JPH0348226U - - Google Patents

Info

Publication number
JPH0348226U
JPH0348226U JP10820789U JP10820789U JPH0348226U JP H0348226 U JPH0348226 U JP H0348226U JP 10820789 U JP10820789 U JP 10820789U JP 10820789 U JP10820789 U JP 10820789U JP H0348226 U JPH0348226 U JP H0348226U
Authority
JP
Japan
Prior art keywords
guide hole
predetermined number
arm body
semiconductor
mounter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10820789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10820789U priority Critical patent/JPH0348226U/ja
Publication of JPH0348226U publication Critical patent/JPH0348226U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP10820789U 1989-09-13 1989-09-13 Pending JPH0348226U (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10820789U JPH0348226U (enrdf_load_html_response) 1989-09-13 1989-09-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10820789U JPH0348226U (enrdf_load_html_response) 1989-09-13 1989-09-13

Publications (1)

Publication Number Publication Date
JPH0348226U true JPH0348226U (enrdf_load_html_response) 1991-05-08

Family

ID=31656860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10820789U Pending JPH0348226U (enrdf_load_html_response) 1989-09-13 1989-09-13

Country Status (1)

Country Link
JP (1) JPH0348226U (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018101730A (ja) * 2016-12-21 2018-06-28 日亜化学工業株式会社 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018101730A (ja) * 2016-12-21 2018-06-28 日亜化学工業株式会社 半導体装置の製造方法

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