-09-14 | 1989-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10826289U JPH0348235U (no) | 1989-09-14 | 1989-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348235U true JPH0348235U (no) | 1991-05-08 |
Family
ID=31656912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10826289U Pending JPH0348235U (no) | 1989-09-14 | 1989-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348235U (no) |
-
1989
- 1989-09-14 JP JP10826289U patent/JPH0348235U/ja active Pending