JPH0345647U - - Google Patents

Info

Publication number
JPH0345647U
JPH0345647U JP10692989U JP10692989U JPH0345647U JP H0345647 U JPH0345647 U JP H0345647U JP 10692989 U JP10692989 U JP 10692989U JP 10692989 U JP10692989 U JP 10692989U JP H0345647 U JPH0345647 U JP H0345647U
Authority
JP
Japan
Prior art keywords
recessed part
core
circuit board
forming
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10692989U
Other languages
English (en)
Other versions
JPH0810199Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10692989U priority Critical patent/JPH0810199Y2/ja
Priority to US07/475,945 priority patent/US5116440A/en
Publication of JPH0345647U publication Critical patent/JPH0345647U/ja
Application granted granted Critical
Publication of JPH0810199Y2 publication Critical patent/JPH0810199Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Description

【図面の簡単な説明】
第１図は電子部品収納用の凹欠部を有する回路
基板の要部の立体断面図、第２図、第３図はそれ
ぞれ実施例の凹欠部形成用中子を説明する斜視図
である。 Ａ，Ｂ，Ｂ１，Ｂ２……それぞれ回路基板、Ｃ
，Ｃ１，Ｃ２……それぞれプリフレグシート部、
１……ダイパツト、２，…，２……回路パターン
、３……凹欠部、４ａ……シリコンゴムシート、
４ｂ……ＰＥＴ樹脂シート、４……凹欠部形成用
中子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板の上に透孔を形成したＮ（但しＮは１
    以上の整数）枚の回路基板を間にプリプレグを挟
    んで積み重ねて階段状の凹部を形成し、上下より
    加熱・加圧して回路基板間を一体に貼り合わせて
    電子部品収納用の凹欠部を有する回路基板を得る
    製法に用いる凹欠部形成用中子であつて、弾性率
    の異なる層を複数層有し全体の厚みが凹欠部の深
    さより大で外径が凹欠部の径より僅かに小さい寸
    法に形成してなることを特徴とする凹欠部形成用
    中子。
JP10692989U 1989-08-09 1989-09-12 凹欠部形成用中子 Expired - Lifetime JPH0810199Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10692989U JPH0810199Y2 (ja) 1989-09-12 1989-09-12 凹欠部形成用中子
US07/475,945 US5116440A (en) 1989-08-09 1990-02-06 Process for manufacturing multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10692989U JPH0810199Y2 (ja) 1989-09-12 1989-09-12 凹欠部形成用中子

Publications (2)

Publication Number Publication Date
JPH0345647U true JPH0345647U (ja) 1991-04-26
JPH0810199Y2 JPH0810199Y2 (ja) 1996-03-27

Family

ID=31655649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10692989U Expired - Lifetime JPH0810199Y2 (ja) 1989-08-09 1989-09-12 凹欠部形成用中子

Country Status (1)

Country Link
JP (1) JPH0810199Y2 (ja)

Also Published As

Publication number Publication date
JPH0810199Y2 (ja) 1996-03-27

Similar Documents

Publication Publication Date Title
JPH0345647U (ja)
JPH02142540U (ja)
JPS63157906U (ja)
JPH02106841U (ja)
JPH042073U (ja)
JPS6371598U (ja)
JPH0171463U (ja)
JPS646064U (ja)
JPS6363916U (ja)
JPH0262762U (ja)
JPH031027U (ja)
JPH0351871U (ja)
JPH02113315U (ja)
JPH02118987U (ja)
JPH02110376U (ja)
JPH01157543U (ja)
JPS62193758U (ja)
JPH02106808U (ja)
JPH0485822U (ja)
JPS5937758U (ja) 補強基板
JPH0230251U (ja)
JPS61199074U (ja)
JPS6375068U (ja)
JPH03104754U (ja)
JPH02113314U (ja)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term