JPH0346368Y2 - - Google Patents
Info
- Publication number
- JPH0346368Y2 JPH0346368Y2 JP15089983U JP15089983U JPH0346368Y2 JP H0346368 Y2 JPH0346368 Y2 JP H0346368Y2 JP 15089983 U JP15089983 U JP 15089983U JP 15089983 U JP15089983 U JP 15089983U JP H0346368 Y2 JPH0346368 Y2 JP H0346368Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- hydrophobic resin
- agc
- internal
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 230000002209 hydrophobic effect Effects 0.000 claims description 14
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 3
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 2
- 235000011164 potassium chloride Nutrition 0.000 claims description 2
- 239000001103 potassium chloride Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 16
- 238000004090 dissolution Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Description
【考案の詳細な説明】
本考案は、電極電位を測定するための比較電極
やガラス電極に用いられる内部電極の改良技術に
関し、長期間安定な基準電位を保持できる内部電
極の提供を目的としている。[Detailed description of the invention] The present invention relates to an improved technology for internal electrodes used in reference electrodes and glass electrodes for measuring electrode potential, and aims to provide an internal electrode that can maintain a stable reference potential for a long period of time. .
上記目的を達成するために、本考案による内部
電極は、銀線（以下Ag線と称す。）の端部に塩化
カリウム（以下KCと称す。）と塩化銀（以下
AgCと称す。）の溶融物を担持させ、その担持
体の表面を疎水性の樹脂膜で被覆すると共に、該
疎水性樹脂膜にクラツクやピンホール等の内部液
に対する液絡部を設けた点に特徴がある。 In order to achieve the above object, the internal electrode according to the present invention has potassium chloride (hereinafter referred to as KC) and silver chloride (hereinafter referred to as KC) and silver chloride (hereinafter referred to as KC) at the end of a silver wire (hereinafter referred to as Ag wire).
It is called AgC. ) is supported, and the surface of the support is coated with a hydrophobic resin film, and the hydrophobic resin film is characterized by providing a liquid junction for cracks, pinholes, and other internal liquids. .
即ち、従来の本考案に近い技術の内部電極とし
ては、白金材にAgCを担持させて、これを親
水性の樹脂膜で被覆したものがある。 That is, as a conventional internal electrode with a technology similar to the present invention, there is one in which AgC is supported on a platinum material and this is coated with a hydrophilic resin film.
このものは、親水性の樹脂膜によつて、AgC
と内部液（一般にKCが用いられる。）との電
気的接合を可能にする状態で、AgCが
AgC→Ag+＋Ｃ-および高濃度のＣ-が含
まれる場合には、AgC＋Ｃ-→AgC2 -なる
反応で内部液中に溶解させないようにしたもの
で、例えば該内部電極を比較電極に用いる場合に
おいて、この比較電極の被検液に対する液絡部の
目詰りを防止させるようにしたものである。 This product has a hydrophilic resin film that allows AgC
AgC→Ag + +C - and when a high concentration of C - is included, AgC + C - →AgC 2 - in conditions that allow electrical bonding between the internal liquid and the internal liquid (KC is generally used ) . For example, when the internal electrode is used as a reference electrode, it is designed to prevent clogging of the liquid junction of the reference electrode against the test liquid. .
ところが、前記樹脂膜が親水性故に、AgC
の溶解を防止し得るものでは無く、該樹脂膜を設
けない場合に比べて溶解をやや抑制できると言つ
た程度のもので、大巾なる寿命延長を期し得るも
のは無かつたものである。 However, because the resin film is hydrophilic, AgC
It is not possible to prevent the dissolution of the resin film, and it is only that the dissolution can be suppressed slightly compared to the case where the resin film is not provided, and there is nothing that can be expected to significantly extend the service life.
この点にあつて本考案によれば、樹脂膜として
疎水性のものを用いて、これにクラツクやピンホ
ール等の内部液に対する接触面積が著しく小なる
液絡部を設けるものであるから、電気的接合が可
能になる状態でAgCの溶解を極めて大巾に抑
制できるに至り、長寿命化を達成できるようにな
つた。 In this regard, according to the present invention, a hydrophobic resin film is used, and liquid junctions such as cracks and pinholes, which have a significantly small contact area with the internal liquid, are provided in the resin film. It has now become possible to significantly suppress the dissolution of AgC in a state where physical bonding is possible, and it has become possible to achieve longer life.
しかも、疎水性樹脂膜の内部においてAgC
とKCの溶融物をAg線に担持させるものである
から、常に安定な電位が得られるもので、簡単な
改良によつて、長期間安定な基準電位を保持でき
る内部電極を提供するに至つた。 Furthermore, AgC inside the hydrophobic resin film
Since the molten material of KC and KC is supported on the Ag wire, a stable potential can be obtained at all times. Through simple improvements, we have been able to provide an internal electrode that can maintain a stable reference potential for a long period of time. .
以下、本考案の実施例を図面に基いて説明する
と、第１図は比較電極１を示し、下端に液絡部２
を備えたガラス管３の内部に、内部電極４を設け
ると共、KC等の内部液５を注入して成る。 Hereinafter, embodiments of the present invention will be explained based on the drawings. FIG. 1 shows a comparison electrode 1, with a liquid junction 2 at the lower end.
An internal electrode 4 is provided inside a glass tube 3, and an internal liquid 5 such as KC is injected into the interior of the glass tube 3.
前記内部電極４は、第２図に誇張して拡大図示
するように、Ag線６の下端に、KCとAgCの
溶融物を融着等によつて担持させると共に、その
担持体７と前記Ag線６の表面を、フツ素系樹脂
（ゴムを含む）等の疎水性の樹脂膜８で被覆し、
かつ、該疎水性樹脂膜８のうち前記担持体７に対
応する膜部分に、前記内部液５に対する接触面積
を著しく小にする液絡部ａを設けて成る。 As shown in an exaggerated enlarged view in FIG. 2, the internal electrode 4 is formed by supporting a melt of KC and AgC on the lower end of the Ag wire 6 by fusion, etc. The surface of the wire 6 is coated with a hydrophobic resin film 8 such as fluororesin (including rubber),
In addition, a liquid junction a is provided in a portion of the hydrophobic resin film 8 corresponding to the carrier 7 to significantly reduce the area of contact with the internal liquid 5.
前記樹脂膜８の被覆としては、エアスプレーガ
ンによる疎水性樹脂の噴射や、疎水性樹脂液中へ
の浸漬等により内部電極付着後、熱処理をするこ
とによつて行なえ、かつ、その樹脂膜８を担持体
７のみに被覆させるも良いが、Ag線６をも被覆
することによつてAg線６の熱的強度を強化でき、
例えば100℃以上の高温連続下においても断線等
がなくなり、好ましい形態と言える。 The resin film 8 can be coated by spraying a hydrophobic resin with an air spray gun or by immersing the internal electrodes in a hydrophobic resin liquid, followed by heat treatment. It is also possible to coat only the carrier 7, but by also coating the Ag wire 6, the thermal strength of the Ag wire 6 can be strengthened.
For example, even under continuous high temperature conditions of 100°C or higher, there is no disconnection, and this can be said to be a preferable form.
さて、前記疎水性樹脂膜８に液絡部ａを設ける
に、前記担持体７に対する疎水性の樹脂膜８部分
を、煮沸水や煮沸KC溶液中に浸漬させ、必要
に応じて急冷させて、膨張差によつて樹脂膜８に
クラツクを生じせしめ、あるいは、疎水性樹脂膜
８としてこれに予めKC溶液を混入させておい
て、これを上記の如き煮沸下におき、もつて、混
入させたKCを溶解させて樹脂膜８にピンホー
ルやクラツクを生じせしめる等の手段を採用でき
る。 Now, in order to provide the liquid junction part a on the hydrophobic resin film 8, the portion of the hydrophobic resin film 8 relative to the support 7 is immersed in boiled water or a boiled KC solution, and is rapidly cooled if necessary. Cracks may be caused in the resin film 8 due to the difference in expansion, or the KC solution may be mixed in advance to form the hydrophobic resin film 8, and this may be boiled as described above and then mixed. It is possible to adopt a method such as dissolving KC to create pinholes or cracks in the resin film 8.
尚、前記疎水性樹脂膜８がゴム系の場合は、担
持体７が変形してもこれを吸収できる点で有利で
ある。 It should be noted that if the hydrophobic resin film 8 is made of rubber, it is advantageous in that even if the carrier 7 is deformed, it can absorb this deformation.
図面は本考案の実施例を示し、第１図は比較電
極の断面図、第２図は内部電極を誇張して拡大し
た断面図である。
５…内部液、６…銀線（Ag線）、７…担持体
（KC・AgC）、８…疎水性樹脂膜、ａ…液絡
部。
The drawings show an embodiment of the present invention, in which FIG. 1 is a sectional view of a comparison electrode, and FIG. 2 is an exaggerated and enlarged sectional view of an internal electrode. 5... Internal liquid, 6... Silver wire (Ag wire), 7... Support (KC/AgC), 8... Hydrophobic resin film, a... Liquid junction.
Claims (1)
担持させ、その担持体の表面を疎水性の樹脂膜で
被覆すると共に、該疎水性樹脂膜にクラツクやピ
ンホール等の内部液に対する液絡部を設けてある
ことを特徴とする内部電極。 A melt of potassium chloride and silver chloride is supported on the end of the silver wire, and the surface of the support is coated with a hydrophobic resin film. An internal electrode characterized by being provided with a connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15089983U JPS6059149U (en) | 1983-09-28 | 1983-09-28 | internal electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15089983U JPS6059149U (en) | 1983-09-28 | 1983-09-28 | internal electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6059149U JPS6059149U (en) | 1985-04-24 |
| JPH0346368Y2 true JPH0346368Y2 (en) | 1991-09-30 |
Family
ID=30334554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15089983U Granted JPS6059149U (en) | 1983-09-28 | 1983-09-28 | internal electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059149U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2969520B2 (en) * | 1989-02-06 | 1999-11-02 | テルモ株式会社 | Reference electrode |
| JP2012115330A (en) * | 2010-11-29 | 2012-06-21 | Horiba Ltd | Electrode body |
-
1983
- 1983-09-28 JP JP15089983U patent/JPS6059149U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6059149U (en) | 1985-04-24 |
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