JPH0345641U - - Google Patents
Info
- Publication number
- JPH0345641U JPH0345641U JP1989106076U JP10607689U JPH0345641U JP H0345641 U JPH0345641 U JP H0345641U JP 1989106076 U JP1989106076 U JP 1989106076U JP 10607689 U JP10607689 U JP 10607689U JP H0345641 U JPH0345641 U JP H0345641U
- Authority
- JP
- Japan
- Prior art keywords
- electrode metal
- metal film
- metal plate
- area
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989106076U JPH0345641U (ko) | 1989-09-08 | 1989-09-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989106076U JPH0345641U (ko) | 1989-09-08 | 1989-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0345641U true JPH0345641U (ko) | 1991-04-26 |
Family
ID=31654823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989106076U Pending JPH0345641U (ko) | 1989-09-08 | 1989-09-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0345641U (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100684496B1 (ko) * | 2006-11-22 | 2007-02-22 | 비엠케이 주식회사 | 튜브 어셈블리 분말 충진장치 |
KR101009098B1 (ko) * | 2008-05-08 | 2011-01-18 | 주식회사 에스디티 | 대용량 정제저장호퍼 리프터 |
JP2012182253A (ja) * | 2011-02-28 | 2012-09-20 | Sanken Electric Co Ltd | 半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6066847A (ja) * | 1983-09-24 | 1985-04-17 | Nippon Denso Co Ltd | 半導体整流装置 |
-
1989
- 1989-09-08 JP JP1989106076U patent/JPH0345641U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6066847A (ja) * | 1983-09-24 | 1985-04-17 | Nippon Denso Co Ltd | 半導体整流装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100684496B1 (ko) * | 2006-11-22 | 2007-02-22 | 비엠케이 주식회사 | 튜브 어셈블리 분말 충진장치 |
KR101009098B1 (ko) * | 2008-05-08 | 2011-01-18 | 주식회사 에스디티 | 대용량 정제저장호퍼 리프터 |
JP2012182253A (ja) * | 2011-02-28 | 2012-09-20 | Sanken Electric Co Ltd | 半導体装置 |