JPH0347562B2 - - Google Patents

Info

Publication number
JPH0347562B2
JPH0347562B2 JP58151389A JP15138983A JPH0347562B2 JP H0347562 B2 JPH0347562 B2 JP H0347562B2 JP 58151389 A JP58151389 A JP 58151389A JP 15138983 A JP15138983 A JP 15138983A JP H0347562 B2 JPH0347562 B2 JP H0347562B2
Authority
JP
Japan
Prior art keywords
diallyl ester
terephthalic acid
ester copolymer
conductive
acid diallyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58151389A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6042803A (ja
Inventor
Wataru Tanaka
Takeshi Kuri
Masanari Oosuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Soda Co Ltd
Original Assignee
Daiso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiso Co Ltd filed Critical Daiso Co Ltd
Priority to JP58151389A priority Critical patent/JPS6042803A/ja
Publication of JPS6042803A publication Critical patent/JPS6042803A/ja
Publication of JPH0347562B2 publication Critical patent/JPH0347562B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Non-Insulated Conductors (AREA)
JP58151389A 1983-08-18 1983-08-18 表面摺動性に優れた電気抵抗体または導電体及びその製造法 Granted JPS6042803A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58151389A JPS6042803A (ja) 1983-08-18 1983-08-18 表面摺動性に優れた電気抵抗体または導電体及びその製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58151389A JPS6042803A (ja) 1983-08-18 1983-08-18 表面摺動性に優れた電気抵抗体または導電体及びその製造法

Publications (2)

Publication Number Publication Date
JPS6042803A JPS6042803A (ja) 1985-03-07
JPH0347562B2 true JPH0347562B2 (cs) 1991-07-19

Family

ID=15517511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58151389A Granted JPS6042803A (ja) 1983-08-18 1983-08-18 表面摺動性に優れた電気抵抗体または導電体及びその製造法

Country Status (1)

Country Link
JP (1) JPS6042803A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123375A (ja) * 2005-10-26 2007-05-17 Matsushita Electric Ind Co Ltd 導電性ペースト組成物並びにそれを用いたプリント配線基板とその製造方法

Also Published As

Publication number Publication date
JPS6042803A (ja) 1985-03-07

Similar Documents

Publication Publication Date Title
JP3814301B2 (ja) ペルフッ素化炭化水素重合体入り接着剤配合物及びその用途
JP4467816B2 (ja) 低誘電正接樹脂組成物、硬化性フィルム、硬化物およびそれを用いた電気部品とその製法
TW201216302A (en) Method for manufacturing piezoresistive material, piezoresistive composition and pressure sensor device
KR100570249B1 (ko) 내열 열전도성 열압착용 실리콘 고무 시트
JP2025010301A (ja) ビスマレイミド系接着剤組成物、硬化物、接着シート及びフレキシブルプリント配線板
CN115135715A (zh) 热固性树脂组合物、树脂片、具有树脂的金属箔、覆金属层压体和印刷线路板
US12173120B2 (en) Random copolymer compound, terminal-modified polymer compound, and resin composition including said compounds
JP2019182989A (ja) 変性ポリフェニレンエーテル樹脂系高分子共重合体化合物、該高分子共重合体化合物を用いて得られる末端変性高分子化合物及びこれらの化合物を含む樹脂組成物。
JPH0347562B2 (cs)
JP2001302736A (ja) 高分子絶縁材料及びその製造方法並びに電子関連基板及び電子部材
TW202248752A (zh) 熱硬化性樹脂組成物、硬化物、樹脂片材、預浸體、覆金屬箔積層板、多層印刷配線板、密封用材料、纖維加強複合材料、接著劑以及半導體裝置
JPS6037104A (ja) 電気抵抗体または導電体の製造法
WO2001000727A1 (fr) Composition conductrice ayant une excellente stabilite de stockage a haute temperature et rouleau conducteur obtenu a partir de cette composition
JP2002322221A (ja) 光硬化系高分子絶縁材料及びその製造方法並びに電子関連基板及び電子部材
JPH0546082B2 (cs)
WO2023176456A1 (ja) 樹脂組成物及び光学フィルム
KR20250039328A (ko) 폴리말레이미드 수지, 수지 조성물, 경화물, 시트, 적층체, 및 프린트 배선판
JPH0260079B2 (cs)
JPH0522363B2 (cs)
JPH01225604A (ja) 導電性インキ用バインダー熱硬化性樹脂組成物及びその用途
WO2019203112A1 (ja) ランダム共重合体化合物、末端変性高分子化合物及びこれらの化合物を含む樹脂組成物
JP2020111630A (ja) ランダム共重合体化合物、末端変性高分子化合物物及びこれらの化合物を含む樹脂組成物
JP7683417B2 (ja) 電子機器用フイルムおよびプリント回路基板
JP2025007716A (ja) 異方性導電フィルム、接続構造体及びその製造方法
JPH02290094A (ja) 配線板の製造法